Patents full text · MLC-0201
CPC subclass H10P
Generic processes or apparatus for the manufacture or treatment of devices covered by class H10
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 201 | US8322542B2 | Cassette for receiving substrates | 2012-12-04 | LG Display Co Ltd |
| 202 | US2012275886A1 | Transport system and transport method | 2012-11-01 | Muratec Automation Co Ltd |
| 203 | US2012032311A1 | Multi component dielectric layer | 2012-02-09 | International Business Machines Corp |
| 204 | US8071452B2 | Atomic layer deposition of hafnium lanthanum oxides | 2011-12-06 | ASM America Inc |
| 205 | US2011263115A1 | Nmos metal gate materials, manufacturing methods, and equipment using cvd and ald processes with metal based precursors | 2011-10-27 | Applied Materials Inc |
| 206 | US7982296B2 | Methods and devices for fabricating and assembling printable semiconductor elements | 2011-07-19 | University of Illinois System |
| 207 | US7932123B2 | Release strategies for making transferable semiconductor structures, devices and device components | 2011-04-26 | University of Illinois System |
| 208 | US2010324732A1 | Wafer center finding with a kalman filter | 2010-12-23 | Brooks Automation Inc |
| 209 | US7795160B2 | ALD of metal silicate films | 2010-09-14 | ASM America Inc |
| 210 | US2010213594A1 | Semiconductor device and a manufacturing method of the same | 2010-08-26 | Renesas Technology Corp |
| 211 | US7694700B2 | Apparatus for transporting substrates under a controlled atmosphere | 2010-04-13 | Alcatel SA |
| 212 | US2010045949A1 | Exposure apparatus, maintaining method and device fabricating method | 2010-02-25 | Nikon Corp |
| 213 | US7530887B2 | Chemical mechanical polishing pad with controlled wetting | 2009-05-12 | Rohm and Haas Electronic Materials CMP Holdings Inc |
| 214 | US2009111244A1 | Method for manufacturing semiconductor device | 2009-04-30 | Semiconductor Energy Laboratory Co Ltd |
| 215 | US2009095956A1 | Single-crystal silicon substrate, soi substrate, semiconductor device, display device, and manufacturing method of semiconductor device | 2009-04-16 | |
| 216 | US7489389B2 | Stage device with frame-shaped member movable in at least three degrees of freedom within a two-dimensional plane | 2009-02-10 | Nikon Corp |
| 217 | US7335244B2 | Air-purifying device for a front-opening unified pod | 2008-02-26 | Cambridge Filter Japan Ltd |
| 218 | US7334691B2 | Glass substrate cassette | 2008-02-26 | AU Optronics Corp |
| 219 | US7222721B2 | Transferring apparatus, carrying apparatus, and transferring method | 2007-05-29 | Seiko Epson Corp |
| 220 | US7122222B2 | Precursors for depositing silicon containing films and processes thereof | 2006-10-17 | Air Products and Chemicals Inc |
| 221 | US2006134330A1 | Cluster tool architecture for processing a substrate | 2006-06-22 | Applied Materials Inc |
| 222 | US7022211B2 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer | 2006-04-04 | Ebara Corp |
| 223 | US7000648B2 | Device picker in handler | 2006-02-21 | Mirae Corp |
| 224 | US6938505B2 | Chamber wafer detection | 2005-09-06 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 225 | US2004241981A1 | Structure and method to fabricate ultra-thin si channel devices | 2004-12-02 | International Business Machines Corp |
| 226 | US6780773B2 | Method of chemical mechanical polishing with high throughput and low dishing | 2004-08-24 | Applied Materials Inc |
| 227 | US6683663B1 | Web fabrication of devices | 2004-01-27 | Alien Technology LLC |
| 228 | US6664129B2 | Integrated circuits and methods for their fabrication | 2003-12-16 | Allvia Inc |
| 229 | US6660700B2 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | 2003-12-09 | Advanced Technology Materials Inc |
| 230 | US6656017B2 | Method and apparatus for creating an open cell micro-environment for treating a substrate with an impingement spray | 2003-12-02 | |
| 231 | US6654668B1 | Processing apparatus, processing system, distinguishing method, and detecting method | 2003-11-25 | Tokyo Electron Ltd |
| 232 | US6592671B2 | Apparatus for clamping a planar substrate | 2003-07-15 | Delsys Pharmaceutical Corp |
| 233 | US6576138B2 | Method for purifying semiconductor gases | 2003-06-10 | Praxair Technology Inc |
| 234 | US6570253B1 | Multi-layer film for a thin film structure and a capacitor using the same | 2003-05-27 | Samsung Electronics Co Ltd |
| 235 | US6568863B2 | Platform and optical module, method of manufacture thereof, and optical transmission device | 2003-05-27 | Seiko Epson Corp |
| 236 | US6566204B1 | Use of mask shadowing and angled implantation in fabricating asymmetrical field-effect transistors | 2003-05-20 | National Semiconductor Corp |
| 237 | US6534395B2 | Method of forming graded thin films using alternating pulses of vapor phase reactants | 2003-03-18 | ASM Microchemistry Oy |
| 238 | US6498107B1 | Interface control for film deposition by gas-cluster ion-beam processing | 2002-12-24 | TEL Epion Inc |
| 239 | US6436251B2 | Vault-shaped target and magnetron having both distributed and localized magnets | 2002-08-20 | Applied Materials Inc |
| 240 | US6429037B1 | Self aligning method for forming a selective emitter and metallization in a solar cell | 2002-08-06 | Unisearch Ltd |
| 241 | US6424028B1 | Semiconductor devices configured to tolerate connection misalignment | 2002-07-23 | Koninklijke Philips Electronics NV |
| 242 | US6410463B1 | Method for forming film with low dielectric constant on semiconductor substrate | 2002-06-25 | ASM Japan KK |
| 243 | US6395334B1 | Multiple head dispensing method | 2002-05-28 | Speedline Technologies Inc |
| 244 | US6274878B1 | Wafer out-of-pocket detection method | 2001-08-14 | Applied Materials Inc |
| 245 | US6274496B1 | Method for single chamber processing of PECVD-Ti and CVD-TiN films for integrated contact/barrier applications in IC manufacturing | 2001-08-14 | Tokyo Electron Ltd |
| 246 | US6183563B1 | Apparatus for depositing thin films on semiconductor wafers | 2001-02-06 | IPS Ltd |
| 247 | US6158445A | Semiconductor wafer cleaning method | 2000-12-12 | Verteq Inc |
| 248 | US6135860A | Fixture for mechanical grinding and inspection of failed or defective semiconductor devices | 2000-10-24 | Sony Corp |
| 249 | US6123775A | Reaction chamber component having improved temperature uniformity | 2000-09-26 | Lam Research Corp |
| 250 | US6113695A | Coating unit | 2000-09-05 | Tokyo Electron Ltd |
| 251 | US6043132A | Method for forming HSG silicon film of semiconductor device | 2000-03-28 | Samsung Electronics Co Ltd |
| 252 | US5981399A | Method and apparatus for fabricating semiconductor devices | 1999-11-09 | Hitachi Ltd |
| 253 | US5981361A | Fabrication process of a semiconductor device including a dicing process of a semiconductor wafer | 1999-11-09 | Fujitsu Ltd |
| 254 | US5858819A | Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device | 1999-01-12 | Seiko Epson Corp |
| 255 | US5723028A | Electrodeposition apparatus with virtual anode | 1998-03-03 | |
| 256 | US5695817A | Method of forming a coating film | 1997-12-09 | Tokyo Electron Ltd |
| 257 | US5665167A | Plasma treatment apparatus having a workpiece-side electrode grounding circuit | 1997-09-09 | Tokyo Electron Ltd |
| 258 | US5584938A | Electrostatic particle removal and characterization | 1996-12-17 | Texas Instruments Inc |
| 259 | US5476810A | Manufacture of electronic devices comprising thin-film circuits using a metal foil as a temporary support | 1995-12-19 | US Philips Corp |
| 260 | US5295296A | Method and apparatus for working a clad material | 1994-03-22 | Citizen Watch Co Ltd |
| 261 | US4877757A | Method of sequential cleaning and passivating a GaAs substrate using remote oxygen plasma | 1989-10-31 | Texas Instruments Inc |
| 262 | US4425076A | Process and apparatus for automatic positioning of a substrate on a worktable | 1984-01-10 | CII Honeywell Bull |
| 263 | US3851899A | Means for sealing fittings and nozzle assemblies at extremely high fluid pressures | 1974-12-03 | |
| 264 | US3670218A | Monolithic heteroepitaxial microwave tunnel die | 1972-06-13 | North American Rockwell Corp |
264 records in this listing. Patents full text (MLC-0201). Request the full dataset.