Electronic apparatus cooling system

{
  "publication_number": "US10123453B2",
  "country": "US",
  "kind": "B2",
  "title": "Electronic apparatus cooling system",
  "abstract": "Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.",
  "claims": [
    "1. A cooling system for directly cooling a plurality of electronic apparatuses through immersion into cooling liquid, the cooling system comprising: a cooling tank having an open space defined by a bottom wall and side walls; a plurality of storage sections defined by a plurality of inner partitioning walls provided within the cooling tank to divide the open space, the storage sections being for storing at least one electronic apparatus in each of the storage sections, the plurality of storage sections arranged in a two-dimensional array; and an inflow opening and an outflow opening for the cooling liquid that are formed at each of the of storage sections; wherein the inflow opening is formed at a bottom portion or a side surface of each of the storage sections and wherein the outflow opening is formed in a vicinity of the liquid level of the cooling liquid flowing through each of the storage sections, and the outflow opening and/or the inflow opening is formed at a position where the plurality of inner partitioning walls defining each storage section intersect with one another.",
    "2. The cooling system according to claim 1, further comprising an outflow pipe piercing through the bottom wall and extending to the vicinity of the liquid level, wherein the outflow opening is formed at one end of the outflow pipe.",
    "3. The cooling system according to claim 2, wherein one or more small holes are formed in a longitudinal direction of the outflow pipe.",
    "4. The cooling system according to claim 1, further comprising an inflow pipe piercing through the bottom wall and extending to the vicinity of the liquid level, wherein the inflow pipe has a plurality of nozzles in a longitudinal direction of the inflow pipe and wherein the inflow opening is formed on each of the plurality of nozzles.",
    "5. The cooling system according to claim 4, wherein the inflow opening includes a plurality of inflow openings, the outflow opening includes a plurality of outflow openings, the cooling tank has an inlet for distributing the cooling liquid toward the inflow openings of respective ones of the storage sections, and an outlet for collecting the cooling liquid passing through the outflow openings of the respective ones of the storage sections; and wherein: the outlet and the inlet are connected through a flow passage existing outside the cooling tank; and at least one pump for moving the cooling liquid and a heat exchanger for cooling the cooling liquid are provided in the flow passage.",
    "6. The cooling system according to claim 5, further comprising a mechanism which, in response to an input signal depending on the temperature variation in each of the storage sections, regulates a flow rate of the cooling liquid passing through the inflow opening of each of the storage sections or a flow rate of the cooling liquid passing through each of the nozzles provided on the inflow pipe.",
    "7. The cooling system according to claim 1, further comprising an inflow pipe and an outflow pipe that pierce through the bottom wall and that extend to the vicinity of the liquid level; wherein: the inflow pipe is provided with a plurality of nozzles in a longitudinal direction of the inflow pipe, and the inflow opening is formed on each of the plurality of nozzles; the outflow opening is formed at an upper end of the output pipe; and the inflow pipe and the outflow pipe are alternately arranged at positions where the plurality of inner partitioning walls defining each of the storage sections intersect with one another.",
    "8. The cooling system according to claim 1, further comprising an inflow pipe and an output pipe that pierce through the bottom wall and that extend to the vicinity of the liquid level; wherein: the inflow pipe is provided with a plurality of nozzles in a longitudinal direction of the inflow pipe, and the inflow opening is formed on each of the plurality of nozzles; the outflow opening is formed at an upper end of the outflow pipe; and the inflow pipe and the outflow pipe constitute a double pipe containing the outflow pipe in the inflow pipe.",
    "9. The cooling system according to claim 8, wherein the double pipe is arranged at a position where the plurality of inner partitioning walls defining each of the storage sections intersect with one another.",
    "10. The cooling system according to claim 1, wherein the cooling liquid contains perfluoride as a main component.",
    "11. The cooling system according to claim 1, wherein the inflow opening includes a plurality of inflow openings, the outflow opening includes a plurality of outflow openings, the cooling tank has an inlet for distributing the cooling liquid toward the inflow openings of respective ones of the storage sections, and an outlet for collecting the cooling liquid passing through the outflow openings of the respective ones of the storage sections; and wherein: the outlet and the inlet are connected through a flow passage existing outside the cooling tank; and at least one pump for moving the cooling liquid and a heat exchanger for cooling the cooling liquid are provided in the flow passage.",
    "12. The cooling system according to claim 1, further comprising a temperature sensor for the cooling liquid provided in each of the storage sections and a mechanism which discontinues an operation of a corresponding one of the electronic apparatuses stored in the respective ones of the storage sections or interrupts the power supply to the electronic apparatus when a predetermined temperature or higher is detected by the temperature sensor.",
    "13. The cooling system according to claim 1, further comprising a temperature sensor provided in each of the electronic apparatuses stored in the respective one of the storage sections, or in a surrounding area of each of the electronic apparatuses stored in the respective one of the storage sections and a mechanism which discontinues an operation of a corresponding one of the electronic apparatuses or interrupts a power supply to the corresponding one of the electronic apparatuses when a predetermined temperature or higher is detected by the temperature sensor."
  ],
  "description_excerpt": "The present invention relates to an electronic apparatus cooling system and particularly, to an electronic apparatus cooling system for efficiently cooling electronic apparatuses such as super computers, data centers and the like that require ultra-high performance operations and stable operations and that have large amounts of heat generated from themselves.\n\nOne of the biggest problems that determine the limitation in performance of supercomputers in recent years is power consumption, and the importance of researches relating to the power-saving capability of supercomputers has already been recognized widely. That is, the speed performance per consumed power (Flops/W) has become one barometer for evaluating the supercomputers. Further, in data centers, it is understood that 45% or so of the power consumption by the whole data centers are consumed for cooling, and therefore, a demand for reduction of the power consumption through improvements in cooling efficiency has become strong.\n\nHeretofore, an air-cooling type and a liquid-cooling type have been in use for cooling supercomputers and data centers. The liquid-cooling type is generally recognized to be high in cooling efficiency because of using a liquid that is remarkably superior to air in heat transfer performance. For example, the “TSUBAME-KFC” built by Tokyo Institute of Technology achieved 4.50 G Flops/W by a liquid immersion cooling system using a synthetic oil and acquired the first place in “Supercomputer Green 500 List” announced on November, 2013 and June, 2014.",
  "cpc": [
    "H05K 7/20236",
    "F24T 10/10",
    "F25D 9/00",
    "F25D 9/005",
    "G06F 1/20",
    "G06F 1/206",
    "G06F 2200/201",
    "H01L 23/44",
    "H01L 23/473",
    "H01L 2924/00",
    "H01L 2924/0002",
    "H05K 7/20",
    "H05K 7/20636",
    "H05K 7/20772",
    "H05K 7/20781",
    "H10W 40/30",
    "H10W 40/47",
    "Y02E 10/10",
    "Y02E 10/12"
  ],
  "ipc": [
    "G06F 1/20",
    "H05K 7/20",
    "H10W 40/30",
    "H10W 40/47",
    "F25D 9/00"
  ],
  "assignees": [
    "Exascaler Inc"
  ],
  "inventors": [
    "Motoaki Saito"
  ],
  "filing_date": "2014-12-05",
  "publication_date": "2018-11-06",
  "grant_date": "2018-11-06",
  "priority_date": "2014-12-05",
  "application_number": "US-201415533348-A",
  "family_id": "56091251",
  "cited_by_count": 6,
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}