Heat sink assembly

{
  "publication_number": "US5343362A",
  "country": "US",
  "kind": "A",
  "title": "Heat sink assembly",
  "abstract": "A heat sink assembly 10 having a component clip 24 for mounting an electronic component 12. The heat sink body 16 includes a planar mounting surface 26 providing flexible positioning for the component 12. The heat sink body 16 is affixed to the circuit board 14 by a mounting rail 20 providing flexible positioning of the heat sink body 16 on the circuit board 14.",
  "claims": [
    "1. A heat sink assembly for mounting an electronic component comprising: a heat sink body, having a planar component mounting surface, and having a rail mounting groove, and having a component, clip mounting channel proximate said planar component mounting surface; a mounting rail positioned within said rail mounting groove, said mounting rail defining a mounting axis; a component clip having a spring arm and having an anchor arm, said anchor arm position in said component clip mounting channel, said spring arm coupled to said anchor arm by a bend; whereby a component placed under said spring arm deflects said bend into contact with a portion of said clip mounting channel causing said bend to act a fulcrum and thereby elastically deflecting said component clip producing a clamping force to hold the component against said planar surface.",
    "2. The heat sink assembly of claim 1 wherein planar surface does not intersect with said mounting axis.",
    "3. The heat sink assembly of claim 1 wherein said component clip further comprises a thrust surface for contacting the electronic component.",
    "4. The heat sink assembly of claim 1 wherein said component clip further comprises a thrust surface for contacting the electronic component, includes a crease for abutting the electronic component, whereby said clamping force is essentially independent of the portion of said crease on the electronic component.",
    "5. The heat sink assembly of claim 1 wherein said anchor arm further comprise an anchor bend formed at the terminal end of said anchor arm.",
    "6. The heat sink assembly of claim 2 wherein said anchor arm further comprises an anchor bend formed at the terminal end of said anchor arm.",
    "7. The heat sink assembly of claim 6 wherein said component clap mounting channel includes a ridge parallel to said mounting axis and contacting a portion of said anchor bend; whereby said anchor bend is elastically deformed by placement of the electronic component under said component clip.",
    "8. A heat sink assembly for mounting an electronic component comprising: a heat sink body, having a planar component mounting surface, and having a rail mounting groove, and having a component clip mounting channel proximate said planar component mounting surface; a mounting rail positioned within said rail mounting groove, said mounting rail defining a mounting axis; a component clip having a spring arm and having an anchor arm, said anchor arm positioned in said component clip mounting channel; said anchor arm further comprise an anchor bend formed at the terminal end of said anchor arm, said spring arm coupled to said anchor arm by a bend; said component clip mounting channel including a ridge parallel to said mounting axis contacting a portion of said anchor bend; whereby an electronic component placed under said spring arm deflects said bend into contact with a portion of said clap mounting channel causing said bend to act a fulcrum and thereby elastically deflecting said component clip producing a clamping force to hold the electronic component against said planar surface."
  ],
  "cpc": [
    "H10W 40/641"
  ],
  "assignees": [
    "ZYTEC CORP"
  ],
  "filing_date": "1994-01-07",
  "publication_date": "1994-08-30",
  "grant_date": "1994-08-30",
  "priority_date": "1994-01-07",
  "application_number": "US-17892894-A",
  "family_id": "22654476",
  "citations": [
    "US4193444A",
    "US4739452A",
    "US5172756A",
    "US5184281A",
    "US5191512A",
    "US5272599A"
  ]
}