Method of manufacturing display device

{
  "publication_number": "US10937768B2",
  "country": "US",
  "kind": "B2",
  "title": "Method of manufacturing display device",
  "abstract": "A method of manufacturing a display apparatus according to an exemplary embodiment includes the steps of forming a plurality of light emitting diode chips on a first manufacturing substrate, coupling the plurality of the light emitting diode chips onto a second manufacturing substrate, separating the first manufacturing substrate from the plurality of the light emitting diode chips, and transferring the plurality of light emitting diode chips coupled onto the second manufacturing substrate to a substrate including first and second substrate electrodes.",
  "claims": [
    "1. A method of manufacturing a display apparatus, comprising steps of: forming a plurality of light emitting diode chips on a first manufacturing substrate; coupling the plurality of the light emitting diode chips onto a second manufacturing substrate; separating the first manufacturing substrate from the plurality of the light emitting diode chips; transferring the plurality of light emitting diode chips coupled to the second manufacturing substrate to a third manufacturing substrate; separating the second manufacturing substrate from the plurality of light emitting diode chips; transferring the plurality of light emitting diode chips coupled onto the third manufacturing substrate to a substrate including a plurality of first and second substrate electrodes by coupling the plurality of light emitting diode chips to the plurality of first and second substrate electrodes; and separating the third manufacturing substrate from the plurality of light emitting diode chips.",
    "2. The method of manufacturing the display apparatus of claim 1, further comprising the step of irradiating the first manufacturing substrate with a laser to separate the plurality of light emitting diode chips from the first manufacturing substrate while the plurality of light emitting diode chips are coupled to the second manufacturing substrate.",
    "3. The method of manufacturing the display apparatus of claim 1, wherein: the second manufacturing substrate has elasticity, and the transferring step further comprises elongating the second manufacturing substrate along a first direction; and in the step of coupling the plurality of light emitting diode chips to the third manufacturing substrate, the plurality of light emitting diode chips disposed on the elongated second manufacturing substrate are coupled to the third manufacturing substrate.",
    "4. The method of manufacturing the display apparatus of claim 1, wherein an interval of the plurality of light emitting diode chips formed on the first manufacturing substrate is the same as an interval of sub-pixels to which the plurality of light emitting diode chips are to be mounted.",
    "5. The method of manufacturing the display apparatus of claim 1, wherein an interval of the plurality of first and second substrate electrodes is the same as an interval of sub-pixels to which the plurality of light emitting diode chips are to be mounted.",
    "6. The method of manufacturing the display apparatus of claim 1, wherein forming the plurality of light emitting diode chips comprises: forming a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on the first manufacturing substrate; exposing a portion of the first conductivity type semiconductor layer; forming first and second electrodes on the first and second conductivity type semiconductor layers, respectively; forming an encapsulant to cover the first and second electrodes; and forming first and second bumps electrically connected to the first and second electrodes on the encapsulant, respectively.",
    "7. A method of manufacturing a display apparatus, comprising steps of: forming a plurality of light emitting diode chips on a first manufacturing substrate; coupling the plurality of the light emitting diode chips onto a second manufacturing substrate; separating the first manufacturing substrate from the plurality of the light emitting diode chips; and transferring the plurality of light emitting diode chips coupled onto the second manufacturing substrate to a substrate including a plurality of first and second substrate electrodes, wherein the transferring step comprises: absorbing a portion of the plurality of light emitting diode chips coupled to the second manufacturing substrate with a transfer device; performing at least one of heating and ultrasonic-irradiating the second manufacturing substrate so as to separate the portion of the plurality of light emitting diode chips absorbed on the transfer device from the second manufacturing substrate; coupling the portion of the absorbed light emitting diode chips to the substrate; and separating the transfer device from the portion of the plurality of light emitting diode chips coupled to the substrate.",
    "8. The method of manufacturing the display apparatus of claim 7, further comprising the step of irradiating the first manufacturing substrate with a laser to separate the plurality of light emitting diode chips from the first manufacturing substrate while the plurality of light emitting diode chips are coupled to the second manufacturing substrate.",
    "9. The method of manufacturing the display apparatus of claim 7, wherein the transfer device absorbs light emitting diode chips disposed on the second manufacturing substrate at predetermined intervals.",
    "10. The method of manufacturing the display apparatus of claim 7, wherein a heater heats portions of the second manufacturing substrate on which the light emitting diode chips absorbed by the transfer device are disposed.",
    "11. The method of manufacturing the display apparatus of claim 7, wherein the plurality of light emitting diode chips are grown on the first manufacturing substrate.",
    "12. The method of manufacturing the display apparatus of claim 7, wherein the plurality of light emitting diode chips are transferred from outside to the first manufacturing substrate.",
    "13. The method of manufacturing the display apparatus of claim 7, further comprising: coupling a third manufacturing substrate and a fourth manufacturing substrate to the substrate before the transfer device is separated; and separating the third manufacturing substrate from the fourth manufacturing substrate by heating the third manufacturing substrate after the transfer device is separated.",
    "14. The method of manufacturing the display apparatus of claim 13, wherein the second, third, and fourth manufacturing substrates are made of an insulation material.",
    "15. The method of manufacturing the display apparatus of claim 7, wherein the substrate is provided with first substrate electrodes and second substrate electrodes.",
    "16. The method of manufacturing the display apparatus of claim 15, wherein the first substrate electrodes and the second substrate electrodes are disposed on the substrate at predetermined intervals corresponding to the intervals of the light emitting diode chips absorbed by the transfer device.",
    "17. The method of manufacturing the display apparatus of claim 15, wherein each of the light emitting diode chips has an n-type bump and a p-type bump, and the n-type bump and the p-type bump are electrically coupled to corresponding first and second substrate electrodes, respectively."
  ],
  "description_excerpt": "Exemplary embodiments of the present invention relate to a method of manufacturing a display apparatus, and, more particularly, to a method of transferring a light emitting diode chip to a substrate for manufacturing a display apparatus.\n\nA light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes. In recent years, light emitting diodes have been used in various fields including displays, automobile lamps, general lighting, and the like. Light emitting diodes have various advantages, such as longer lifespan, lower power consumption, and quicker response than conventional light sources. As such, light emitting devices using a light emitting diode are replacing existing light sources quickly.\n\nRecent display apparatuses, such as TVs, monitors, or electronic display boards, display colors through a thin film transistor liquid crystal display (TFT-LCD) panel, and employ light emitting diodes as a light source of a backlight unit for emission of the realized colors. Various studies have been conducted to develop a display apparatus capable of displaying colors directly through light emitting diodes, instead of using an LCD.\n\nIn order to use light emitting diodes as a light source of a backlight unit, or for direct realization of colors, one light emitting diode may be provided for each pixel. In this case, in order to control each of the light emitting diodes, an active matrix (AM) drive type or a passive matrix (PM) drive type may be employed.",
  "cpc": [
    "H10W 90/00",
    "H01L 25/075",
    "H01L 2933/0033",
    "H01L 2933/005",
    "H01L 2933/0066",
    "H10H 20/036",
    "H10H 20/0362",
    "H10H 20/0364",
    "H10H 20/85",
    "H10H 20/857",
    "H10P 72/0446",
    "H10P 72/74",
    "H10P 72/7414",
    "H10P 72/7428",
    "H10P 72/7434",
    "H10P 72/744",
    "H10P 72/78"
  ],
  "ipc": [
    "H01L 25/075",
    "H01L 21/00",
    "H01L 33/00"
  ],
  "assignees": [
    "Seoul Semiconductor Co Ltd"
  ],
  "inventors": [
    "Motonobu Takeya"
  ],
  "filing_date": "2018-03-07",
  "publication_date": "2021-03-02",
  "grant_date": "2021-03-02",
  "priority_date": "2017-03-13",
  "application_number": "US-201816489358-A",
  "family_id": "63523649",
  "cited_by_count": 6,
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}