Method of handling micro device

{
  "publication_number": "US11335828B2",
  "country": "US",
  "kind": "B2",
  "title": "Method of handling micro device",
  "abstract": "A method of handling a micro device is provided. The method includes: holding the micro device by a transfer head; forming a liquid layer between the micro device and a substrate; maintaining a first temperature of the transfer head to be lower than an environmental temperature; maintaining a second temperature of the substrate to be lower than the environmental temperature; and binding the micro device to the substrate by the liquid layer.",
  "claims": [
    "1. A method of handling a micro device, comprising: holding the micro device by a transfer head; forming a liquid layer on a surface of the micro device opposite to the transfer head; maintaining a first temperature of the transfer head to be lower than an environmental temperature; maintaining a second temperature of a substrate to be lower than the environmental temperature; and moving the transfer head towards the substrate to make the liquid layer be in contact with the substrate after forming the liquid layer.",
    "2. The method of claim 1, wherein the environmental temperature is lower than 40 degree Celsius.",
    "3. The method of claim 1, further comprising: maintaining a relative humidity of an environment to be higher than 40%.",
    "4. The method of claim 1, further comprising: evaporating the liquid layer such that the micro device is bound to the substrate.",
    "5. The method of claim 4, further comprising: separating the transfer head from the micro device after the micro device is bound to the substrate.",
    "6. The method of claim 1, wherein the liquid layer is condensed from water vapor.",
    "7. The method of claim 1, wherein the micro device is microscopic light emitting diode (micro-LED).",
    "8. The method of claim 1, wherein the first temperature is the same as the second temperature.",
    "9. The method of claim 1, wherein the first temperature is different from the second temperature."
  ],
  "description_excerpt": "The present disclosure relates to a method of handling a micro device.\n\nThe statements in this section merely provide background information related to the present disclosure and do not necessarily constitute prior art.\n\nTraditional technologies for the transfer of devices include transferring from a transfer wafer to a receiving substrate by wafer bonding. One such implementation is “direct bonding” which involves one bonding stage of an array of devices from a transfer wafer to a receiving substrate, followed by removal of the transfer wafer. Another such implementation is “indirect bonding” which involves two bonding/de-bonding stages. In indirect bonding, a transfer head may pick up an array of devices from a donor substrate, and then bond the array of devices to a receiving substrate, followed by removal of the transfer head.\n\nIn recent years, many researchers and experts have been working hard to overcome those difficulties in making a massive transfer of devices (i.e., transferring millions or tens of millions of devices) feasible for commercial applications. Among those difficulties, how to achieve cost reduction, time efficiency, and yield are three of the key issues in the industry.\n\nAccording to some embodiments of the present disclosure, a method of handling a micro device is provided.",
  "cpc": [
    "H10H 20/01",
    "B32B 38/18",
    "F16B 11/006",
    "H01L 2933/0033",
    "H01L 33/0095",
    "H01L 33/48",
    "H10H 20/036",
    "H10H 20/85",
    "H10P 72/0442",
    "H10P 72/0446",
    "H10W 90/00"
  ],
  "ipc": [
    "B32B 38/18",
    "H01L 33/00",
    "H01L 33/48"
  ],
  "assignees": [
    "Mikro Mesa Technology Co Ltd"
  ],
  "inventors": [
    "Li-Yi Chen"
  ],
  "filing_date": "2019-12-08",
  "publication_date": "2022-05-17",
  "grant_date": "2022-05-17",
  "priority_date": "2019-12-08",
  "application_number": "US-201916706776-A",
  "family_id": "76162667",
  "cited_by_count": 0,
  "citations": [
    "US20040154733A1",
    "US20190252350A1",
    "US10141475B1",
    "US20190252221A1",
    "US10312218B1"
  ]
}