Method for binding micro device to conductive pad

{
  "publication_number": "US10141475B1",
  "country": "US",
  "kind": "B1",
  "title": "Method for binding micro device to conductive pad",
  "abstract": "A method for binding a micro device to a conductive pad of an array substrate is provided. The method includes: forming a liquid layer on the conductive pad of the array substrate; disposing the micro device over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, wherein the micro device comprises an electrode facing the conductive pad; and evaporating the liquid layer such that the electrode is bound to and is in electrical contact with the conductive pad.",
  "claims": [
    "1. A method for binding a micro device to a conductive pad of an array substrate, the method comprising: lowering a temperature of the conductive pad in an environment comprising a vapor such that at least a portion of the vapor is condensed to form a liquid layer on the conductive pad; disposing the micro device over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, wherein the micro device comprises an electrode facing the conductive pad; and evaporating the liquid layer such that the electrode is bound to and is in electrical contact with the conductive pad.",
    "2. The method of claim 1, wherein the liquid layer comprises water.",
    "3. The method of claim 1, wherein the liquid layer comprises water.",
    "4. The method of claim 3, wherein the temperature of the conductive pad is lowered to about the water dew point.",
    "5. The method of claim 1, wherein evaporating the liquid layer comprises: raising a temperature of the conductive pad such that the electrode is stuck to the conductive pad after the liquid layer is evaporated.",
    "6. The method of claim 1, wherein at least one of the conductive pad and the electrode comprises a bonding material; further comprising: raising a temperature of the conductive pad to be above a melting point of the bonding material after evaporating the liquid layer.",
    "7. The method of claim 1, further comprising: raising a temperature of the conductive pad to be above an eutectic point of the conductive pad and the electrode after evaporating the liquid layer.",
    "8. The method of claim 1, wherein a thickness of the liquid layer is less than a thickness of the micro device when the micro device is gripped by the capillary force.",
    "9. A structure formed by the method of claim 1, the structure comprising: the array substrate comprising the conductive pad; and the micro device comprising the electrode bound to and in electrical contact with the conductive pad.",
    "10. The structure of claim 9, wherein the micro device is a vertical type light emitting diode.",
    "11. The structure of claim 9, wherein the micro device is a vertical-cavity surface-emitting laser.",
    "12. The structure of claim 9, wherein a plurality of the conductive pads are arranged on the array substrate, are spaced apart from each other, and are electrically independent from each other, and the micro device comprises a plurality of the electrodes respectively bond to and in electrical contact with the conductive pads.",
    "13. The structure of claim 12, wherein the micro device is a flip chip type light emitting diode.",
    "14. The structure of claim 12, wherein the electrodes of the micro device are substantially coplanar.",
    "15. The structure of claim 12, wherein the micro device is a vertical type light emitting diode.",
    "16. The structure of claim 12, wherein the micro device is a vertical-cavity surface-emitting laser."
  ],
  "description_excerpt": "Field of Invention\n\nThe present disclosure relates to a method for binding a micro device to at least one conductive pad.\n\nDescription of Related Art\n\nIn the recent years, light-emitting diodes (LEDs) have become popular in general and commercial lighting applications. As light sources, LEDs have many advantages including low energy consumption, long lifetime, small size, and fast switching, and hence conventional lighting, such as incandescent lighting, is gradually replaced by LED lights.\n\nAccording to some embodiments of the present disclosure, a method for binding a micro device to a conductive pad of an array substrate is provided. The method includes: forming a liquid layer on the conductive pad of the array substrate; disposing the micro device over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, wherein the micro device comprises an electrode facing the conductive pad; and evaporating the liquid layer such that the electrode is bound to and is in electrical contact with the conductive pad.\n\nAccording to some embodiments of the present disclosure, a structure formed by the method for binding a micro device to a conductive pad of an array substrate is provided. The structure includes an array substrate including the conductive pad; and a micro device including the electrode bound to and in electrical contact with the conductive pad.",
  "cpc": [
    "H10H 20/01",
    "H01L 24/03",
    "H01L 24/04",
    "H01L 24/05",
    "H01L 24/06",
    "H01L 33/005",
    "H01L 33/36",
    "H01L 33/62",
    "H01S 5/0216",
    "H01S 5/183",
    "H10H 20/036",
    "H10H 20/0364",
    "H10H 20/83",
    "H10H 20/8506",
    "H10H 20/857",
    "H10W 72/013",
    "H10W 72/019",
    "H10W 72/07211",
    "H10W 72/07236",
    "H10W 72/07304",
    "H10W 72/07311",
    "H10W 72/07336",
    "H10W 72/077",
    "H10W 72/29",
    "H10W 72/59",
    "H10W 72/90",
    "H10W 90/724"
  ],
  "ipc": [
    "H01L 23/00",
    "H01L 33/00",
    "H01L 33/36",
    "H01L 33/62",
    "H01S 5/02",
    "H01S 5/183"
  ],
  "assignees": [
    "Mikro Mesa Technology Co Ltd"
  ],
  "inventors": [
    "Li-Yi Chen"
  ],
  "filing_date": "2017-12-24",
  "publication_date": "2018-11-27",
  "grant_date": "2018-11-27",
  "priority_date": "2017-12-24",
  "application_number": "US-201715853839-A",
  "family_id": "64315601",
  "cited_by_count": 14,
  "citations": [
    "US20050194605A1",
    "US20050258438A1",
    "US20120153317A1",
    "US20150179605A1"
  ]
}