Mechanically embedded heating element

{
  "publication_number": "US9618973B2",
  "country": "US",
  "kind": "B2",
  "title": "Mechanically embedded heating element",
  "abstract": "Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.",
  "claims": [
    "1. An apparatus comprising: a heating element thermally coupled to an adhesive, wherein the adhesive is to bond a first portion of a computing device and a second portion of the computing device, wherein the heating element is capable to be heated in response to application of power, wherein the heated heating element is to cause release of a bond by the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device, wherein the heating element is to be accessible through an opening, wherein the opening is an existing port of the computing device.",
    "2. The apparatus of claim 1, wherein the application of power is to be provided through one or more of: application of electrical voltage, application of electric current, or application of electromagnetic energy.",
    "3. The apparatus of claim 1, wherein the heating element is to be further accessible through a latch.",
    "4. The apparatus of claim 1, wherein the existing port is selected from a group comprising: a USB (Universal Serial Bus) port, an audio port, a SIM (Subscriber Identity Module) port, or an HDMI (High Definition Multimedia Interface) port.",
    "5. The apparatus of claim 1, wherein the heating element is to be constructed of material selected from a group comprising one or more of: Nickel Chromium alloy, Copper Nickel alloy, Iron-Chromium-Aluminum alloy, and/or combinations thereof.",
    "6. The apparatus of claim 1, wherein the heating element is to comprise a single strand cable or a multi-strand cable.",
    "7. The apparatus of claim 6, wherein the multi-strand cable is to be constructed with a plurality of cable material.",
    "8. The apparatus of claim 1, wherein the heating element is capable of sustaining a sufficient amount of heat or temperature for a sufficient duration to release the bond by the adhesive.",
    "9. The apparatus of claim 1, wherein the first portion of the computing device is to comprise a display device or a display device cover glass.",
    "10. The apparatus of claim 9, wherein the display device is to comprise a flat panel display.",
    "11. The apparatus of claim 1, wherein the second portion of the computing device is to comprise a device chassis of the computing device or an outer cover of the computing device.",
    "12. The apparatus of claim 1, wherein the computing device is to comprise a mobile computing device.",
    "13. The apparatus of claim 12, wherein the mobile computing device is to comprise one or more of: a System On Chip (SOC) device; a processor, having one or more processor cores; a flat panel display device, and memory.",
    "14. The apparatus of claim 13, wherein the mobile computing device is to comprise one of: a smartphone, tablet, UMPC (Ultra-Mobile Personal Computer), laptop computer, Ultrabook™ computing device, and a wearable device.",
    "15. The apparatus of claim 14, wherein the wearable device is to comprise one of a smart watch, smart glasses, or a smart bracelet.",
    "16. A computing system comprising: a processor having one or more processor cores; a flat panel display device coupled to the processor; a heating element thermally coupled to an adhesive, wherein the adhesive is to bond a cover glass of the flat panel display device to an outer cover, wherein the heating element is capable to be heated in response to application of power, wherein the heated heating element is to cause release of a bond by the adhesive to allow for physical separation of the cover glass and outer cover, wherein the heating element is to be accessible through an opening, wherein the opening is an existing port of the computing device.",
    "17. The system of claim 16, wherein the application of power is to be provided through one or more of: application of electrical voltage, application of electric current, or application of electromagnetic energy.",
    "18. The system of claim 16, wherein the heating element is to be further accessible through a latch.",
    "19. The system of claim 16, wherein the existing port is selected from a group comprising: a USB (Universal Serial Bus) port, an audio port, a SIM (Subscriber Identity Module) port, or an HDMI (High Definition Multimedia Interface) port.",
    "20. The system of claim 16, wherein the heating element is to be constructed of material selected from a group comprising one or more of: Nickel Chromium alloy, Copper Nickel alloy, Iron-Chromium-Aluminum alloy, and/or combinations thereof.",
    "21. The system of claim 16, wherein the heating element is to comprise a single strand cable or a multi-strand cable.",
    "22. The system of claim 16, wherein the heating element is capable of sustaining a sufficient amount of heat or temperature for a sufficient duration to release the bond by the adhesive.",
    "23. The system of claim 16, further comprising memory to be accessible by the processor, wherein the flat panel display device is to display one or more images corresponding to at least some data stored in the memory."
  ],
  "description_excerpt": "The present disclosure generally relates to the field of electronics. More particularly, an embodiment relates to provision and/or utilization of a mechanically embedded heating element.\n\nMobile computing devices are quickly becoming commonplace, e.g., due to their increased battery life as well as improved computing capabilities. One current trend in tablet (or smartphone) design is to permanently bond the display assembly to the chassis with glue. This may minimize the use of fasteners, holes, and/or screws, and enhance the overall system aesthetic. Such design solutions can, however, limit the upgrade and/or serviceability of mobile computing devices.\n\nApplication of external heat, e.g., together with some special tools, may be used to pry open such devices. However, application of external heat and/or special tools may require an operator with significant prior knowledge about tearing down such devices, e.g., to ensure no brakeage or damage to the device during the tear down.\n\nThe detailed description is provided with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items.\n\nFIG. 1 illustrates a top view of a tablet device according to an embodiment.\n\nFIGS. 2A and 2B illustrated cross-sectional views of mechanical structures, according to some embodiments.\n\nFIG. 3 illustrates a mechanical part with thermal cable embedded in a sample component, according to an embodiment.",
  "cpc": [
    "G06F 1/1637",
    "B32B 2250/44",
    "B32B 2307/75",
    "B32B 2457/00",
    "B32B 2457/20",
    "B32B 2519/00",
    "B32B 2605/08",
    "B32B 3/08",
    "B32B 3/263",
    "B32B 7/06",
    "B32B 7/12",
    "G06F 1/1601",
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    "H04M 1/0249",
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    "H05B 3/0014",
    "H05B 3/86"
  ],
  "ipc": [
    "G06F 1/16",
    "H05B 3/00",
    "H05B 3/86",
    "B32B 7/00",
    "B32B 7/06",
    "B32B 7/12"
  ],
  "assignees": [
    "Intel Corp"
  ],
  "inventors": [
    "Remi Bergmann",
    "Erkki Nokkonen",
    "Juha Paavola",
    "Hannu Luoma",
    "Kari Vallius"
  ],
  "filing_date": "2015-06-26",
  "publication_date": "2017-04-11",
  "grant_date": "2017-04-11",
  "priority_date": "2015-06-26",
  "application_number": "US-201514752695-A",
  "family_id": "57585645",
  "cited_by_count": 7,
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}