Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning

{
  "publication_number": "US6695571B1",
  "country": "US",
  "kind": "B1",
  "title": "Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning",
  "abstract": "A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically oriented, removable, tubular magazine disposed above a controllably driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.",
  "claims": [
    "1. A method for dispensing semiconductor devices from a magazine, comprising: forming a substantially vertical stack of a plurality of semiconductor devices within a magazine having a mouth at an upper end thereof, with an uppermost semiconductor device disposed at a level adjacent said mouth; sensing a number of semiconductor devices in said magazine comprising said plurality of semiconductor devices; removing said uppermost semiconductor device from said mouth; elevating at least one additional semiconductor device in said stack to said level; and removing said at least one additional semiconductor device from said mouth.",
    "2. A method for receiving semiconductor devices within a magazine, comprising: providing a magazine oriented along a substantially vertical axis and having a mouth at an upper end thereof; disposing a first semiconductor device over said mouth; supporting said first semiconductor device from below; moving said first semiconductor device downwardly within said magazine a distance substantially equal to a thickness of said first semiconductor device parallel to said substantially vertical axis of said magazine; disposing a second semiconductor device on said first semiconductor device; and sensing a number of semiconductor devices in said magazine.",
    "3. The method of claim 2, further including selecting a maximum number of semiconductor devices to be received within said magazine, and sensing when said magazine has received said maximum number.",
    "4. The method of claim 2, further comprising: moving said first semiconductor device and said second semiconductor device downwardly within said magazine a distance substantially equal to a thickness of said second semiconductor device parallel to said substantially vertical axis of said magazine; and disposing a third semiconductor device on said second semiconductor device.",
    "5. A method for receiving semiconductor devices within a magazine, comprising: providing a magazine oriented along a substantially vertical axis and having a mouth at an upper end thereof; disposing a first semiconductor device over said mouth; supporting said first semiconductor device from below; moving said first semiconductor device downwardly within said magazine a distance substantially equal to a thickness of said first semiconductor device parallel to said substantially vertical axis of said magazine; disposing a second semiconductor device on said first semiconductor device; and indicating substantially a number of semiconductor devices within said magazine.",
    "6. A method for dispensing semiconductor devices from a magazine, comprising: selecting a maximum number of semiconductor devices to comprise a substantially vertical stack of semiconductor devices within a magazine having a mouth at an upper end thereof, with an uppermost device disposed at a level adjacent said mouth when said maximum number is reached; disposing semiconductor devices in said magazine to form said stack of semiconductor devices; sensing a number of semiconductor devices in said stack of semiconductor devices to determine when said stack includes said maximum number of semiconductor devices; removing said uppermost semiconductor device from said mouth; elevating at least one additional semiconductor device in said stack to said level; and removing said at least one additional semiconductor device from said mouth.",
    "7. The method of claim 6, further comprising sensing a number of semiconductor devices in said magazine when said stack comprises less than said maximum number of semiconductor devices.",
    "8. A method for dispensing semiconductor devices from a magazine, comprising: forming a substantially vertical stack of a plurality of semiconductor devices within a magazine having a mouth at an upper end thereof, with an uppermost semiconductor device disposed at a level adjacent said mouth; removing said uppermost semiconductor device from said mouth; elevating at least one additional semiconductor device in said stack to said level; removing said at least one additional semiconductor device from said mouth; and sensing a number of semiconductor devices in said magazine to determine when all semiconductor devices of said plurality of semiconductor devices have been removed from said magazine.",
    "9. A method for dispensing semiconductor devices from a magazine, comprising: forming a substantially vertical stack of a plurality of semiconductor devices within a magazine having a mouth at an upper end thereof, with an uppermost semiconductor device disposed at a level adjacent said mouth; indicating a first number of semiconductor devices within said magazine; removing said uppermost semiconductor device from said mouth; elevating at least one additional semiconductor device in said stack to said level; and indicating a second number of semiconductor devices within said magazine.",
    "10. The method of claim 9, further comprising removing said at least one additional semiconductor device from said mouth.",
    "11. A method for dispensing semiconductor devices from a magazine, comprising: forming a substantially vertical stack of a plurality of semiconductor devices within a magazine having a mouth at an upper end thereof, with an uppermost semiconductor device disposed at a level adjacent said mouth; sensing a number of semiconductor devices comprising said plurality of semiconductor devices within said magazine; removing said uppermost semiconductor device from said mouth; and sensing a number of semiconductor devices within said magazine after said removing said uppermost semiconductor device.",
    "12. The method of claim 11, further comprising: elevating at least one additional semiconductor device in said stack to said level; removing said at least one additional semiconductor device from said mouth; and sensing a number of semiconductor devices within said magazine after said removing said at least one additional device."
  ],
  "cpc": [
    "G01R 31/2893",
    "B07C 5/344",
    "Y10S 414/105",
    "Y10S 414/115"
  ],
  "assignees": [
    "MICRON TECHNOLOGY INC"
  ],
  "filing_date": "1999-12-17",
  "publication_date": "2004-02-24",
  "grant_date": "2004-02-24",
  "priority_date": "1998-01-16",
  "application_number": "US-46645599-A",
  "family_id": "21730463",
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}