Patents full text · MLC-0201
CPC subclass H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by class H10
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 101 | US5343362A | Heat sink assembly | 1994-08-30 | ZYTEC CORP |
| 102 | US5295296A | Method and apparatus for working a clad material | 1994-03-22 | CITIZEN WATCH CO LTD |
| 103 | US5265792A | Light source and technique for mounting light emitting diodes | 1993-11-30 | HEWLETT PACKARD CO |
| 104 | US4918514A | Press-contact type semiconductor device | 1990-04-17 | TOSHIBA KK |
| 105 | US4906494A | Antistatic sheet material, package and method of making | 1990-03-06 | DOW CHEMICAL CO |
| 106 | US4835427A | Three-phase alternator diode heat sink structure | 1989-05-30 | BOSCH GMBH ROBERT |
| 107 | US4321664A | Rectifier assembly with heat sink | 1982-03-23 | BOSCH GMBH ROBERT |
| 108 | US4189653A | Rectifier assembly for rectifying output of alternator for internal combustion engine | 1980-02-19 | HITACHI LTD |
| 109 | US3989164A | Magnetic handling equipment | 1976-11-02 | ITT |
| 110 | US3851899A | Means for sealing fittings and nozzle assemblies at extremely high fluid pressures | 1974-12-03 | FRANZ N |
| 111 | US3688159A | Compression mounted scr clamp with heat sink means | 1972-08-29 | CUTLER HAMMER INC |
111 records in this listing. Patents full text (MLC-0201). Request the full dataset.