Fixture for mechanical grinding and inspection of failed or defective semiconductor devices

{
  "publication_number": "US6135860A",
  "country": "US",
  "kind": "A",
  "title": "Fixture for mechanical grinding and inspection of failed or defective semiconductor devices",
  "abstract": "A fixture for holding a semiconductor chip during a polishing process can be made to also hold the chip while the chip is inspected by a scanning electron microscope. In this manner, the polishing of the chip may be inspected and monitored without removing the chip from the polishing fixture. This allows polishing to be resumed, if necessary, with more precision. This results because the position of the chip with respect to the polishing fixture has not been altered by removing and then resecuring the chip as would be otherwise necessary for microscopic inspection of the chip.",
  "claims": [
    "1. A method of polishing and monitoring the polishing of a semiconductor chip comprising: securing said chip on a chip pad, said chip pad being mounted on a polishing fixture: polishing said chip while said chip is secured to said chip pad and said chip pad is secured to said polishing fixture; observing a polished edge of the chip with a microscope while said chip remains secured to said chip pad which is secured to said polishing fixture with which said polishing was performed.",
    "2. A method as claimed in claim 1, further comprising controlling a polishing rate of said polishing by applying a polishing rate adjusting weight to said fixture during said polishing.",
    "3. A method as claimed in claim 2, further comprising controlling said polishing rate by adjusting the position and orientation of said weight with respect to said fixture.",
    "4. A method as claimed in claim 1, wherein said observing further comprises removably mounting said fixture to said microscope, said method further comprising removing said fixture from said microscope and resuming polishing of said chip based on said observation.",
    "5. A method as claimed in claim 4, further comprising controlling said resumed polishing by adjusting means provided on said fixture for controlling the angle between said fixture and a polishing surface.",
    "6. A method as claimed in claim 4, further comprising controlling said resumed polishing by adjusting the orientation or position of a polishing rate adjusting weight applied to said fixture.",
    "7. A method as claimed in claim 1, wherein: said observing further comprises removably mounting said fixture to said microscope; and said mounting further mounting said fixture to said microscope with a groove in a surface of said fixture.",
    "8. A method of polishing and monitoring the polishing of a semiconductor chip, wherein said chip is polished while secured to a polishing fixture, the method comprising: removably mounting said polishing fixture to a microscope in an orientation in which said chip can be observed with said microscope; and observing a polished edge of said chip with said microscope while said chip remains secured to said polishing fixture.",
    "9. A method as claimed in claim 8, further comprising: polishing said chip while said chip is secured to said polishing fixture; and controlling a polishing rate of said polishing by applying a polishing rate adjusting weight to said fixture during said polishing.",
    "10. A method as claimed in claim 9, further comprising controlling said polishing rate by adjusting the position and orientation of said weight with respect to said fixture.",
    "11. A method as claimed in claim 8, further comprising removing said fixture from said microscope and resuming polishing of said chip based on said observation.",
    "12. A method as claimed in claim 11, further comprising controlling said resumed polishing by adjusting means provided on said fixture for controlling the angle between said fixture and a polishing surface.",
    "13. A method as claimed in claim 11, further comprising controlling said resumed polishing by adjusting the orientation or position of a polishing rate adjusting weight applied to said fixture.",
    "14. A method as claimed in claim 8, wherein said mounting further comprises mounting said fixture to said microscope with a groove in a surface of said fixture."
  ],
  "cpc": [
    "B24B 37/30",
    "H10P 72/0604",
    "H10P 72/0616",
    "H10P 72/76",
    "Y10T 29/49995"
  ],
  "assignees": [
    "SONY CORP",
    "SONY ELECTRONICS INC"
  ],
  "filing_date": "1999-07-20",
  "publication_date": "2000-10-24",
  "grant_date": "2000-10-24",
  "priority_date": "1997-05-16",
  "application_number": "US-35825399-A",
  "family_id": "25326815",
  "citations": [
    "US2484574A",
    "US2654979A",
    "US4850157A",
    "US4876826A",
    "US5272844A"
  ]
}