Display device using micro-LED, and manufacturing method therefor

{
  "publication_number": "US12230617B2",
  "country": "US",
  "kind": "B2",
  "title": "Display device using micro-LED, and manufacturing method therefor",
  "abstract": "A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.",
  "claims": [
    "1. A method for manufacturing a display device, the method comprising: forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining at least one assembly groove in the partition wall; providing at least one light emitting diode (LED) having an assembly face corresponding to a shape of the at least one assembly groove in the partition wall; and assembling the assembly face of the at least one LED into the at least one assembly groove in the partition wall, wherein the at least one LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure, wherein two opposing sides of the at least one LED are formed to have at least two longitudinal lengths, creating two flat assembly faces that correspond to a bottom surface of the at least one assembly groove, and wherein the at least one LED is seated in the at least one assembly groove using one of the two flat assembly faces formed on the two opposing sides, and the at least one assembly groove is configured to accommodate a single LED.",
    "2. The method of claim 1, wherein the assembling the assembly face of the at least one LED into the at least one assembly groove includes: contacting the assembly face of the at least one LED to the at least one assembly groove using an assembly device having a magnetic body; and assembling the assembly face of the at least one LED into the at least one assembly groove based on an electric field applied through the assembly electrode formed on the substrate.",
    "3. The method of claim 1, wherein the forming the assembly electrode on the substrate includes: forming a plurality of assembly electrode portions spaced apart from each other to respectively overlap portions of the partition wall that are disposed on opposite sides of the at least one assembly groove, or forming a single assembly electrode portion to overlap a bottom face of the at least one assembly groove.",
    "4. The method of claim 1, wherein the first semiconductor layer is an N-type GaN layer, and the second semiconductor layer is a P-type GaN layer.",
    "5. The method of claim 1, wherein the at least one LED includes a magnetic layer.",
    "6. The method of claim 1, wherein the substrate contains at least one of glass, a conductor, or flexible polymer materials.",
    "7. The method of claim 1, wherein the defining the at least one assembly groove includes: forming a polymer adhesive layer on at least a portion of a bottom face of the at least one assembly groove for seating the assembly face of the at least one LED on the polymer adhesive layer.",
    "8. The method of claim 1, wherein the defining the at least one assembly groove includes: forming a metal reflective film on at least a portion of a bottom face of the at least one assembly groove for seating the active layer of the at least one LED on the metal reflective film.",
    "9. The method of claim 1, further comprising: simultaneously forming wiring electrodes electrically connected to the first electrode and the second electrode of the at least one LED, respectively.",
    "10. The method of claim 1, wherein the at least one LED is a micro-LED having a micrometer size.",
    "11. The method of claim 1, wherein the substrate is equipped with a transistor for active matrix driving.",
    "12. The method of claim 1, wherein the at least one LED includes one of a red LED, a green LED, and a blue LED, wherein shapes of assembly faces of the red LED, green LED, and blue LED are formed differently from one another, and wherein shapes of assembly grooves for the red LED, green LED, and blue LED are formed according to the shapes of the assembly faces of the red LED, green LED, and blue LED, respectively.",
    "13. A display device comprising: an assembly electrode disposed on a substrate; an insulating layer disposed on the assembly electrode; a partition wall disposed on the insulating layer; at least one assembly groove in the partition wall; and at least one light emitting diode (LED) assembled in the at least one assembly groove in the partition wall, wherein the at least one LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure, and wherein two opposing sides of the at least one LED are formed to have at least two longitudinal lengths, creating two flat assembly faces that correspond to a bottom surface of the assembly groove, and wherein the at least one LED is seated in the assembly groove using one of the two flat assembly faces formed on the two opposing sides, and the assembly groove is configured to accommodate a single LED.",
    "14. The display device of claim 13, wherein layers of the stacked structure of the at least one LED are perpendicular to a bottom surface of the at least one assembly groove.",
    "15. The display device of claim 13, wherein the assembly face has a shape substantially identical to a shape of the at least one assembly groove.",
    "16. The display device of claim 13, wherein the at least one LED includes one of a red LED, a green LED, and a blue LED, wherein shapes of assembly faces of the red LED, green LED, and blue LED are formed differently from one another, and wherein shapes of assembly grooves for the red LED, green LED, and blue LED are formed according to the shapes of the assembly faces of the red LED, green LED, and blue LED, respectively."
  ],
  "description_excerpt": "The present disclosure is applicable to a display device-related technical field, and relates, for example, to a display device using a micro LED (light emitting diode) and a method for manufacturing the same.\n\nRecently, in a field of a display technology, display devices having excellent characteristics such as thinness, flexibility, and the like have been developed. On the other hand, currently commercialized major displays are represented by a LCD (liquid crystal display) and an OLED (organic light emitting diode).\n\nHowever, the LCD has a response time that is not fast, and is difficult to be flexibly implemented.\n\nOn the other hand, LED (light emitting diode), which is a well-known semiconductor light-emitting element that converts electric current into light, has been used as a light source for a display image of an electronic device including an information and communication device along with a GaP:N-based green LED, starting with commercialization of a red LED using a GaAsP compound semiconductor in 1962. Accordingly, a method for solving the above-described problems by implementing a display using the semiconductor light-emitting element may be proposed. Such light emitting diode has various advantages, such as long lifespan, low power consumption, excellent initial driving characteristics, high vibration resistance, and the like, compared to a filament-based light-emitting element.",
  "cpc": [
    "H10W 90/00",
    "H01L 2224/24051",
    "H01L 2224/24105",
    "H01L 2224/24147",
    "H01L 2224/29006",
    "H01L 2224/32013",
    "H01L 2224/32058",
    "H01L 2224/32148",
    "H01L 2224/73204",
    "H01L 2224/83201",
    "H01L 2224/95101",
    "H01L 2224/95133",
    "H01L 2224/95136",
    "H01L 24/24",
    "H01L 24/29",
    "H01L 24/32",
    "H01L 24/73",
    "H01L 24/83",
    "H01L 24/95",
    "H01L 25/167",
    "H01L 27/1259",
    "H01L 33/0093",
    "H01L 33/20",
    "H01L 33/32",
    "H10D 86/021",
    "H10H 20/018",
    "H10H 20/819",
    "H10H 20/825",
    "H10H 20/84",
    "H10H 29/03",
    "H10W 70/60",
    "H10W 70/6523",
    "H10W 72/0198",
    "H10W 72/07332",
    "H10W 72/07352",
    "H10W 72/07353",
    "H10W 72/321",
    "H10W 72/334",
    "H10W 74/15",
    "H10W 90/22",
    "H10W 90/732"
  ],
  "ipc": [
    "H01L 27/12",
    "H01L 33/00",
    "H01L 23/00",
    "H01L 25/16"
  ],
  "assignees": [
    "LG Electronics Inc"
  ],
  "inventors": [
    "Bongchu Shim",
    "Dohee Kim",
    "Yongil SHIN",
    "Dohwan YANG"
  ],
  "filing_date": "2019-06-11",
  "publication_date": "2025-02-18",
  "grant_date": "2025-02-18",
  "priority_date": "2019-06-11",
  "application_number": "US-201917616125-A",
  "family_id": "73781270",
  "cited_by_count": 2,
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}