Substrate for wallboard joint tape and process for making same

{
  "publication_number": "US10106932B2",
  "country": "US",
  "kind": "B2",
  "title": "Substrate for wallboard joint tape and process for making same",
  "abstract": "A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb f /inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lb f /inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.",
  "claims": [
    "1. A method of making a multi-ply paper substrate, comprising using an air-laid papermaking machine, forming at least two layers, contacting one or both of the layers with an adhesive, and contacting the layers with one another, to form a two-layered web; and compressing the two-layered web, to make the paper substrate, the multi-ply paper comprising at least three adjoining plies, wherein at least two plies are bonded to one another by an adhesive therebetween, the adhesive being selected from the group consisting of starch, cooked starch, and adhesive starch; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lb f /inch width as measured by TAPPI method 494; a CD tensile of 10-300 lb f /inch width as measured by TAPPI method 494; and wherein at least one of said plies has an internal bond higher than that of the other of said plies, the adhesive, or both the adhesive and the other said plies.",
    "2. The method of claim 1, wherein at least one side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg.",
    "3. The method of claim 1, wherein a wall side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg.",
    "4. The method of claim 1, wherein a work side of the multi-ply paper substrate has a Taber abrasion of 50-200 mg.",
    "5. The method of claim 1, wherein the multi-ply paper substrate has a wet tensile strength of 5-60 lb f /inch width.",
    "6. The method of claim 1, wherein the multi-ply paper substrate has a caliper of 0.005-0.011 inch.",
    "7. The method of claim 1, wherein the multi-ply paper substrate comprises 3 to 11 plies.",
    "8. The method of claim 1, wherein the multi-ply paper substrate comprises 3 to 7 plies.",
    "9. The method of claim 1, wherein the multi-ply paper substrate comprises 3 to 5 plies.",
    "10. The method of claim 1, wherein the multi-ply paper substrate comprises a maximum of three plies.",
    "11. The method of claim 1, wherein at least one ply comprises cellulose fibers.",
    "12. The method of claim 1, wherein at least one ply comprises fibers, of which a majority are cellulose fibers.",
    "13. The method of claim 1, wherein at least one ply comprises fibers, of which at least a majority are hardwood fibers.",
    "14. The method of claim 1, wherein at least one ply comprises fibers, of which at least a majority are softwood fibers.",
    "15. The method of claim 1, wherein a single ply comprises an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "16. The method of claim 1, wherein the adhesive comprises an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "17. The method of claim 1, wherein the adhesive, a single ply, or both comprise an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "18. The method of claim 1, wherein the adhesive comprises an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "19. The method of claim 1, wherein one or more plies comprise an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "20. The method of claim 1, wherein the adhesive, a single ply, or both comprise an internal bond of greater than 180 milli-ft.-lb/sq. in. as measured by TAPPI method 541.",
    "21. The method of claim 1, further comprising contacting one or both of the layers, the web, or both one or more of the layers and the web, with a binder.",
    "22. The method of claim 21, wherein the contacting comprises applying the binder in solid form, powder form, liquid form, melt form, or a combination thereof.",
    "23. The method of claim 1, wherein contacting one or both layers with the adhesive comprises applying the adhesive in solid form, powder form, liquid form, melt form, or combination thereof.",
    "24. The method of claim 1, further comprising sanding or abrading one or more outer surface of the paper substrate.",
    "25. The method of claim 1, further comprising contacting a wallboard surface with the paper substrate.",
    "26. The method of claim 1, further comprising heating one or both of the layers, the web, the substrate, or any combination thereof."
  ],
  "description_excerpt": "The invention relates to a substrate for wallboard joint tape, products made thereby, and processes for making and using.\n\nVarious embodiments are described in conjunction with the accompanying figures, which are not intended to be limiting unless otherwise specified.\n\nFIG. 1 shows a cross-sectional view of a conventional single-ply substrate for wallboard joint tape.\n\nFIG. 2 shows a cross-sectional view of one example of a multi-ply paper substrate.\n\nFIG. 3 shows a cross-sectional view of another example of a multi-ply paper substrate. In the embodiment shown, the drawing elements 1-5 correspond to description items 1-5.\n\nFIG. 4 shows a cross-sectional view of one example of a multi-ply paper substrate. In the embodiment shown, the drawing elements 1-4 correspond to description items 1-4.\n\nFIG. 5 shows a cross-sectional view of one example of a multi-ply paper substrate in which the adjoining plies are separated for clarity.\n\nFIG. 6 shows a diagram of one embodiment of an air-laid papermaking machine.\n\nFIG. 7 shows a diagram of one embodiment of an air-laid headbox detail.\n\nOne embodiment of the subject matter claimed herein provides a product suitable for next-generation wallboard joint tape and process for making same. One advantage of the subject matter claimed herein is that the internal strength (e.g., in the z-direction) of the wallboard joint tape is decoupled from in-plane strength (e.g., the machine direction (MD) and cross-machine (CD) directions). Another advantage of the subject matter claimed herein is that the product has a low yet controllable internal strength and a high in-plane tensile strength.",
  "cpc": [
    "D21H 27/38",
    "B29C 65/48",
    "B32B 29/005",
    "B32B 7/02",
    "D21H 11/00",
    "D21H 25/04",
    "D21H 27/20",
    "D21H 27/32",
    "E04F 13/042",
    "Y10T 156/10",
    "Y10T 428/24942",
    "Y10T 428/24983"
  ],
  "ipc": [
    "D21H 11/00",
    "D21H 25/04",
    "D21H 27/32",
    "D21H 27/38",
    "B29C 65/00",
    "B32B 29/00",
    "E04F 13/04"
  ],
  "assignees": [
    "International Paper Co"
  ],
  "inventors": [
    "Dennis W. Anderson",
    "James E. Sealey"
  ],
  "filing_date": "2015-04-08",
  "publication_date": "2018-10-23",
  "grant_date": "2018-10-23",
  "priority_date": "2011-07-20",
  "application_number": "US-201514681755-A",
  "family_id": "46682900",
  "cited_by_count": 800,
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