System and method for establishing a junction trace of an assembly

{
  "publication_number": "US11270427B2",
  "country": "US",
  "kind": "B2",
  "title": "System and method for establishing a junction trace of an assembly",
  "abstract": "A system for establishing a junction trace of an assembly includes a surface model creating module, a processing module, and a material inspection module. The assembly includes a first part and a second part assembled with each other. The surface model creating module scans the first part and the second part to separately establish first surface model data and second surface model data. The processing module establishes assembled surface model data according to the first surface model data and the second surface model data, determines a junction region from the assembled surface model data, and determines inspection points mapped on the assembly according to the junction region. The material inspection module inspects materials of the assembly at the inspection points. The processing module establishes a junction trace of the first part and the second part in the assembly according to a material inspection result.",
  "claims": [
    "1. A system for establishing a junction trace of an assembly, wherein the assembly comprises a first part and a second part assembled with each other, and the system comprises: a surface model creating module, scanning the first part and the second part to establish first surface model data of the first part and second surface model data of the second part; a processing module, establishing assembled surface model data according to the first surface model data and the second surface model data, determining a junction region from the assembled surface model data, and determining inspection points mapped on the assembly according to the junction region, wherein the inspection points comprise a first inspection point separated from a configuration point by a first separation distance, a second inspection point separated from the configuration point by a second separation distance, and a third inspection point located between the first inspection point and the second inspection point, and the configuration point is located within the junction region; and a material inspection module, inspecting materials of the assembly at the inspection points, wherein the processing module establishes a junction trace of the first part and the second part in the assembly according to an inspection result of the material inspection module.",
    "2. The system as claimed in claim 1, wherein the material inspection module comprises a nondestructive material inspection device.",
    "3. The system as claimed in claim 2, wherein the material inspection module comprises an X-ray fluorescence spectrometer (XRF), an atomic force microscope (AFM), a conductive atomic force microscope (C-AFM), a cross section polisher (CP), a scanning electron microscope/energy-dispersive X-ray spectroscopy (SEM/EDS), dual-beam focused ion beam/energy-dispersive X-ray spectroscopy (DB FIB/EDS), or a transmission electron microscope/energy-dispersive X-ray spectroscopy (TEM/EDS).",
    "4. The system as claimed in claim 2, wherein the material inspection module further comprises an automation carrier, and the automation carrier carries the nondestructive material inspection device.",
    "5. The system as claimed in claim 4, wherein the automation carrier comprises a multi-axis robot arm.",
    "6. The system as claimed in claim 1, wherein the surface model creating module comprises a multi-depth-of-field image capturing device.",
    "7. The system as claimed in claim 6, wherein the surface model creating module further comprises an automation carrier, and the automation carrier carries the multi-depth-of-field image capturing device.",
    "8. The system as claimed in claim 7, wherein the automation carrier comprises a multi-axis robot ann.",
    "9. The system as claimed in claim 1, further comprising a carrying platform, canying the assembly and positioning the assembly within a working range of the material inspection module or the surface model creating module.",
    "10. The system as claimed in claim 1, wherein the processing module comprises a processor and a storage unit, the storage unit stores the first surface model data and the second surface model data, and the processing module compares and analyzes the first surface model data and the second surface model data to establish the assembled surface model data, determines the junction region from the assembled surface model data, and determines inspection points mapped on the assembly according to the junction region.",
    "11. A method for establishing a junction trace of an assembly, comprising: scanning a first part and a second part of the assembly to establish first surface model data of the first part and second surface model data of the second part; establishing assembled surface model data according to the first surface model data and the second surface model data, determining a junction region from the assembled surface model data, and determining inspection points mapped on the assembly according to the junction region, wherein the inspection points comprise a first inspection point separated from a configuration point by a first separation distance, a second inspection point separated from the configuration point by a second separation distance, and a third inspection point located between the first inspection point and the second inspection point, and the configuration point is located within the junction region; inspecting materials of the assembly at the inspection points; and establishing a junction trace of the first part and the second part in the assembly according to a material inspection result.",
    "12. The method as claimed in claim 11, wherein the method for establishing the assembled surface model data comprises an iterative closest point (ICP) algorithm, a general iterative closest point algorithm, a fractional iterative closest point algorithm, a point feature histogram algorithm, a fast point feature histogram algorithm, or a combination of the foregoing algorithms.",
    "13. The method as claimed in claim 11, further comprising setting an allowable error and comparing materials inspected at the first inspection point and the third inspection point.",
    "14. The method as claimed in claim 13, wherein a distance between the second inspection point and the third inspection point is calculated when the materials inspected at the first inspection point and the third inspection point are identical.",
    "15. The method as claimed in claim 14, wherein a middle point between the second inspection point and the third inspection point is determined as a junction coordinate point of the junction trace when the distance is less than the allowable error.",
    "16. The method as claimed in claim 14, wherein the first separation distance and the second separation distance are reduced when the distance is greater than the allowable error so as to update the first inspection point, the second inspection point, and the third inspection point.",
    "17. The method as claimed in claim 13, wherein a distance between the first inspection point and the third inspection point is calculated when the materials inspected at the first inspection point and the third inspection point are different.",
    "18. The method as claimed in claim 17, wherein a middle point between the first inspection point and the third inspection point is determined as a junction coordinate point of the junction trace when the distance is less than the allowable error.",
    "19. The method as claimed in claim 17, wherein the first separation distance and the second separation distance are reduced when the distance is greater than the allowable error so as to update the first inspection point, the second inspection point, and the third inspection point."
  ],
  "description_excerpt": "Technical Field The disclosure relates to a system and a method for inspecting a junction of an assembly, and more particularly, relates to a system and a method for establishing a junction trace of an assembly. Description of Related Art Along with the development of automation technology, manufacturers have begun to introduce automation equipment into the production of various types of products with an aim to replace manpower, and 3D (dirty, dangerous, and difficult) industry, in particular, is the first industry to make such introduction. Nevertheless, for industries except the metal industry, the processing results of various parts may be easily affected by factors such as processing conditions or special properties of materials (flexible materials, foaming materials, etc.). As a result, sizes of parts may vary considerably, and it is thus difficult to establish an accurate processing trace and introduce automation equipment. Manufacturing of products still depends heavily on manpower at present. Taking the footwear manufacturing industry for example, in the processing of footwear, a large amount of chemicals are used, so the footwear manufacturing industry is categorized as the 3D industry. Nevertheless, as affected by various factors such as material restriction, complex processing conditions (during sewing, the sizes of uppers vary greatly, and a large number of colors and various types of materials are used) and so on, introduction of automation into such industry is not as easy as expected.",
  "cpc": [
    "G06T 7/0004",
    "A41H 3/007",
    "A43D 1/08",
    "A43D 2200/10",
    "B25J 11/00",
    "B25J 18/00",
    "G05B 19/41885",
    "G05B 2219/45243",
    "G06T 17/00",
    "G06T 19/00",
    "G06T 2207/10028",
    "G06T 2207/30108",
    "G06T 2207/30124",
    "G06T 2207/30241",
    "G06T 7/11",
    "G06T 7/149",
    "G06T 7/30",
    "G06T 7/60",
    "Y02P 90/02"
  ],
  "ipc": [
    "A41H 3/00",
    "A43D 1/08",
    "B25J 18/00",
    "G05B 19/418",
    "G06T 7/00",
    "G06T 7/11",
    "G06T 7/149"
  ],
  "assignees": [
    "IND TECH RES INST"
  ],
  "inventors": [
    "HSU BING-CHENG",
    "HUANG CHENG-KAI",
    "CHEN JAN-HAO",
    "YANG CHWEN-YI",
    "LIN YI-YING"
  ],
  "filing_date": "2020-03-05",
  "publication_date": "2022-03-08",
  "grant_date": "2022-03-08",
  "priority_date": "2020-01-06",
  "application_number": "US-202016809576-A",
  "family_id": "76609098",
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}