Patents full text · MLC-0201
CPC subclass H10P
Generic processes or apparatus for the manufacture or treatment of devices covered by class H10
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US12237197B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2025-02-25 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 2 | US12153433B2 | Systems and methods for raised floor automated sensor vehicles | 2024-11-26 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 3 | US12148643B2 | Carrier vehicle system | 2024-11-19 | MURATA MACHINERY LTD |
| 4 | US12106991B2 | Substrate transfer systems and methods of use thereof | 2024-10-01 | APPLIED MATERIALS INC |
| 5 | US12091063B2 | Damping device, stacker crane, transport system, and damping device jig | 2024-09-17 | MURATA MACHINERY LTD |
| 6 | US12080581B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2024-09-03 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 7 | US12068182B2 | Device for recognizing wafer identification number with automatically turning on and off recognizing function | 2024-08-20 | UNIV NAT TSING HUA |
| 8 | US12004337B2 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools | 2024-06-04 | APPLIED MATERIALS INC |
| 9 | US2024057464A1 | Manufacturing equipment for light-emitting device | 2024-02-15 | SEMICONDUCTOR ENERGY LAB |
| 10 | US11810801B2 | Robot embedded vision apparatus | 2023-11-07 | BROOK AUTOMATION INC |
| 11 | US11592611B2 | Tray module, tray assembly having the tray module, and method of fabricating display device using the tray assembly | 2023-02-28 | SAMSUNG DISPLAY CO LTD |
| 12 | US11498779B2 | Adsorption device, method for making same, and transferring system having same | 2022-11-15 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 13 | US2022344182A1 | Transfer chamber | 2022-10-27 | SINFONIA TECHNOLOGY CO LTD |
| 14 | US11469132B2 | Method of aligning micro light emitting element and display transferring structure | 2022-10-11 | SAMSUNG ELECTRONICS CO LTD |
| 15 | US11430683B2 | Conveying device for conveying at least one wafer | 2022-08-30 | BOSCH GMBH ROBERT |
| 16 | US11309168B2 | Vacuum processing apparatus and maintenance apparatus | 2022-04-19 | TOKYO ELECTRON LTD |
| 17 | US2022020575A1 | Apparatus for treating substrate, method for measuring height difference between lift pins, and computer readable recording medium having processing program stored therein | 2022-01-20 | SEMES CO LTD |
| 18 | US11223014B2 | Semiconductor structures including liners comprising alucone and related methods | 2022-01-11 | MICRON TECHNOLOGY INC |
| 19 | US2022005736A1 | Substrate processing apparatus and substrate processing method | 2022-01-06 | SCREEN HOLDINGS CO LTD |
| 20 | US11158079B2 | Substrate treating apparatus and apparatus and method for eccentricity inspection | 2021-10-26 | SEMES CO LTD |
| 21 | US11091397B2 | Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices | 2021-08-17 | WATLOW ELECTRIC MFG |
| 22 | US11088182B2 | Method for transferring light emitting elements, display panel, method for making display panel, and substrate | 2021-08-10 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 23 | US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | 2021-03-30 | PALO ALTO RES CT INC |
| 24 | US10930494B2 | Vapor phase transport system and method for depositing perovskite semiconductors | 2021-02-23 | SWIFT SOLAR INC |
| 25 | US10923370B2 | Transport system and transport method | 2021-02-16 | MURATA MACHINERY LTD |
| 26 | US10825702B2 | Method and device for self-assembling semiconductor light-emitting diodes | 2020-11-03 | LG ELECTRONICS INC |
| 27 | US10685832B1 | Substrate processing apparatus | 2020-06-16 | KOKUSAI ELECTRIC CORP |
| 28 | US10681851B2 | Pick and place tooling with adjustable nozzle configuration | 2020-06-09 | INTEL CORP |
| 29 | US10403531B2 | Semiconductor manufacturing apparatus with supporting columns and tables | 2019-09-03 | TOSHIBA MEMORY CORP |
| 30 | US10367080B2 | Method of forming a germanium oxynitride film | 2019-07-30 | ASM IP HOLDING BV |
| 31 | US10332747B1 | Selective titanium nitride deposition using oxides of lanthanum masks | 2019-06-25 | GLOBALFOUNDRIES INC |
| 32 | US10290508B1 | Method for forming vertical spacers for spacer-defined patterning | 2019-05-14 | ASM IP HOLDING BV |
| 33 | US10283353B2 | Method of reforming insulating film deposited on substrate with recess pattern | 2019-05-07 | ASM IP HOLDING BV |
| 34 | US10236197B2 | Processing system containing an isolation region separating a deposition chamber from a treatment chamber | 2019-03-19 | APPLIED MATERIALS INC |
| 35 | US10217678B2 | Display device and method of manufacturing the display device | 2019-02-26 | INNOLUX CORP |
| 36 | US10192734B2 | Short inorganic trisilylamine-based polysilazanes for thin film deposition | 2019-01-29 | AIR LIQUIDE ADVANCED MAT INC |
| 37 | US10189243B2 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | 2019-01-29 | X CELEPRINT LTD |
| 38 | US10186449B2 | Apparatus and methods for wafer rotation to improve spatial ALD process uniformity | 2019-01-22 | APPLIED MATERIALS INC |
| 39 | US10153140B2 | Method of installing elastomer ring in semiconductor processing equipment and guiding sheet and jig used in installing elastomer ring | 2018-12-11 | MFC SEALING TECH CO LTD |
| 40 | US10134620B2 | Robot system and incline detection method | 2018-11-20 | YASKAWA ELECTRIC CORP |
| 41 | US10121692B2 | Substrate holding apparatus | 2018-11-06 | EBARA CORP |
| 42 | US2018279520A1 | Mounting head and surface mounter | 2018-09-27 | YAMAHA MOTOR CO LTD |
| 43 | US9889521B2 | Method and system for pull testing of wire bonds | 2018-02-13 | ASM TECH SINGAPORE PTE LTD |
| 44 | US9881821B2 | Control wafer making device and method for measuring and monitoring control wafer | 2018-01-30 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 45 | US9859151B1 | Selective film deposition method to form air gaps | 2018-01-02 | ASM IP HOLDING BV |
| 46 | US9799736B1 | High acceptor level doping in silicon germanium | 2017-10-24 | IBM |
| 47 | US9761754B2 | Systems and methods for preparing GaN and related materials for micro assembly | 2017-09-12 | X CELEPRINT LTD |
| 48 | US9741847B2 | Methods of forming a contact structure for a vertical channel semiconductor device and the resulting device | 2017-08-22 | GLOBALFOUNDRIES INC |
| 49 | US9735131B2 | Multi-stack package-on-package structures | 2017-08-15 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 50 | US9644266B2 | Film forming apparatus, gas supply device and film forming method | 2017-05-09 | TOKYO ELECTRON LTD |
| 51 | US9640715B2 | Printable inorganic semiconductor structures | 2017-05-02 | X CELEPRINT LTD |
| 52 | US9601693B1 | Method for encapsulating a chalcogenide material | 2017-03-21 | LAM RES CORP |
| 53 | US9588443B2 | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method | 2017-03-07 | NIKON CORP |
| 54 | US9548231B2 | Robot and adaptive placement system and method | 2017-01-17 | PERSIMMON TECHNOLOGIES CORP |
| 55 | US9543178B2 | Semiconductor wafer stocker apparatus and wafer transferring methods using the same | 2017-01-10 | SAMSUNG ELECTRONICS CO LTD |
| 56 | US9525262B2 | Slab laser and amplifier and method of use | 2016-12-20 | STUART MARTIN A |
| 57 | US9508667B2 | Formation of solder and copper interconnect structures and associated techniques and configurations | 2016-11-29 | INTEL CORP |
| 58 | US9484233B2 | Carousel reactor for multi-station, sequential processing systems | 2016-11-01 | NOVELLUS SYSTEMS INC |
| 59 | US9373530B2 | Tool for picking a planar object from a supply station | 2016-06-21 | SCHMIDT-LANGE MICHAEL |
| 60 | US2016163561A1 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | 2016-06-09 | LAM RES CORP |
| 61 | US9281254B2 | Methods of forming integrated circuit package | 2016-03-08 | TAIWAN SEMICONDUCTOR MFG |
| 62 | US9263309B2 | Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator | 2016-02-16 | FLITSCH FREDERICK A |
| 63 | US9117940B2 | Optical systems fabricated by printing-based assembly | 2015-08-25 | UNIV ILLINOIS |
| 64 | US9111975B2 | Loading mechanism | 2015-08-18 | LI BING |
| 65 | US8807905B2 | Linear semiconductor processing facilities | 2014-08-19 | MEULEN PETER VAN DER |
| 66 | US8771807B2 | Organoaminosilane precursors and methods for making and using same | 2014-07-08 | XIAO MANCHAO |
| 67 | US8748780B2 | Substrate processing apparatus, substrate processing method, and computer-readable storage medium | 2014-06-10 | MORO SHOUKEN |
| 68 | US8714532B2 | Absorber and apparatus for fabricating liquid crystal display panel having the same | 2014-05-06 | LIM JONG-GO |
| 69 | US8710580B2 | Semiconductor device and method of manufacturing the same | 2014-04-29 | SAKUMA KIWAMU |
| 70 | US2014105716A1 | Apparatus for transferring substrates | 2014-04-17 | TES CO LTD |
| 71 | US2014004710A1 | Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device | 2014-01-02 | SAKATA MASAKAZU |
| 72 | US8506363B2 | Substrate holder and substrate holding method | 2013-08-13 | TAKAHASHI TAMAMI |
| 73 | US2013078392A1 | Halogenated organoaminosilane precursors and methods for depositing films comprising same | 2013-03-28 | XIAO MANCHAO |
| 74 | US8367528B2 | Cyclical epitaxial deposition and etch | 2013-02-05 | ASM INC |
| 75 | US8334152B2 | Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate | 2012-12-18 | SPEIER INGO |
| 76 | US8322542B2 | Cassette for receiving substrates | 2012-12-04 | PARK MOO YEOL |
| 77 | US2012275886A1 | Transport system and transport method | 2012-11-01 | OTA TATSUJI |
| 78 | US2012032311A1 | Multi component dielectric layer | 2012-02-09 | GATES STEPHEN M |
| 79 | US8071452B2 | Atomic layer deposition of hafnium lanthanum oxides | 2011-12-06 | RAISANEN PETRI I |
| 80 | US2011263115A1 | Nmos metal gate materials, manufacturing methods, and equipment using cvd and ald processes with metal based precursors | 2011-10-27 | APPLIED MATERIALS INC |
| 81 | US2011247918A1 | Substrate delivery device and aligner unit applied therein | 2011-10-13 | AURIA SOLAR |
| 82 | US7982296B2 | Methods and devices for fabricating and assembling printable semiconductor elements | 2011-07-19 | UNIV ILLINOIS |
| 83 | US7932123B2 | Release strategies for making transferable semiconductor structures, devices and device components | 2011-04-26 | UNIV ILLINOIS |
| 84 | US7874261B2 | Stage apparatus and coating treatment device | 2011-01-25 | TOKYO ELECTRON LTD |
| 85 | US2010324732A1 | Wafer center finding with a kalman filter | 2010-12-23 | BROOKS AUTOMATION INC |
| 86 | US7795160B2 | ALD of metal silicate films | 2010-09-14 | ASM INC |
| 87 | US2010213594A1 | Semiconductor device and a manufacturing method of the same | 2010-08-26 | RENESAS TECH CORP |
| 88 | US7694700B2 | Apparatus for transporting substrates under a controlled atmosphere | 2010-04-13 | CIT ALCATEL |
| 89 | US2010045949A1 | Exposure apparatus, maintaining method and device fabricating method | 2010-02-25 | NIKON CORP |
| 90 | US7530887B2 | Chemical mechanical polishing pad with controlled wetting | 2009-05-12 | ROHM & HAAS ELECT MAT |
| 91 | US2009095956A1 | Single-crystal silicon substrate, soi substrate, semiconductor device, display device, and manufacturing method of semiconductor device | 2009-04-16 | TAKAFUJI YUTAKA |
| 92 | US7489389B2 | Stage device with frame-shaped member movable in at least three degrees of freedom within a two-dimensional plane | 2009-02-10 | NIKON CORP |
| 93 | US7335244B2 | Air-purifying device for a front-opening unified pod | 2008-02-26 | CAMBRIDGE FILTER JAPAN LTD |
| 94 | US7334691B2 | Glass substrate cassette | 2008-02-26 | AU OPTRONICS CORP |
| 95 | US7222721B2 | Transferring apparatus, carrying apparatus, and transferring method | 2007-05-29 | SEIKO EPSON CORP |
| 96 | US7122222B2 | Precursors for depositing silicon containing films and processes thereof | 2006-10-17 | AIR PROD & CHEM |
| 97 | US2006134330A1 | Cluster tool architecture for processing a substrate | 2006-06-22 | APPLIED MATERIALS INC |
| 98 | US7022211B2 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | 2006-04-04 | EBARA CORP |
| 99 | US7000648B2 | Device picker in handler | 2006-02-21 | MIRAE CORP |
| 100 | US2005253218A1 | High voltage gate driver integrated circuit including high voltage junction capacitor and high voltage LDMOS transistor | 2005-11-17 | JEON CHANG-KI |
142 records in this listing. Patents full text (MLC-0201). Request the full dataset.