Scalable, high load, low stiffness, and small footprint loading mechanism

{
  "publication_number": "US11449111B2",
  "country": "US",
  "kind": "B2",
  "title": "Scalable, high load, low stiffness, and small footprint loading mechanism",
  "abstract": "A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.",
  "claims": [
    "1. A microprocessor loading mechanism, comprising: a bolster plate surrounding an aperture, the aperture to receive a microprocessor socket; a torsion bar comprising a first end, a second end, and an elongate segment between the first and second ends, the first end directly coupled to the bolster plate; and a stud comprising an opening extending at least partially through the stud in a first direction, wherein the second end of the torsion bar is within the opening, coupled to each of the wherein the stud is to receive a nut in a second direction substantially orthogonal to the first direction to secure a microprocessor package to the microprocessor socket within the aperture via a portion of the microprocessor package being between the nut and the bolster plate, and wherein the stud is secured to the bolster plate by the torsion bar.",
    "2. The microprocessor loading mechanism of claim 1, wherein the first end is directly coupled to the bolster plate by a stub of the first end extending orthogonal to the elongate segment being secured by a tab of the bolster plate.",
    "3. The microprocessor loading mechanism of claim 1, wherein the elongate segment extends outside the stud from the first end to the second end, the second end comprising a curved section and a stub portion within the opening of the stud, the stub portion entering the opening from the curved section opposite the first end.",
    "4. The microprocessor loading mechanism of claim 3, wherein the stub portion is substantially parallel to the elongate segment.",
    "5. The microprocessor loading mechanism of claim 1, wherein the second end is secured to the stud by one of a set screw or a weld.",
    "6. The microprocessor loading mechanism of claim 1, wherein, in a preload state with the nut disengaged from the stud, the second end of the torsion bar is substantially parallel to the bolster plate and, in a loaded state with the nut engaged with the stud, the second end of the torsion bar is at a non-zero angle relative to the bolster plate.",
    "7. The microprocessor loading mechanism of claim 6, wherein, in the loaded state, the stud is suspended above the bolster plate by the second end.",
    "8. The microprocessor loading mechanism of claim 1, wherein the stud is substantially orthogonal to the bolster plate.",
    "9. The microprocessor loading mechanism of claim 1, wherein the elongate segment is substantially parallel to a vertical flange at an edge of the bolster plate.",
    "10. The microprocessor loading mechanism of claim 1, further comprising: a second torsion bar comprising a third end, a fourth end, and a second elongate segment between the third and fourth ends, the third end directly coupled to the bolster plate; and a second stud comprising a second opening extending at least partially through the second stud, wherein the fourth end of the second torsion bar is within the second opening, wherein the stud is at a first corner of the bolster plate, the second stud is at a second corner of the bolster plate.",
    "11. A system, comprising: a microprocessor loading mechanism mounted on a printed circuit board (PCB), the microprocessor loading mechanism comprising: a bolster plate comprising an aperture, wherein a microprocessor socket coupled to the PCB is within the aperture, wherein the bolster plate is coupled to the PCB; a torsion bar comprising a first end, a second end, and an elongate segment between the first and second ends, the first end directly coupled to the bolster plate; and a stud comprising an opening extending at least partially through the stud in a first direction, wherein the second end of the torsion bar is within the opening, wherein the stud engages a nut in a second direction substantially orthogonal to the first direction to secure a microprocessor package to the microprocessor socket within the aperture via a portion of the microprocessor package being between the nut and the bolster plate, and wherein the stud is secured to the bolster plate by the torsion bar; a microprocessor socket within the aperture and coupled to the PCB a microprocessor package seated within the microprocessor socket, wherein the microprocessor package comprises an integrated heat spreader (IHS) on a surface thereof; and a heatsink over the microprocessor, and in thermal contact with the IHS, wherein the heat sink comprises a flange having one or more bolt passage holes, and wherein the stud is received by one of the one or more bolt passage holes.",
    "12. The system of claim 11, wherein a thermal interface material is between the heatsink and the integrated heat spreader.",
    "13. The system of claim 11, wherein the heatsink comprises a base plate, wherein the base plate comprises a heat transfer surface, wherein the microprocessor package is seated within a microprocessor carrier, and wherein the microprocessor carrier is coupled to the base plate such that the IHS is thermally contacted to the heat transfer surface.",
    "14. The system of claim 11, wherein the nut is on the flange, wherein the one or more torsion bars load the heatsink such that the load is distributed over the microprocessor package.",
    "15. The system of claim 11, wherein the PCB is a computer motherboard."
  ],
  "description_excerpt": "Loading of modern land grid array (LGA) microprocessors into sockets requires the application of large loads to ensure that all of the electrical connections between the processor package and the socket contacts are established and stable. As the contact count increases, greater loads are required. Current methods to load a microprocessor on a socket includes a loading mechanism to aid in mounting a microprocessor on a computer motherboard. Current loading mechanisms lack flexibility to accommodate variations in microprocessor z-height variations or may not be capable of generating sufficient loads required for present and future generations of microprocessors.\n\nThe embodiments of the disclosure will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the disclosure, which, however, should not be taken to limit the disclosure to the specific embodiments, but are for explanation and understanding only.\n\nFIG. 1 illustrates an exploded view of an anti-tilt fastener assembly, according to some embodiments of the disclosure.\n\nFIG. 2A illustrates a top oblique view of an assembled anti-tilt base, according to some embodiments of the disclosure.\n\nFIG. 2B illustrates a bottom oblique view of an assembled anti-tilt base, according to some embodiments of the disclosure.\n\nFIG. 3A illustrates an exploded isometric view of an implementation of an anti-tilt fastener assembly, according to some embodiments of the disclosure.",
  "cpc": [
    "G06F 1/183",
    "G06F 1/1658",
    "G06F 1/203",
    "H05K 7/1007",
    "H05K 7/1422",
    "H05K 7/16",
    "H05K 7/183",
    "H10W 40/611",
    "H10W 40/641"
  ],
  "ipc": [
    "H05K 7/20",
    "G06F 1/18",
    "H05K 7/14",
    "H05K 7/16",
    "H05K 7/18",
    "H05K 7/10"
  ],
  "assignees": [
    "Intel Corp"
  ],
  "inventors": [
    "Eric W. Buddrius",
    "Ralph V. Miele",
    "Mohanraj Prabhugoud",
    "David Shia",
    "Jeffory L. Smalley"
  ],
  "filing_date": "2018-03-30",
  "publication_date": "2022-09-20",
  "grant_date": "2022-09-20",
  "priority_date": "2018-03-30",
  "application_number": "US-201815942280-A",
  "family_id": "68056130",
  "cited_by_count": 6,
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}