Patents full text · MLC-0201
CPC subclass H10H
Inorganic light-emitting semiconductor devices having potential barriers
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US12230617B2 | Display device using micro-LED, and manufacturing method therefor | 2025-02-18 | LG ELECTRONICS INC |
| 2 | US11498779B2 | Adsorption device, method for making same, and transferring system having same | 2022-11-15 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 3 | US11469132B2 | Method of aligning micro light emitting element and display transferring structure | 2022-10-11 | SAMSUNG ELECTRONICS CO LTD |
| 4 | US11088182B2 | Method for transferring light emitting elements, display panel, method for making display panel, and substrate | 2021-08-10 | CENTURY TECH SHENZHEN CORPORATION LIMITED |
| 5 | US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | 2021-03-30 | PALO ALTO RES CT INC |
| 6 | US10825702B2 | Method and device for self-assembling semiconductor light-emitting diodes | 2020-11-03 | LG ELECTRONICS INC |
| 7 | US10312285B2 | LED illuminator and method of making the same | 2019-06-04 | ROHM CO LTD |
| 8 | US10217678B2 | Display device and method of manufacturing the display device | 2019-02-26 | INNOLUX CORP |
| 9 | US2018076352A1 | Substrate Features for Enhanced Fluidic Assembly of Electronic Devices | 2018-03-15 | SHARP LABORATORIES AMERICA INC |
| 10 | US9799635B2 | Light-emitting apparatus | 2017-10-24 | CITIZEN ELECTRONICS |
| 11 | US9761754B2 | Systems and methods for preparing GaN and related materials for micro assembly | 2017-09-12 | X CELEPRINT LTD |
| 12 | US9640715B2 | Printable inorganic semiconductor structures | 2017-05-02 | X CELEPRINT LTD |
| 13 | US9117940B2 | Optical systems fabricated by printing-based assembly | 2015-08-25 | UNIV ILLINOIS |
| 14 | US8334152B2 | Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate | 2012-12-18 | SPEIER INGO |
| 15 | US7982296B2 | Methods and devices for fabricating and assembling printable semiconductor elements | 2011-07-19 | UNIV ILLINOIS |
| 16 | US7932123B2 | Release strategies for making transferable semiconductor structures, devices and device components | 2011-04-26 | UNIV ILLINOIS |
| 17 | US6717256B1 | Mounting structure for semiconductor device having entirely flat leads | 2004-04-06 | ROHM CO LTD |
| 18 | US6165809A | Method of fabricating light emitting diodes | 2000-12-26 | SHARP KK |
| 19 | US5265792A | Light source and technique for mounting light emitting diodes | 1993-11-30 | HEWLETT PACKARD CO |
19 records in this listing. Patents full text (MLC-0201). Request the full dataset.