Wafer cleaning apparatus and wafer transfer device

{
  "publication_number": "US12261067B2",
  "country": "US",
  "kind": "B2",
  "title": "Wafer cleaning apparatus and wafer transfer device",
  "abstract": "A wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts.",
  "claims": [
    "1. A wafer transfer device of a wafer cleaning apparatus, comprising: a machine bracket; a drive mechanism arranged at the machine bracket; a retractable bracket arranged at the machine bracket including a sleeve, a first end of the retractable bracket being fixedly connected to the machine bracket, a second end of the retractable bracket being movably arranged at the machine bracket; and a plurality of wafer support brackets arranged at the retractable bracket and arranged in a movement direction of the second end, each wafer support bracket of the plurality of wafer support brackets including a bracket pin and a shaft sleeve; wherein: the drive mechanism is connected to the retractable bracket and configured to drive the second end to move to cause the retractable bracket to extend and retract; a distance of any two neighboring wafer support brackets changes as the retractable bracket extends and retracts, and the distance of any two neighboring wafer support brackets is same; the bracket pin is arranged at a bottom of the wafer support bracket; the shaft sleeve is rotatably connected to the bracket pin; and the sleeve is connected to the shaft sleeve.",
    "2. The wafer transfer device according to claim 1, wherein the retractable bracket includes: a plurality of connection rods hinged end-to-end, wherein: the plurality of wafer support brackets are connected to middle positions of the plurality of connection rods in a one-to-one correspondence; connection positions between the plurality of wafer support brackets and the corresponding connection rods are on a straight line; and the straight line extends in a movement direction of the second end.",
    "3. The wafer transfer device according to claim 1, wherein: a screw mechanism is provided at the machine bracket; the screw mechanism includes: a screw connected to the machine bracket and connected to the drive mechanism for driving, an axis of the screw extending in the movement direction of the second end; and a sliding piece arranged at the screw and thread-cooperates with the screw; wherein: the drive mechanism is configured to drive the screw to rotate to cause the sliding piece to move on the screw; the sliding piece is connected to the second end; and the second end moves with the sliding piece along the screw.",
    "4. The wafer transfer device according to claim 3, wherein the drive mechanism includes: a motor arranged at the machine bracket; and a transmission member; wherein the motor is connected to the screw through the transmission member for transmitting movement to drive the screw to rotate.",
    "5. The wafer transfer device according to claim 3, wherein: the machine bracket further includes a guide rod, an axis of the guide rod extending along the movement direction of the second end; and the wafer support bracket includes a guide hole, the plurality of wafer support brackets being arranged at the guide rod through the guide hole, and the guide rod slidably cooperating with the guide hole.",
    "6. The wafer transfer device according to claim 5, further comprising: two guide rods arranged on two sides of the screw, respectively; wherein the wafer support bracket includes two guide holes cooperating with the two guide rods in a one-to-one correspondence.",
    "7. The wafer transfer device according to claim 3, wherein the wafer support bracket includes an avoidance hole, the screw passing through avoidance holes of the plurality of wafer support brackets to be connected to the machine bracket.",
    "8. The wafer transfer device according to claim 1, wherein the machine bracket further includes: a first position sensor and a second position sensor spaced apart from the first position sensor on the machine bracket; wherein: in response to the second end moving to a position opposite to the first position sensor, the first position sensor is triggered, and a distance between any two neighboring wafer support brackets is a first distance; and in response to the second end moving to a position opposite to the second position sensor, the second position sensor is triggered, and the distance between any two neighboring wafer support brackets is the second distance; and the first distance is not equal to the second distance.",
    "9. The wafer transfer device according to claim 1, further comprising: a distance measurement structure arranged at the machine bracket and configured to detect a distance between wafers carried by the two neighboring wafer support brackets.",
    "10. The wafer transfer device according to claim 9, wherein the distance measurement structure includes: an electric cylinder arranged at the machine bracket and along the movement direction of the second end; an electric cylinder sliding piece movably arranged at the electric cylinder; a through beam sensor bracket arranged at the electric cylinder sliding piece; and a through beam sensor arranged at the through beam sensor bracket and configured to detect the distance between the wafers carried by neighboring wafer support brackets.",
    "11. A wafer cleaning apparatus comprising a wafer transfer device including: a machine bracket; a drive mechanism arranged at the machine bracket; a retractable bracket arranged at the machine bracket including a sleeve, a first end of the retractable bracket being fixedly connected to the machine bracket, a second end of the retractable bracket being movably arranged at the machine bracket; and a plurality of wafer support brackets arranged at the retractable bracket and arranged in a movement direction of the second end, each wafer support bracket of the plurality of wafer support brackets including a bracket pin and a shaft sleeve; wherein: the drive mechanism is connected to the retractable bracket and configured to drive the second end to move to cause the retractable bracket to extend and retract; a distance of any two neighboring wafer support brackets changes as the retractable bracket extends and retracts, and the distance of any two neighboring wafer support brackets is same; the bracket pin is arranged at a bottom of the wafer support bracket; the shaft sleeve is rotatably connected to the bracket pin; and the sleeve is connected to the shaft sleeve."
  ],
  "description_excerpt": "The present disclosure generally relates to the semiconductor field and, more particularly, to a wafer cleaning apparatus and a wafer transfer device.\n\nIn the process of continuous processing, forming, and polishing, contaminants are generated at a wafer since the wafer is in contact with organic materials, particles, and metals. Thus, a cleaning process needs to be performed on the surface of the wafer to eliminate the contaminants on the surface of the wafer. The cleaning process is an important step in the wafer manufacturing process.\n\nDuring the cleaning process, the wafer needs to be fetched from a wafer storage container using a wafer transfer device and placed in a cleaning tank in a misalignment sealed insertion method for cleaning. Once the cleaning is completed, the wafer is then fetched from the cleaning tank and placed back into the wafer storage container. As the number of stacked memory chip layers increases, the thickness of the wafer also increases. Thus, the wafer is thicker when the same number of wafers are placed in the cleaning tank. The distance between neighboring wafers is reduced accordingly, which impacts the cleaning effect.\n\nThe present disclosure provides a wafer cleaning apparatus and a wafer transfer device, which can adjust a distance between any two neighboring wafers to adapt to wafers of different thicknesses to ensure the cleaning effect.\n\nTo solve the above problem, the present disclosure provides the following technical solutions.",
  "cpc": [
    "H10P 72/3402",
    "H01L 21/67028",
    "H01L 21/67309",
    "H01L 21/67346",
    "H10P 72/0406",
    "H10P 72/0416",
    "H10P 72/0608",
    "H10P 72/127",
    "H10P 72/18",
    "H10P 72/3302",
    "H10P 72/3412",
    "Y02P 70/50"
  ],
  "ipc": [
    "H10P 72/00",
    "H10P 72/10",
    "H10P 72/30"
  ],
  "assignees": [
    "Beijing Naura Microelectronics Equipment Co Ltd"
  ],
  "inventors": [
    "Hongshuai MA",
    "Hongyu Zhao",
    "Ruiting Wang"
  ],
  "filing_date": "2022-06-23",
  "publication_date": "2025-03-25",
  "grant_date": "2025-03-25",
  "priority_date": "2021-06-29",
  "application_number": "US-202218574817-A",
  "family_id": "77873953",
  "cited_by_count": 1,
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}