MLchartDataset catalogue

Patent · US10197617B2 · B2 · US

Probe card loading apparatus and probe card managing system including the same

(11) Publication number
US10197617B2
(21) Application number
14/955,432
(22) Filing date
2015-12-01
(30) Priority date
2014-12-24
(43) Publication date
2019-02-05
(45) Date of grant
2019-02-05
(51) IPC
B65G 47/90; G01R 1/04; G01R 31/26; H10P 72/30; G01R 31/28
(52) CPC
  • G01R Measuring electric variables; measuring magnetic variables: 31/2601, 31/2889, 31/2893
  • H10P Generic processes or apparatus for the manufacture or treatment of devices covered by class H10: 72/3216
(73) Assignee
Samsung Electronics Co Ltd
(72) Inventors
Youngin Kim; Jongsam KIM; Byung-Soo PARK; Sookil PARK; Byungkook Yoo; Younghyen LEE; Seong Sil JEONG; Wooseong CHOI
(54) Title
Probe card loading apparatus and probe card managing system including the same
(57) Abstract

A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.

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Claims (15)

  1. A loading apparatus comprising: a package jig configured to fix to a package, the package jig including, a case configured to surround an edge of the package and having first alignment holes adjacent to the edge of the package; and a handle configured to connect to the case and positioned on the package; a transfer unit including a hand for holding the package jig and configured to transfer the package; and a load port on which the package transferred by the transfer unit is loaded, the load port and the hand comprising, first alignment pins and first alignment sockets for aligning the package to the load port.
  2. The loading apparatus of claim 1, wherein the load port further comprises: second alignment pins between the first alignment pins and extending into the first alignment holes.
  3. The loading apparatus of claim 2, wherein the first alignment pins are longer in length than the second alignment pins.
  4. The loading apparatus of claim 2, wherein the first alignment pins and the second alignment pins are aligned in the same direction.
  5. The loading apparatus of claim 2, wherein a height where the second alignment pins are positioned is lower than a height where the first alignment pins are positioned.
  6. The loading apparatus of claim 2, wherein the hand further comprises: clamps between the first alignment sockets and configured to fix the handle.
  7. The loading apparatus of claim 6, wherein the handle has second alignment holes, and wherein the hand further comprises: third alignment pins between the clamps and provided in the second alignment holes.
  8. The loading apparatus of claim 7, wherein the third alignment pins are shorter in length than the clamps and the first alignment sockets.
  9. The loading apparatus of claim 6, wherein the first alignment sockets are longer in length than the clamps.
  10. The loading apparatus of claim 1, wherein the load port further comprises reflection plates at the outside of the first alignment pins, and wherein the hand further comprises: location sensors at the outside of the first alignment sockets and aligned to the reflection plates.
  11. A probe card managing system comprising: a stocker configured to keep a probe card; a tester configured to test a substrate connected with the probe card; and a card loading apparatus configured to transfer the probe card to the stocker and to load the probe card on the substrate, the card loading apparatus comprising: a probe card jig configured to fix to a probe card, the probe card jig including, a case configured to surround an edge of the probe card and having first alignment holes adjacent to the edge of the probe card, and a handle configured to connect to the case and positioned on the probe card; a transfer unit including a hand configured to hold the probe card jig and configured to transfer the probe card; and a load port on which the probe card transferred by the transfer unit is loaded, the load port and the hand comprising: first alignment pins and first alignment sockets configured to align the probe card to the load port.
  12. The probe card managing system of claim 11, further comprising: a carrier transfer apparatus configured to transfer at least one carrier on which the probe card is loaded, and wherein the carrier comprises: a first housing; at least one first rack in a housing and having a hole opened in an entrance direction of the housing; and support blocks on the first rack along an edge of the hole and configured to support the probe card.
  13. The probe card managing system of claim 12, wherein the load port further comprises guide pins adjacent to the support blocks and provided in the first alignment holes.
  14. The probe card managing system of claim 12, wherein the stocker comprises: a plurality of second racks configured to receive the probe card; a transfer port configured to transfer the probe card provided on the second racks to the card loading apparatus; and a carrier opener configured to open the carrier to provide the probe card to the second racks.
  15. The probe card managing system of claim 12, wherein the carrier transfer apparatus comprises: a first carrier transfer apparatus configured to transfer the carrier manually; and a second carrier transfer apparatus configured to transfer the carrier automatically, and further comprising: jeep towers between the first and second carrier transfer apparatuses and configured to elevate the carrier.

Description

A semiconductor device may be fabricated using a plurality of unit processes. Among the unit processes, a test process is a process for determining the reliability of the semiconductor device. A tester outputs or receives an electric signal to or from the semiconductor device using a probe card. The probe card may be connected with a semiconductor device at a wafer level. In general, managing and loading of the probe card may be performed manually by an operator.

In at least one example embodiment of the inventive concepts, a probe card loading apparatus capable of aligning a probe card to a load port is provided.

In some example embodiments of the inventive concepts a probe card loading apparatus capable of automatizing logistics movement of a probe card and a probe card managing system including the same is provided.

At least one example embodiment provides a loading apparatus which includes a package jig, a transfer unit, and a load port. The package jig may be fixed to a package. The transfer unit may include a hand for holding the package jig and transfers the package. The package transferred by the transfer unit may be loaded on the load port. The load port and the hand may include first alignment pins and first alignment sockets for aligning the package to the load port.

At least one example embodiment provides a probe card managing system which includes a stocker, a tester, and a card loading apparatus. The stocker may keep a probe card, and the tester may test a substrate connected with the probe card.

Citations (22)

  • US5375710A
  • US20020037657A1
  • JP2004170267A
  • US7385386B2
  • US20050170689A1
  • KR100617273B1
  • US20070126441A1
  • US7887277B2
  • US8040147B2
  • KR100833285B1
  • US8490802B2
  • JP5035415B2
  • KR101019534B1
  • KR101019535B1
  • US8267633B2
  • KR101279318B1
  • JP5517344B2
  • US20110215826A1
  • US20130056872A1
  • US20140070828A1
  • JP2014103358A
  • US20150285838A1
Record as JSON
{
  "publication_number": "US10197617B2",
  "country": "US",
  "kind": "B2",
  "title": "Probe card loading apparatus and probe card managing system including the same",
  "abstract": "A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.",
  "claims": [
    "1. A loading apparatus comprising: a package jig configured to fix to a package, the package jig including, a case configured to surround an edge of the package and having first alignment holes adjacent to the edge of the package; and a handle configured to connect to the case and positioned on the package; a transfer unit including a hand for holding the package jig and configured to transfer the package; and a load port on which the package transferred by the transfer unit is loaded, the load port and the hand comprising, first alignment pins and first alignment sockets for aligning the package to the load port.",
    "2. The loading apparatus of claim 1, wherein the load port further comprises: second alignment pins between the first alignment pins and extending into the first alignment holes.",
    "3. The loading apparatus of claim 2, wherein the first alignment pins are longer in length than the second alignment pins.",
    "4. The loading apparatus of claim 2, wherein the first alignment pins and the second alignment pins are aligned in the same direction.",
    "5. The loading apparatus of claim 2, wherein a height where the second alignment pins are positioned is lower than a height where the first alignment pins are positioned.",
    "6. The loading apparatus of claim 2, wherein the hand further comprises: clamps between the first alignment sockets and configured to fix the handle.",
    "7. The loading apparatus of claim 6, wherein the handle has second alignment holes, and wherein the hand further comprises: third alignment pins between the clamps and provided in the second alignment holes.",
    "8. The loading apparatus of claim 7, wherein the third alignment pins are shorter in length than the clamps and the first alignment sockets.",
    "9. The loading apparatus of claim 6, wherein the first alignment sockets are longer in length than the clamps.",
    "10. The loading apparatus of claim 1, wherein the load port further comprises reflection plates at the outside of the first alignment pins, and wherein the hand further comprises: location sensors at the outside of the first alignment sockets and aligned to the reflection plates.",
    "11. A probe card managing system comprising: a stocker configured to keep a probe card; a tester configured to test a substrate connected with the probe card; and a card loading apparatus configured to transfer the probe card to the stocker and to load the probe card on the substrate, the card loading apparatus comprising: a probe card jig configured to fix to a probe card, the probe card jig including, a case configured to surround an edge of the probe card and having first alignment holes adjacent to the edge of the probe card, and a handle configured to connect to the case and positioned on the probe card; a transfer unit including a hand configured to hold the probe card jig and configured to transfer the probe card; and a load port on which the probe card transferred by the transfer unit is loaded, the load port and the hand comprising: first alignment pins and first alignment sockets configured to align the probe card to the load port.",
    "12. The probe card managing system of claim 11, further comprising: a carrier transfer apparatus configured to transfer at least one carrier on which the probe card is loaded, and wherein the carrier comprises: a first housing; at least one first rack in a housing and having a hole opened in an entrance direction of the housing; and support blocks on the first rack along an edge of the hole and configured to support the probe card.",
    "13. The probe card managing system of claim 12, wherein the load port further comprises guide pins adjacent to the support blocks and provided in the first alignment holes.",
    "14. The probe card managing system of claim 12, wherein the stocker comprises: a plurality of second racks configured to receive the probe card; a transfer port configured to transfer the probe card provided on the second racks to the card loading apparatus; and a carrier opener configured to open the carrier to provide the probe card to the second racks.",
    "15. The probe card managing system of claim 12, wherein the carrier transfer apparatus comprises: a first carrier transfer apparatus configured to transfer the carrier manually; and a second carrier transfer apparatus configured to transfer the carrier automatically, and further comprising: jeep towers between the first and second carrier transfer apparatuses and configured to elevate the carrier."
  ],
  "description_excerpt": "A semiconductor device may be fabricated using a plurality of unit processes. Among the unit processes, a test process is a process for determining the reliability of the semiconductor device. A tester outputs or receives an electric signal to or from the semiconductor device using a probe card. The probe card may be connected with a semiconductor device at a wafer level. In general, managing and loading of the probe card may be performed manually by an operator.\n\nIn at least one example embodiment of the inventive concepts, a probe card loading apparatus capable of aligning a probe card to a load port is provided.\n\nIn some example embodiments of the inventive concepts a probe card loading apparatus capable of automatizing logistics movement of a probe card and a probe card managing system including the same is provided.\n\nAt least one example embodiment provides a loading apparatus which includes a package jig, a transfer unit, and a load port. The package jig may be fixed to a package. The transfer unit may include a hand for holding the package jig and transfers the package. The package transferred by the transfer unit may be loaded on the load port. The load port and the hand may include first alignment pins and first alignment sockets for aligning the package to the load port.\n\nAt least one example embodiment provides a probe card managing system which includes a stocker, a tester, and a card loading apparatus. The stocker may keep a probe card, and the tester may test a substrate connected with the probe card.",
  "cpc": [
    "G01R 31/2601",
    "G01R 31/2889",
    "G01R 31/2893",
    "H10P 72/3216"
  ],
  "ipc": [
    "B65G 47/90",
    "G01R 1/04",
    "G01R 31/26",
    "H10P 72/30",
    "G01R 31/28"
  ],
  "assignees": [
    "Samsung Electronics Co Ltd"
  ],
  "inventors": [
    "Youngin Kim",
    "Jongsam KIM",
    "Byung-Soo PARK",
    "Sookil PARK",
    "Byungkook Yoo",
    "Younghyen LEE",
    "Seong Sil JEONG",
    "Wooseong CHOI"
  ],
  "filing_date": "2015-12-01",
  "publication_date": "2019-02-05",
  "grant_date": "2019-02-05",
  "priority_date": "2014-12-24",
  "application_number": "US-201514955432-A",
  "family_id": "56163367",
  "cited_by_count": 2,
  "citations": [
    "US5375710A",
    "US20020037657A1",
    "JP2004170267A",
    "US7385386B2",
    "US20050170689A1",
    "KR100617273B1",
    "US20070126441A1",
    "US7887277B2",
    "US8040147B2",
    "KR100833285B1",
    "US8490802B2",
    "JP5035415B2",
    "KR101019534B1",
    "KR101019535B1",
    "US8267633B2",
    "KR101279318B1",
    "JP5517344B2",
    "US20110215826A1",
    "US20130056872A1",
    "US20140070828A1",
    "JP2014103358A",
    "US20150285838A1"
  ]
}

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