MLchartDataset catalogue

Patents full text · MLC-0201

CPC subclass H01L

98 patents

Table 1. Patents
No.PublicationTitlePublishedAssignee
1US12266660B2Memory device having 2-transistor memory cell and access line plate2025-04-01MICRON TECHNOLOGY INC
2US12237197B2Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current2025-02-25TAIWAN SEMICONDUCTOR MFG CO LTD
3US12230617B2Display device using micro-LED, and manufacturing method therefor2025-02-18LG ELECTRONICS INC
4US12148643B2Carrier vehicle system2024-11-19MURATA MACHINERY LTD
5US12106991B2Substrate transfer systems and methods of use thereof2024-10-01APPLIED MATERIALS INC
6US12080581B2Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current2024-09-03TAIWAN SEMICONDUCTOR MFG CO LTD
7US12068182B2Device for recognizing wafer identification number with automatically turning on and off recognizing function2024-08-20UNIV NAT TSING HUA
8US12004337B2Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools2024-06-04APPLIED MATERIALS INC
9US2024057464A1Manufacturing equipment for light-emitting device2024-02-15SEMICONDUCTOR ENERGY LAB
10US11810801B2Robot embedded vision apparatus2023-11-07BROOK AUTOMATION INC
11US11498779B2Adsorption device, method for making same, and transferring system having same2022-11-15CENTURY TECH SHENZHEN CORPORATION LIMITED
12US2022344182A1Transfer chamber2022-10-27SINFONIA TECHNOLOGY CO LTD
13US11469132B2Method of aligning micro light emitting element and display transferring structure2022-10-11SAMSUNG ELECTRONICS CO LTD
14US11430683B2Conveying device for conveying at least one wafer2022-08-30BOSCH GMBH ROBERT
15US11398461B2Electronic device2022-07-26LG ELECTRONICS INC
16US11387163B2Scalable debris-free socket loading mechanism2022-07-12INTEL CORP
17US11349062B2Piezoelectric drive device, robot, and printer2022-05-31SEIKO EPSON CORP
18US2022020575A1Apparatus for treating substrate, method for measuring height difference between lift pins, and computer readable recording medium having processing program stored therein2022-01-20SEMES CO LTD
19US11223014B2Semiconductor structures including liners comprising alucone and related methods2022-01-11MICRON TECHNOLOGY INC
20US2022005736A1Substrate processing apparatus and substrate processing method2022-01-06SCREEN HOLDINGS CO LTD
21US2021335901A1Display substrate, display panel, display apparatus, and method of fabricating a display substrate thereof2021-10-28HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD
22US11158079B2Substrate treating apparatus and apparatus and method for eccentricity inspection2021-10-26SEMES CO LTD
23US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices2021-08-17WATLOW ELECTRIC MFG
24US11088326B2Substrate for use in manufacturing display device and method for forming element on substrate2021-08-10SAMSUNG DISPLAY CO LTD
25US11088182B2Method for transferring light emitting elements, display panel, method for making display panel, and substrate2021-08-10CENTURY TECH SHENZHEN CORPORATION LIMITED
26US10964582B2Transfer substrate utilizing selectable surface adhesion transfer elements2021-03-30PALO ALTO RES CT INC
27US10944072B2Stretchable electroluminescent devices2021-03-09UNIV CORNELL
28US10930494B2Vapor phase transport system and method for depositing perovskite semiconductors2021-02-23SWIFT SOLAR INC
29US10926485B2Light generating microcapsules for photo-curing2021-02-23IBM
30US10923617B2Methods for fabricating thin film III-V compound solar cell2021-02-16PAN NOREN
31US10923370B2Transport system and transport method2021-02-16MURATA MACHINERY LTD
32US10867914B2Printed extendable sensor system2020-12-15UNITED TECHNOLOGIES CORP
33US2020365484A1Fastening unit for connecting thermally stressed components to each other2020-11-19FACHHOCHSCHULE KIEL
34US10825702B2Method and device for self-assembling semiconductor light-emitting diodes2020-11-03LG ELECTRONICS INC
35US10777521B2Printable component structure with electrical contact2020-09-15X DISPLAY COMPANY TECH LTD
36US10735635B2Capturing and processing of images captured by camera arrays incorporating cameras with telephoto and conventional lenses to generate depth maps2020-08-04FOTONATION LTD
37US10685832B1Substrate processing apparatus2020-06-16KOKUSAI ELECTRIC CORP
38US10681851B2Pick and place tooling with adjustable nozzle configuration2020-06-09INTEL CORP
39US2020150789A1Flexible conductive display film2020-05-143M INNOVATIVE PROPERTIES CO
40US10429892B1Electronic devices with thin display housings2019-10-01APPLE INC
41US10403531B2Semiconductor manufacturing apparatus with supporting columns and tables2019-09-03TOSHIBA MEMORY CORP
42US10367080B2Method of forming a germanium oxynitride film2019-07-30ASM IP HOLDING BV
43US10347815B1Piezoelectric strands for tactile sensing2019-07-09X DEV LLC
44US10332747B1Selective titanium nitride deposition using oxides of lanthanum masks2019-06-25GLOBALFOUNDRIES INC
45US10312285B2LED illuminator and method of making the same2019-06-04ROHM CO LTD
46US10290508B1Method for forming vertical spacers for spacer-defined patterning2019-05-14ASM IP HOLDING BV
47US10290240B2Display device2019-05-14LG ELECTRONICS INC
48US10283353B2Method of reforming insulating film deposited on substrate with recess pattern2019-05-07ASM IP HOLDING BV
49US10236197B2Processing system containing an isolation region separating a deposition chamber from a treatment chamber2019-03-19APPLIED MATERIALS INC
50US10217678B2Display device and method of manufacturing the display device2019-02-26INNOLUX CORP
51US10192734B2Short inorganic trisilylamine-based polysilazanes for thin film deposition2019-01-29AIR LIQUIDE ADVANCED MAT INC
52US10189243B2Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion2019-01-29X CELEPRINT LTD
53US10186449B2Apparatus and methods for wafer rotation to improve spatial ALD process uniformity2019-01-22APPLIED MATERIALS INC
54US10158342B1Multiplexer, transmission device, and reception device2018-12-18MURATA MANUFACTURING CO
55US10153140B2Method of installing elastomer ring in semiconductor processing equipment and guiding sheet and jig used in installing elastomer ring2018-12-11MFC SEALING TECH CO LTD
56US10134620B2Robot system and incline detection method2018-11-20YASKAWA ELECTRIC CORP
57US10123453B2Electronic apparatus cooling system2018-11-06EXASCALER INC
58US10121692B2Substrate holding apparatus2018-11-06EBARA CORP
59US10115850B2Roof integrated solar panel system with side mounted micro inverters2018-10-30BUILDING MAT INVESTMENT CORP
60US2018308997A1Plzt thin film capacitors apparatus with enhanced photocurrent and power conversion efficiency and method thereof2018-10-25UNIV ALABAMA
61US2018279520A1Mounting head and surface mounter2018-09-27YAMAHA MOTOR CO LTD
62US2018095265A1Curved display panel adhering device2018-04-05SHENZHEN CHINA STAR OPTOELECT
63US2018076352A1Substrate Features for Enhanced Fluidic Assembly of Electronic Devices2018-03-15SHARP LABORATORIES AMERICA INC
64US9889521B2Method and system for pull testing of wire bonds2018-02-13ASM TECH SINGAPORE PTE LTD
65US9881821B2Control wafer making device and method for measuring and monitoring control wafer2018-01-30TAIWAN SEMICONDUCTOR MFG CO LTD
66US9865602B2Semiconductor devices having bit lines and method of fabricating the same2018-01-09SAMSUNG ELECTRONICS CO LTD
67US9859151B1Selective film deposition method to form air gaps2018-01-02ASM IP HOLDING BV
68US9799736B1High acceptor level doping in silicon germanium2017-10-24IBM
69US9799635B2Light-emitting apparatus2017-10-24CITIZEN ELECTRONICS
70US9761754B2Systems and methods for preparing GaN and related materials for micro assembly2017-09-12X CELEPRINT LTD
71US9741847B2Methods of forming a contact structure for a vertical channel semiconductor device and the resulting device2017-08-22GLOBALFOUNDRIES INC
72US9735131B2Multi-stack package-on-package structures2017-08-15TAIWAN SEMICONDUCTOR MFG CO LTD
73US9640715B2Printable inorganic semiconductor structures2017-05-02X CELEPRINT LTD
74US9601693B1Method for encapsulating a chalcogenide material2017-03-21LAM RES CORP
75US9588443B2Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method2017-03-07NIKON CORP
76US9581839B2Method of manufacturing display device and manufacturing apparatus for the same2017-02-28SAMSUNG DISPLAY CO LTD
77US9548231B2Robot and adaptive placement system and method2017-01-17PERSIMMON TECHNOLOGIES CORP
78US9543178B2Semiconductor wafer stocker apparatus and wafer transferring methods using the same2017-01-10SAMSUNG ELECTRONICS CO LTD
79US9525262B2Slab laser and amplifier and method of use2016-12-20STUART MARTIN A
80US9517929B2Method of fabricating electromechanical microchips with a burst ultrafast laser pulses2016-12-13ROFIN-SINAR TECH INC
81US9508667B2Formation of solder and copper interconnect structures and associated techniques and configurations2016-11-29INTEL CORP
82US9484233B2Carousel reactor for multi-station, sequential processing systems2016-11-01NOVELLUS SYSTEMS INC
83US9450086B2Semiconductor device2016-09-20RENESAS ELECTRONICS CORP
84US9373530B2Tool for picking a planar object from a supply station2016-06-21SCHMIDT-LANGE MICHAEL
85US2016163561A1Technique to deposit sidewall passivation for high aspect ratio cylinder etch2016-06-09LAM RES CORP
86US9281277B2Methods of forming wiring structures2016-03-08SAMSUNG ELECTRONICS CO LTD
87US9281254B2Methods of forming integrated circuit package2016-03-08TAIWAN SEMICONDUCTOR MFG
88US9263309B2Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator2016-02-16FLITSCH FREDERICK A
89US9169858B2Fastening structure for thermal module2015-10-27ASIA VITAL COMPONENTS CO LTD
90US9117940B2Optical systems fabricated by printing-based assembly2015-08-25UNIV ILLINOIS
91US9111975B2Loading mechanism2015-08-18LI BING
92US2015179640A1Common fabrication of different semiconductor devices with different threshold voltages2015-06-25GLOBALFOUNDRIES INC
93US8807905B2Linear semiconductor processing facilities2014-08-19MEULEN PETER VAN DER
94US8773857B2Heat sink mounting device2014-07-08YANG CHIH-HAO
95US8748780B2Substrate processing apparatus, substrate processing method, and computer-readable storage medium2014-06-10MORO SHOUKEN
96US8710580B2Semiconductor device and method of manufacturing the same2014-04-29SAKUMA KIWAMU
97US2014105716A1Apparatus for transferring substrates2014-04-17TES CO LTD
98US2014004710A1Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device2014-01-02SAKATA MASAKAZU

98 records in this listing. Patents full text (MLC-0201). Request the full dataset.