Patents full text · MLC-0201
CPC subclass F28C
Heat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media come into direct contact without chemical interaction
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US2007241468A1 | Dew point cooling tower, adhesive bonded heat exchanger, and other heat transfer apparatus | 2007-10-18 | KAMMERZELL LARRY L |
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