Patents full text · MLC-0201
CPC subclass H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by class H10
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US12230617B2 | Display device using micro-LED, and manufacturing method therefor | 2025-02-18 | LG ELECTRONICS INC |
| 2 | US12185575B2 | Display device | 2024-12-31 | LG DISPLAY CO LTD |
| 3 | US11498779B2 | Adsorption device, method for making same, and transferring system having same | 2022-11-15 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 4 | US11469132B2 | Method of aligning micro light emitting element and display transferring structure | 2022-10-11 | SAMSUNG ELECTRONICS CO LTD |
| 5 | US11398461B2 | Electronic device | 2022-07-26 | LG ELECTRONICS INC |
| 6 | US11387163B2 | Scalable debris-free socket loading mechanism | 2022-07-12 | INTEL CORP |
| 7 | US11088326B2 | Substrate for use in manufacturing display device and method for forming element on substrate | 2021-08-10 | SAMSUNG DISPLAY CO LTD |
| 8 | US11088182B2 | Method for transferring light emitting elements, display panel, method for making display panel, and substrate | 2021-08-10 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 9 | US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | 2021-03-30 | PALO ALTO RES CT INC |
| 10 | US10926485B2 | Light generating microcapsules for photo-curing | 2021-02-23 | IBM |
| 11 | US10867914B2 | Printed extendable sensor system | 2020-12-15 | UNITED TECHNOLOGIES CORP |
| 12 | US2020365484A1 | Fastening unit for connecting thermally stressed components to each other | 2020-11-19 | FACHHOCHSCHULE KIEL |
| 13 | US10825702B2 | Method and device for self-assembling semiconductor light-emitting diodes | 2020-11-03 | LG ELECTRONICS INC |
| 14 | US10777521B2 | Printable component structure with electrical contact | 2020-09-15 | X DISPLAY COMPANY TECH LTD |
| 15 | US10312285B2 | LED illuminator and method of making the same | 2019-06-04 | ROHM CO LTD |
| 16 | US10290508B1 | Method for forming vertical spacers for spacer-defined patterning | 2019-05-14 | ASM IP HOLDING BV |
| 17 | US10217678B2 | Display device and method of manufacturing the display device | 2019-02-26 | INNOLUX CORP |
| 18 | US10189243B2 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | 2019-01-29 | X CELEPRINT LTD |
| 19 | US10158342B1 | Multiplexer, transmission device, and reception device | 2018-12-18 | MURATA MANUFACTURING CO |
| 20 | US10152097B1 | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function | 2018-12-11 | ADATA TECH CO LTD |
| 21 | US10123453B2 | Electronic apparatus cooling system | 2018-11-06 | EXASCALER INC |
| 22 | US2018076352A1 | Substrate Features for Enhanced Fluidic Assembly of Electronic Devices | 2018-03-15 | SHARP LABORATORIES AMERICA INC |
| 23 | US9889521B2 | Method and system for pull testing of wire bonds | 2018-02-13 | ASM TECH SINGAPORE PTE LTD |
| 24 | US9881821B2 | Control wafer making device and method for measuring and monitoring control wafer | 2018-01-30 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 25 | US9865602B2 | Semiconductor devices having bit lines and method of fabricating the same | 2018-01-09 | SAMSUNG ELECTRONICS CO LTD |
| 26 | US9859151B1 | Selective film deposition method to form air gaps | 2018-01-02 | ASM IP HOLDING BV |
| 27 | US9799635B2 | Light-emitting apparatus | 2017-10-24 | CITIZEN ELECTRONICS |
| 28 | US9761754B2 | Systems and methods for preparing GaN and related materials for micro assembly | 2017-09-12 | X CELEPRINT LTD |
| 29 | US9741847B2 | Methods of forming a contact structure for a vertical channel semiconductor device and the resulting device | 2017-08-22 | GLOBALFOUNDRIES INC |
| 30 | US9735131B2 | Multi-stack package-on-package structures | 2017-08-15 | TAIWAN SEMICONDUCTOR MFG CO LTD |
| 31 | US9640715B2 | Printable inorganic semiconductor structures | 2017-05-02 | X CELEPRINT LTD |
| 32 | US9601693B1 | Method for encapsulating a chalcogenide material | 2017-03-21 | LAM RES CORP |
| 33 | US9517929B2 | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses | 2016-12-13 | ROFIN-SINAR TECH INC |
| 34 | US9508667B2 | Formation of solder and copper interconnect structures and associated techniques and configurations | 2016-11-29 | INTEL CORP |
| 35 | US9281277B2 | Methods of forming wiring structures | 2016-03-08 | SAMSUNG ELECTRONICS CO LTD |
| 36 | US9281254B2 | Methods of forming integrated circuit package | 2016-03-08 | TAIWAN SEMICONDUCTOR MFG |
| 37 | US9169858B2 | Fastening structure for thermal module | 2015-10-27 | ASIA VITAL COMPONENTS CO LTD |
| 38 | US9117940B2 | Optical systems fabricated by printing-based assembly | 2015-08-25 | UNIV ILLINOIS |
| 39 | US8773857B2 | Heat sink mounting device | 2014-07-08 | YANG CHIH-HAO |
| 40 | US2012218803A1 | Memeory device interface methods, apparatus, and systems | 2012-08-30 | JEDDELOH JOE M |
| 41 | US8241991B2 | Method for forming interconnect structure having airgap | 2012-08-14 | HSIEH JULIAN J |
| 42 | US2012170217A1 | Power Inverter | 2012-07-05 | NISHIKIMI FUSANORI |
| 43 | US2012032311A1 | Multi component dielectric layer | 2012-02-09 | GATES STEPHEN M |
| 44 | US8076230B2 | Method of forming self-aligned contacts and local interconnects | 2011-12-13 | WEI AN CHYI |
| 45 | US2011263115A1 | Nmos metal gate materials, manufacturing methods, and equipment using cvd and ald processes with metal based precursors | 2011-10-27 | APPLIED MATERIALS INC |
| 46 | US7982296B2 | Methods and devices for fabricating and assembling printable semiconductor elements | 2011-07-19 | UNIV ILLINOIS |
| 47 | US2011121181A1 | Infrared Proximity Sensor Package with Improved Crosstalk Isolation | 2011-05-26 | AVAGO TECHNOLOGIES ECBU SINGAPORE PTE LTD |
| 48 | US7932123B2 | Release strategies for making transferable semiconductor structures, devices and device components | 2011-04-26 | UNIV ILLINOIS |
| 49 | US2011057108A1 | Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate | 2011-03-10 | AVAGO TECHNOLOGIES ECBU SINGAPORE PTE LTD |
| 50 | US2010270675A1 | Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate | 2010-10-28 | OKI SEMICONDUCTOR CO LTD |
| 51 | US2010213594A1 | Semiconductor device and a manufacturing method of the same | 2010-08-26 | RENESAS TECH CORP |
| 52 | US7727880B1 | Protective self-aligned buffer layers for damascene interconnects | 2010-06-01 | NOVELLUS SYSTEMS INC |
| 53 | US2009095956A1 | Single-crystal silicon substrate, soi substrate, semiconductor device, display device, and manufacturing method of semiconductor device | 2009-04-16 | TAKAFUJI YUTAKA |
| 54 | US7511382B2 | Semiconductor chip arrangement and method | 2009-03-31 | INFINEON TECHNOLOGIES AG |
| 55 | US2009059530A1 | Bolster plate assembly for printed circuit board | 2009-03-05 | HONGFUJIN PREC IND SHENZHEN |
| 56 | US2006151203A1 | Encapsulated electronic component and production method | 2006-07-13 | KRUEGER HANS |
| 57 | US2005117307A1 | Electronic apparatus | 2005-06-02 | |
| 58 | US2004241981A1 | Structure and method to fabricate ultra-thin si channel devices | 2004-12-02 | IBM |
| 59 | US6780773B2 | Method of chemical mechanical polishing with high throughput and low dishing | 2004-08-24 | APPLIED MATERIALS INC |
| 60 | US6749890B2 | Terminal electrode forming method in chip-style electronic component and apparatus therefor | 2004-06-15 | TDK CORP |
| 61 | US6717256B1 | Mounting structure for semiconductor device having entirely flat leads | 2004-04-06 | ROHM CO LTD |
| 62 | US6683663B1 | Web fabrication of devices | 2004-01-27 | ALIEN TECHNOLOGY CORP |
| 63 | US6677185B2 | Method of affixing a heat sink to a substrate and package thereof | 2004-01-13 | ORIENT SEMICONDUCTOR ELECT LTD |
| 64 | US6664129B2 | Integrated circuits and methods for their fabrication | 2003-12-16 | TRI SI TECHNOLOGIES INC |
| 65 | US6636313B2 | Method of measuring photoresist and bump misalignment | 2003-10-21 | TAIWAN SEMICONDUCTOR MFG |
| 66 | US6623911B1 | Method to form code marks on mask ROM products | 2003-09-23 | TAIWAN SEMICONDUCTOR MFG |
| 67 | US6568863B2 | Platform and optical module, method of manufacture thereof, and optical transmission device | 2003-05-27 | SEIKO EPSON CORP |
| 68 | US6556065B1 | 256 Meg dynamic random access memory | 2003-04-29 | MICRON TECHNOLOGY INC |
| 69 | US6534395B2 | Method of forming graded thin films using alternating pulses of vapor phase reactants | 2003-03-18 | ASM MICROCHEMISTRY OY |
| 70 | US6489793B2 | Temperature control of electronic devices using power following feedback | 2002-12-03 | DELTA DESIGN INC |
| 71 | US6473305B1 | Fastening system and method of retaining temperature control devices used on semiconductor dies | 2002-10-29 | INTEL CORP |
| 72 | US6467673B2 | Bonding apparatus and bonding method | 2002-10-22 | SHINKAWA KK |
| 73 | US6436251B2 | Vault-shaped target and magnetron having both distributed and localized magnets | 2002-08-20 | APPLIED MATERIALS INC |
| 74 | US6424028B1 | Semiconductor devices configured to tolerate connection misalignment | 2002-07-23 | KONINKL PHILIPS ELECTRONICS NV |
| 75 | US6410463B1 | Method for forming film with low dielectric constant on semiconductor substrate | 2002-06-25 | ASM JAPAN |
| 76 | US6391166B1 | Plating apparatus and method | 2002-05-21 | ACM RES INC |
| 77 | US6300673B1 | Edge connectable metal package | 2001-10-09 | ADVANCED INTERCONNECT TECH LTD |
| 78 | US6287964B1 | Method for forming a metallization layer of a semiconductor device | 2001-09-11 | HYUNDAI ELECTRONICS IND |
| 79 | US6274496B1 | Method for single chamber processing of PECVD-Ti and CVD-TiN films for integrated contact/barrier applications in IC manufacturing | 2001-08-14 | TOKYO ELECTRON LTD |
| 80 | US6160696A | Modular bus bar and switch assembly for traction inverter | 2000-12-12 | GEN ELECTRIC |
| 81 | US6140405A | Salt-modified electrostatic dissipative polymers | 2000-10-31 | GOODRICH CO B F |
| 82 | US6136128A | Method of making an adhesive preform lid for electronic devices | 2000-10-24 | AMERASIA INT TECHNOLOGY INC |
| 83 | US6103616A | Method to manufacture dual damascene structures by utilizing short resist spacers | 2000-08-15 | ADVANCED MICRO DEVICES INC |
| 84 | US6071819A | Flexible skin incorporating mems technology | 2000-06-06 | CALIFORNIA INST OF TECHN |
| 85 | US6043132A | Method for forming HSG silicon film of semiconductor device | 2000-03-28 | SAMSUNG ELECTRONICS CO LTD |
| 86 | US6030881A | High throughput chemical vapor deposition process capable of filling high aspect ratio structures | 2000-02-29 | NOVELLUS SYSTEMS INC |
| 87 | US6021045A | Heat sink assembly with threaded collar and multiple pressure capability | 2000-02-01 | CHIP COOLERS INC |
| 88 | US6004839A | Semiconductor device with conductive plugs | 1999-12-21 | NEC CORP |
| 89 | US5760476A | Interconnect run between a first point and a second point in a semiconductor device for reducing electromigration failure | 1998-06-02 | MOTOROLA INC |
| 90 | US5748446A | Heat sink support | 1998-05-05 | INTEL CORP |
| 91 | US5723028A | Electrodeposition apparatus with virtual anode | 1998-03-03 | |
| 92 | US5655704A | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component | 1997-08-12 | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD |
| 93 | US5648123A | Process for producing a strong bond between copper layers and ceramic | 1997-07-15 | HOECHST AG |
| 94 | US5561325A | Mounting structure and fastener for heat sink | 1996-10-01 | FUJITSU LTD |
| 95 | US5504042A | Porous dielectric material with improved pore surface properties for electronics applications | 1996-04-02 | TEXAS INSTRUMENTS INC |
| 96 | US5491610A | Electronic package having active means to maintain its operating temperature constant | 1996-02-13 | IBM |
| 97 | US5476810A | Manufacture of electronic devices comprising thin-film circuits using a metal foil as a temporary support | 1995-12-19 | PHILIPS CORP |
| 98 | US5475564A | CPU heat sink holding-down device | 1995-12-12 | |
| 99 | US5420752A | GPT system for encapsulating an integrated circuit package | 1995-05-30 | LSI LOGIC CORP |
| 100 | US5368643A | Coating apparatus for boards | 1994-11-29 | CIBA GEIGY CORP |
111 records in this listing. Patents full text (MLC-0201). Request the full dataset.