Adsorption device, transferring system having same, and transferring method using same

{
  "publication_number": "US11676840B2",
  "country": "US",
  "kind": "B2",
  "title": "Adsorption device, transferring system having same, and transferring method using same",
  "abstract": "A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.",
  "claims": [
    "1. A transferring method operatively associated with an adsorption device, the method comprising: providing the adsorption device, wherein the adsorption device comprises: a magnetic plate, a surface of the magnetic plate having a first region and a plurality of second regions spaced apart from each other, the first region and each of the plurality of second regions not overlapping with each other, the first region forming a magnetic pole of the magnetic plate, and each of the plurality of second regions forming a magnetic pole opposite to the magnetic pole of the first region; and a limiting layer on the surface of the magnetic plate, the limiting layer covering the first region, each of the plurality of second regions being exposed to the limiting layer, wherein each of the plurality of second regions is configured for adsorbing a target object; attaching and holding a plurality of light emitting diodes (LEDs) by the plurality of second regions of the adsorption device; providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate until each of the plurality of LEDs held by the adsorption device directly in contact with one of the plurality of spots of anisotropic conductive adhesive on the target substrate; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving the adsorption device away from the target substrate.",
    "2. The method of claim 1, wherein each of the plurality of LEDs is partially covered with a magnetic layer.",
    "3. The method of claim 2, further comprising removing the magnetic layer from each of the plurality of LEDs after the plurality of LEDs is detached from the adsorption device and attached to the target substrate.",
    "4. The method of claim 1, wherein the magnetic layer is made of invar alloy.",
    "5. The method of claim 1, wherein the plurality of spots of anisotropic conductive adhesive on the target substrate is thermally cured.",
    "6. The method of claim 1, wherein the plurality of spots of anisotropic conductive adhesive on the target substrate is UV-cured.",
    "7. The method of claim 1, wherein the attaching and holding a plurality of LEDs comprises attracting and holding one of the plurality of LEDs by each of the plurality of second regions of the adsorption device.",
    "8. The method of claim 1, wherein the limiting layer defines a plurality of through holes each extending through the limiting layer; each of the plurality of second regions is exposed to the limiting layer by the plurality of through holes.",
    "9. The method of claim 8, wherein the target object adsorbed by each of the plurality of second regions is received in each of the plurality of through holes.",
    "10. The method of claim 8, wherein each of the plurality of through holes has a cross-sectional area less than or equal to an area of a corresponding one of the plurality of second regions."
  ],
  "description_excerpt": "The subject matter herein generally relates to a field of manufacturing display panel, and particularly relates to an adsorption device, a transferring system having the adsorption device, and a transferring method using the adsorption device.\n\nIn a manufacturing process of a micro light emitting diode (LED) display device, a large number of LEDs are transferred to a substrate having a circuit. A known method of transferring is to adopt electrostatic attraction, that is, the LEDs to be transferred are held to a transferring substrate by static electricity, then the transferring substrate with the LEDs is moved above the substrate, and the static electricity is removed to make the LEDs drop onto the substrate. However, the electrostatic charge may damage the circuit on the substrate.\n\nTherefore, there is room for improvement in the art.\n\nImplementations of the present technology will now be described, by way of embodiments only, with reference to the attached figures.\n\nFIG. 1 is an isometric view of an adsorption device according to an embodiment of the present disclosure.\n\nFIG. 2 is an exploded view of the adsorption device of FIG. 1.\n\nFIG. 3 is a cross-sectional view of a transferring system according to an embodiment of the present disclosure.\n\nFIG. 4 is a plan view showing the transferring system of FIG. 3 in a working state.\n\nFIG. 5 is a flowchart showing a transferring method using the adsorption device.\n\nFIG. 6 is a cross-sectional view showing the transferring system in a working state.",
  "cpc": [
    "H10P 72/165",
    "B65G 47/92",
    "H01L 21/67336",
    "H01L 33/00",
    "H10H 20/01",
    "H10H 20/0364",
    "H10H 20/80",
    "H10H 20/857",
    "H10P 72/0446",
    "H10P 72/74",
    "H10P 72/7434",
    "H10W 70/682",
    "H10W 72/0198",
    "H10W 72/073",
    "H10W 72/07304",
    "H10W 72/07331",
    "H10W 72/07338",
    "H10W 72/074",
    "H10W 72/325",
    "H10W 72/354",
    "H10W 90/00"
  ],
  "ipc": [
    "B65G 47/92",
    "H01L 21/673",
    "H01L 33/00"
  ],
  "assignees": [
    "Century Technology Shenzhen Corp Ltd"
  ],
  "inventors": [
    "Po-Liang Chen",
    "Yung-Fu Lin",
    "Hirohisa Tanaka",
    "Yasunori Shimada"
  ],
  "filing_date": "2022-02-21",
  "publication_date": "2023-06-13",
  "grant_date": "2023-06-13",
  "priority_date": "2019-07-05",
  "application_number": "US-202217676372-A",
  "family_id": "68252179",
  "cited_by_count": 0,
  "citations": [
    "US6919581B2",
    "US20130210194A1",
    "CN104115266A",
    "CN105789122A",
    "CN109378370A",
    "US11295971B2",
    "US20220172970A1"
  ]
}