Method and device for transferring components

{
  "publication_number": "US12103787B2",
  "country": "US",
  "kind": "B2",
  "title": "Method and device for transferring components",
  "abstract": "A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate. The components can be transferred selectively by means of bonding means and/or debonding means.",
  "claims": [
    "1. A method for the transfer of components from a sender substrate to a receiver substrate with at least the following steps: i) provision and/or production of the components on the sender substrate, ii) transfer of the components of the sender substrate to the transfer substrate, iii) transfer of the components from the transfer substrate to the receiver substrate, wherein the components can be transferred selectively by means of bonding means and/or debonding means, wherein individual components or a plurality of components are fixed, locally limited, during the transfer in step ii) and step iii) by the bonding means by laser radiation and released, locally limited, during the transfer in step ii) and step iii) by the debonding means by laser radiation.",
    "2. The method according to claim 1, wherein, for the selection, the components are tested at least once by an electrical test for functionality.",
    "3. The method according to claim 1, wherein, during the transfer in step ii), the transfer substrate contacts and/or applies pressure to the components provided on the sender substrate, so that the components are kept in a specific position between the sender substrate and the transfer substrate.",
    "4. The method according to claim 1, wherein, during the transfer in step iii), the components arranged on the transfer substrate contact and/or apply pressure to the receiver substrate, so that the components are held between the transfer substrate and the receiver substrate.",
    "5. The method according to claim 1, wherein a release layer and/or an adhesion layer is applied respectively on the sender substrate and/or the transfer substrate and/or the receiver substrate and/or the components, which layers, through the action of the debonding means and/or the bonding means, change their adhesive properties with respect to the components in an adhesive area.",
    "6. The method according to claim 1, wherein the sender substrate and/or the transfer substrate and/or the receiver substrate are designed permeable for the laser radiation.",
    "7. The method according to claim 1, wherein the transfer substrate comprises fixing elements, which fix the components during the transfer by surface adhesion.",
    "8. The method according claim 7, wherein the fixing elements are made of a polymer material and/or have a design that corresponds with a design of a suction cup.",
    "9. The method according to claim 7, wherein the transfer substrate is deformed during the transfer by mechanical and/or pneumatic means, so that the components are released from the fixing elements and/or fixed by the fixing elements in a manner offset in terms of space and/or time.",
    "10. The method according to claim 1, wherein the transfer substrate is an elastic film.",
    "11. A device for the transfer of components using a method according to claim 1, wherein components can be produced and/or provided on a sender substrate, wherein the components of the sender substrate can be transferred to a transfer substrate, wherein the components can be transferred from the transfer substrate to the receiver substrate, and wherein the transfer of the components to the transfer substrate and/or the receiver substrate can be carried out selectively by the bonding means and/or the debonding means.",
    "12. A light-emitting diode (LED) produced by a method according to claim 1.",
    "13. The light-emitting diode according to claim 12, wherein the light-emitting diode is comprised of a plurality of the components provided by different sender substrates and arranged upon one another and/or beside one another."
  ],
  "description_excerpt": "The invention relates to a method for the transfer of, in particular electronic, components from a sender substrate to a receiver substrate.\n\nThe prior art shows the most diverse methods for transferring a product substrate from one carrier substrate to another carrier substrate. Such carrier exchange processes are mentioned in detail for example in publication WO2011120537A1. In recent years, individual functional components are increasingly being stacked above one another or beside one another. It is of crucial importance here that only those components are transferred which have passed a previous, in particular electrical, test. This thus eliminates the possibility of defective components being transferred.\n\nIt is an object of the present invention, therefore, to provide a method and a device which at least partially eliminate, in particular completely eliminate, the drawbacks stated in the prior art. In particular, it is an object of the present invention to provide an improved method and a device for transferring components from a sender substrate to a receiver substrate. A further object of the present invention is to provide an improved method and a device for the production of a light-emitting diode, with which the individual components are transferred from a sender substrate to a receiver substrate. It is a further object of the present invention to provide a method and a device, with which no defective components or only components with specific properties are transferred to the receiver substrate.",
  "cpc": [
    "B65G 47/52",
    "C23C 14/048",
    "H10H 20/01",
    "H10P 72/0442",
    "H10P 72/0446",
    "H10P 72/74",
    "H10P 72/7402",
    "H10P 72/7414",
    "H10P 72/7428",
    "H10P 72/744",
    "H10P 72/7611",
    "H10P 72/78",
    "H10W 72/019",
    "H10W 72/0198",
    "H10W 72/0711",
    "H10W 72/07141",
    "H10W 72/07178",
    "H10W 72/07183",
    "H10W 72/07236",
    "H10W 72/07307",
    "H10W 72/07321",
    "H10W 72/07323",
    "H10W 72/07335",
    "H10W 72/07336",
    "H10W 72/07337",
    "H10W 72/354",
    "H10W 72/951",
    "H10W 80/00",
    "H10W 80/016",
    "H10W 80/163",
    "H10W 80/165",
    "H10W 80/211",
    "H10W 80/301",
    "H10W 80/312",
    "H10W 80/327",
    "H10W 80/338",
    "H10W 80/341",
    "H10W 90/00",
    "H10W 90/732",
    "H10W 90/734",
    "H10W 90/792",
    "H10W 90/794"
  ],
  "ipc": [
    "B65G 47/52",
    "H01L 21/68",
    "H05K 13/02"
  ],
  "assignees": [
    "EV Group E Thallner GmbH"
  ],
  "inventors": [
    "Jurgen Burggraf"
  ],
  "filing_date": "2020-02-18",
  "publication_date": "2024-10-01",
  "grant_date": "2024-10-01",
  "priority_date": "2020-02-18",
  "application_number": "US-202017795002-A",
  "family_id": "69701162",
  "cited_by_count": 1,
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}