Patent · US11477352B1 · B1 · US

Accessory device heat dissipation by parent device

(11) Publication number

US11477352B1

(21) Application number

17/226,868

(22) Filing date

2021-04-09

(30) Priority date

2021-04-09

(43) Publication date

2022-10-18

(45) Date of grant

2022-10-18

(51) IPC

F16B 1/00; F16M 13/02; G03B 17/55; G03B 17/56; G06F 1/16; H04N 5/225; H05K 7/20

(52) CPC

H04N Pictorial communication, e.g. television: 23/52, 23/51, 23/54, 23/57, 5/2252, 5/22521, 5/2253, 5/2257
F16B Devices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges; joints or jointing: 2001/0035, 2200/83
F16M Frames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere; stands; supports: 13/02, 2200/08
G03B Apparatus or arrangements for taking photographs or for projecting or viewing them; apparatus or arrangements employing analogous techniques using waves other than optical waves; accessories therefor: 17/55, 17/561, 17/566, 2217/007, 29/00
G06F Electric digital data processing: 1/1605, 1/1607, 1/1637, 1/1686, 1/203, 2200/1613
H05K Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components: 7/2039

(73) Assignee

MICROSOFT TECHNOLOGY LICENSING LLC

(72) Inventors

PALVE LALIT ANIL; SATHE RHISHIKESH A; DELANO ANDREW D

(54) Title

Accessory device heat dissipation by parent device

(57) Abstract

Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.

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Claims (20)

A first electronic device, comprising: a device body housing; a first heat-generating component disposed within the device body housing; a first heat-conducting component disposed within the device body housing and coupled between the first heat-generating component and the device body housing; and a device foot, comprising: a device foot housing coupled to an exterior surface of the device body housing; and a first mating element connected to the device foot housing and adapted to engage with a corresponding second mating element of a second electronic device in a manner that mounts the first electronic device to the second electronic device and brings a planar portion of the device foot housing into contact with a planar mounting surface of the second electronic device; wherein the contact between the planar portion of the device foot housing and the planar mounting surface of the second electronic device completes a thermal circuit that comprises the first heat-generating component, the first heat-conducting component, the device body housing, the device foot housing and the planar mounting surface of the second electronic device and that facilitates the transfer of heat from the first heat-generating component to the second electronic device.
The first electronic device of claim 1, wherein the device body housing, the first heat-conducting component, the device foot housing and the planar mounting surface of the second electronic device are each comprised of one or more of: a metal; an aluminum alloy; or a thermally conductive plastic.
The first electronic device of claim 1, wherein the first heat-conducting component is connected to the first heat-generating component via a first layer of a thermal interface material and to the device body housing via a second layer of the thermal interface material, and wherein the device body housing is connected to the device foot housing via a third layer of the thermal interface material.
The first electronic device of claim 1, wherein the first heat-generating component comprises one of an imaging sensor or a processing component.
The first electronic device of claim 1, wherein the first mating element comprises a plate that is planarly aligned with the planar portion of the device foot housing and comprises a first magnetic material, the second mating element comprises a second magnetic material, and the first magnetic material and the second magnetic material comprise, respectively: a permanent magnet and a ferromagnetic material; a ferromagnetic material and a permanent magnet; or a first permanent magnet and a second permanent magnet.
The first electronic device of claim 5, wherein the device foot further comprises a hinged member that flexibly connects the plate to the device foot housing and that enables the device foot to be rotated away from the second electronic device without disconnecting the first electronic device from the second electronic device.
The first electronic device of claim 5, wherein the first mating element further comprises first and second alignment pins that extend perpendicularly from the plate and the second mating element further comprises first and second holes in the planar mounting surface of the second electronic device that are adapted to accommodate the first and second alignment pins, respectively.
The first electronic device of claim 1, wherein the device foot further comprises a first electrical connector that extends from the planar portion of the device foot and is configured to engage with a second electrical connector located on the planar mounting surface of the second electronic device.
The first electronic device of claim 1, further comprising: a second heat-generating component disposed within the device body housing and connected thereto.
The first electronic device of claim 1, wherein the first electronic device comprises a camera and the second electronic device comprises one of a computer monitor or an interactive white board.
A first electronic device, comprising: a device body housing; a heat-generating component disposed within and connected to the device body housing; and a device foot, comprising: a device foot housing coupled to an exterior surface of the device body housing; a first mating element connected to the device foot housing and adapted to engage with a corresponding second mating element of a second electronic device in a manner that physically couples the first and second electronic devices together and brings a planar portion of the device foot housing into contact with a planar mounting surface of the second electronic device; and a first electrical connector that protrudes from the planar portion of the device foot housing and is adapted to engage with a corresponding second electrical connector that is located on the planar mounting surface of the second electronic device when the first and second electronic devices are coupled together; wherein the contact between the planar portion of the device foot housing and the planar mounting surface of the second electronic device completes a thermal circuit that includes the heat-generating component, the device body housing, the device foot housing and the planar mounting surface of the second electronic device and that facilitates the transfer of heat from the first heat-generating component to the second electronic device.
The first electronic device of claim 11, wherein the device body housing, the device foot housing and the planar mounting surface of the second electronic device are each comprised of one or more of: a metal; an aluminum alloy; or a thermally conductive plastic.
The first electronic device of claim 11, wherein the heat-conducting component is connected to the device body housing via a first layer of a thermal interface material, and wherein the device body housing is connected to the device foot housing via a second layer of the thermal interface material.
The first electronic device of claim 11, wherein the heat-generating component comprises one of an imaging sensor or a processing component.
The first electronic device of claim 11, wherein the first mating element comprises a plate that is planarly aligned with the planar portion of the device foot housing and comprises a first magnetic material, the second mating element comprises a second magnetic material, and the first magnetic material and the second magnetic material comprise, respectively: a permanent magnet and a ferromagnetic material; a ferromagnetic material and a permanent magnet; or a first permanent magnet and a second permanent magnet.
The first electronic device of claim 15, wherein the device foot further comprises a hinged member that flexibly connects the plate to the device foot housing and that enables the device foot to be rotated away from the second electronic device without disconnecting the first electronic device from the second electronic device.
The first electronic device of claim 15, wherein the first mating element further comprises first and second alignment pins that extend perpendicularly from the plate and the second mating element further comprises first and second holes in the planar mounting surface of the second electronic device that are adapted to accommodate the first and second alignment pins, respectively.
The first electronic device of claim 11, wherein the first and second electrical connectors comprise first and second Universal Serial Bus (USB) connectors, respectively.
The first electronic device of claim 11, wherein the first electronic device comprises a camera and the second electronic device comprises one of a computer monitor or an interactive white board.
A system, comprising: a first electronic device, comprising: a device body housing; a heat-generating component disposed within and connected to the device body housing; and a device foot comprising a device foot housing coupled to an exterior surface of the device body housing, a first mating element connected to the device foot housing, and a first electrical connector that protrudes from a planar portion of the device foot housing; and a second electronic device, comprising: a planar mounting surface; a second mating element adapted to engage with the first mating element in a manner that mounts the first electronic device to the second electronic device and brings the planar portion of the device foot housing into contact with the planar mounting surface; and a second electrical connector located on the planar mounting surface and adapted to engage with the first electrical connector when the first electronic device is mounted to the second electronic device; wherein the contact between the planar portion of the device foot housing and the planar mounting surface completes a thermal circuit that includes the heat-generating component, the device body housing, the device foot housing and the planar mounting surface and that facilitates the transfer of heat from the heat-generating component to the second electronic device.

Description

The capabilities of computing and other electronic devices often may be augmented by the addition of accessory devices. The capabilities of such devices have been increasing due to the ubiquity of inexpensive yet powerful processing and sensing devices. However, processing and sensing capabilities can present cooling challenges for the accessory devices.

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Electronic devices are described herein that enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. In one aspect, an electronic device includes: a device body housing that is coupled to and houses a heat-generating component, a device foot that includes a device foot housing coupled to an exterior surface of the device body housing, a first mating element connected to the device foot housing, and a first electrical connector that protrudes from a planar portion of the device foot housing.

Citations (15)

CN202758163U
CN203037982U
CN203606775U
CN204442508U
EP3163864A1
TWM597877U
US2012182527A1
US2012257646A1
US2015049243A1
US2018259832A1
US2019158709A1
US2020059583A1
US2020064882A1
US5991468A
WO2017175949A1

Record as JSON

{
  "publication_number": "US11477352B1",
  "country": "US",
  "kind": "B1",
  "title": "Accessory device heat dissipation by parent device",
  "abstract": "Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.",
  "claims": [
    "1. A first electronic device, comprising: a device body housing; a first heat-generating component disposed within the device body housing; a first heat-conducting component disposed within the device body housing and coupled between the first heat-generating component and the device body housing; and a device foot, comprising: a device foot housing coupled to an exterior surface of the device body housing; and a first mating element connected to the device foot housing and adapted to engage with a corresponding second mating element of a second electronic device in a manner that mounts the first electronic device to the second electronic device and brings a planar portion of the device foot housing into contact with a planar mounting surface of the second electronic device; wherein the contact between the planar portion of the device foot housing and the planar mounting surface of the second electronic device completes a thermal circuit that comprises the first heat-generating component, the first heat-conducting component, the device body housing, the device foot housing and the planar mounting surface of the second electronic device and that facilitates the transfer of heat from the first heat-generating component to the second electronic device.",
    "2. The first electronic device of claim 1, wherein the device body housing, the first heat-conducting component, the device foot housing and the planar mounting surface of the second electronic device are each comprised of one or more of: a metal; an aluminum alloy; or a thermally conductive plastic.",
    "3. The first electronic device of claim 1, wherein the first heat-conducting component is connected to the first heat-generating component via a first layer of a thermal interface material and to the device body housing via a second layer of the thermal interface material, and wherein the device body housing is connected to the device foot housing via a third layer of the thermal interface material.",
    "4. The first electronic device of claim 1, wherein the first heat-generating component comprises one of an imaging sensor or a processing component.",
    "5. The first electronic device of claim 1, wherein the first mating element comprises a plate that is planarly aligned with the planar portion of the device foot housing and comprises a first magnetic material, the second mating element comprises a second magnetic material, and the first magnetic material and the second magnetic material comprise, respectively: a permanent magnet and a ferromagnetic material; a ferromagnetic material and a permanent magnet; or a first permanent magnet and a second permanent magnet.",
    "6. The first electronic device of claim 5, wherein the device foot further comprises a hinged member that flexibly connects the plate to the device foot housing and that enables the device foot to be rotated away from the second electronic device without disconnecting the first electronic device from the second electronic device.",
    "7. The first electronic device of claim 5, wherein the first mating element further comprises first and second alignment pins that extend perpendicularly from the plate and the second mating element further comprises first and second holes in the planar mounting surface of the second electronic device that are adapted to accommodate the first and second alignment pins, respectively.",
    "8. The first electronic device of claim 1, wherein the device foot further comprises a first electrical connector that extends from the planar portion of the device foot and is configured to engage with a second electrical connector located on the planar mounting surface of the second electronic device.",
    "9. The first electronic device of claim 1, further comprising: a second heat-generating component disposed within the device body housing and connected thereto.",
    "10. The first electronic device of claim 1, wherein the first electronic device comprises a camera and the second electronic device comprises one of a computer monitor or an interactive white board.",
    "11. A first electronic device, comprising: a device body housing; a heat-generating component disposed within and connected to the device body housing; and a device foot, comprising: a device foot housing coupled to an exterior surface of the device body housing; a first mating element connected to the device foot housing and adapted to engage with a corresponding second mating element of a second electronic device in a manner that physically couples the first and second electronic devices together and brings a planar portion of the device foot housing into contact with a planar mounting surface of the second electronic device; and a first electrical connector that protrudes from the planar portion of the device foot housing and is adapted to engage with a corresponding second electrical connector that is located on the planar mounting surface of the second electronic device when the first and second electronic devices are coupled together; wherein the contact between the planar portion of the device foot housing and the planar mounting surface of the second electronic device completes a thermal circuit that includes the heat-generating component, the device body housing, the device foot housing and the planar mounting surface of the second electronic device and that facilitates the transfer of heat from the first heat-generating component to the second electronic device.",
    "12. The first electronic device of claim 11, wherein the device body housing, the device foot housing and the planar mounting surface of the second electronic device are each comprised of one or more of: a metal; an aluminum alloy; or a thermally conductive plastic.",
    "13. The first electronic device of claim 11, wherein the heat-conducting component is connected to the device body housing via a first layer of a thermal interface material, and wherein the device body housing is connected to the device foot housing via a second layer of the thermal interface material.",
    "14. The first electronic device of claim 11, wherein the heat-generating component comprises one of an imaging sensor or a processing component.",
    "15. The first electronic device of claim 11, wherein the first mating element comprises a plate that is planarly aligned with the planar portion of the device foot housing and comprises a first magnetic material, the second mating element comprises a second magnetic material, and the first magnetic material and the second magnetic material comprise, respectively: a permanent magnet and a ferromagnetic material; a ferromagnetic material and a permanent magnet; or a first permanent magnet and a second permanent magnet.",
    "16. The first electronic device of claim 15, wherein the device foot further comprises a hinged member that flexibly connects the plate to the device foot housing and that enables the device foot to be rotated away from the second electronic device without disconnecting the first electronic device from the second electronic device.",
    "17. The first electronic device of claim 15, wherein the first mating element further comprises first and second alignment pins that extend perpendicularly from the plate and the second mating element further comprises first and second holes in the planar mounting surface of the second electronic device that are adapted to accommodate the first and second alignment pins, respectively.",
    "18. The first electronic device of claim 11, wherein the first and second electrical connectors comprise first and second Universal Serial Bus (USB) connectors, respectively.",
    "19. The first electronic device of claim 11, wherein the first electronic device comprises a camera and the second electronic device comprises one of a computer monitor or an interactive white board.",
    "20. A system, comprising: a first electronic device, comprising: a device body housing; a heat-generating component disposed within and connected to the device body housing; and a device foot comprising a device foot housing coupled to an exterior surface of the device body housing, a first mating element connected to the device foot housing, and a first electrical connector that protrudes from a planar portion of the device foot housing; and a second electronic device, comprising: a planar mounting surface; a second mating element adapted to engage with the first mating element in a manner that mounts the first electronic device to the second electronic device and brings the planar portion of the device foot housing into contact with the planar mounting surface; and a second electrical connector located on the planar mounting surface and adapted to engage with the first electrical connector when the first electronic device is mounted to the second electronic device; wherein the contact between the planar portion of the device foot housing and the planar mounting surface completes a thermal circuit that includes the heat-generating component, the device body housing, the device foot housing and the planar mounting surface and that facilitates the transfer of heat from the heat-generating component to the second electronic device."
  ],
  "description_excerpt": "The capabilities of computing and other electronic devices often may be augmented by the addition of accessory devices. The capabilities of such devices have been increasing due to the ubiquity of inexpensive yet powerful processing and sensing devices. However, processing and sensing capabilities can present cooling challenges for the accessory devices.\n\nThis Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Electronic devices are described herein that enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. In one aspect, an electronic device includes: a device body housing that is coupled to and houses a heat-generating component, a device foot that includes a device foot housing coupled to an exterior surface of the device body housing, a first mating element connected to the device foot housing, and a first electrical connector that protrudes from a planar portion of the device foot housing.",
  "cpc": [
    "H04N 23/52",
    "F16B 2001/0035",
    "F16B 2200/83",
    "F16M 13/02",
    "F16M 2200/08",
    "G03B 17/55",
    "G03B 17/561",
    "G03B 17/566",
    "G03B 2217/007",
    "G03B 29/00",
    "G06F 1/1605",
    "G06F 1/1607",
    "G06F 1/1637",
    "G06F 1/1686",
    "G06F 1/203",
    "G06F 2200/1613",
    "H04N 23/51",
    "H04N 23/54",
    "H04N 23/57",
    "H04N 5/2252",
    "H04N 5/22521",
    "H04N 5/2253",
    "H04N 5/2257",
    "H05K 7/2039"
  ],
  "ipc": [
    "F16B 1/00",
    "F16M 13/02",
    "G03B 17/55",
    "G03B 17/56",
    "G06F 1/16",
    "H04N 5/225",
    "H05K 7/20"
  ],
  "assignees": [
    "MICROSOFT TECHNOLOGY LICENSING LLC"
  ],
  "inventors": [
    "PALVE LALIT ANIL",
    "SATHE RHISHIKESH A",
    "DELANO ANDREW D"
  ],
  "filing_date": "2021-04-09",
  "publication_date": "2022-10-18",
  "grant_date": "2022-10-18",
  "priority_date": "2021-04-09",
  "application_number": "US-202117226868-A",
  "family_id": "81307828",
  "citations": [
    "CN202758163U",
    "CN203037982U",
    "CN203606775U",
    "CN204442508U",
    "EP3163864A1",
    "TWM597877U",
    "US2012182527A1",
    "US2012257646A1",
    "US2015049243A1",
    "US2018259832A1",
    "US2019158709A1",
    "US2020059583A1",
    "US2020064882A1",
    "US5991468A",
    "WO2017175949A1"
  ]
}

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