Patent · US2005117307A1 · A1 · US
Electronic apparatus
- (11) Publication number
- US2005117307A1
- (21) Application number
- 10/994,938
- (22) Filing date
- 2004-11-22
- (30) Priority date
- 2003-11-28
- (43) Publication date
- 2005-06-02
- (51) IPC
- G06F 1/18; G06F 1/20; H05K 7/20; H10W 40/60
- (52) CPC
- H10W Generic packages, interconnections, connectors or other constructional details of devices covered by class H10: 40/611
- (72) Inventors
- Makoto Tanaka
- (54) Title
- Electronic apparatus
- (57) Abstract
An electronic apparatus includes a housing, a substrate, a bridge, a radiating plate, and a retaining member. The substrate is built in the housing. The bridge has an element portion and is mounted on the substrate. The radiating plate is thermally connected to the element portion. The retaining member has a pressing portion and three feet. The pressing portion is located on an opposite of the element portion about the radiating plate and abuts on the radiating plate. Three feet extend in three directions from the pressing portion and their respective end portions are fixed on the substrate. The retaining member urges the pressing portion toward the radiating plate.
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Claims (10)
- An electronic apparatus comprising: a housing; a substrate built in the housing; a circuit module which has an element portion and is mounted on the substrate; a heat conducting member which is thermally connected to the element portion; and a retaining member having a pressing portion which is located at an opposite to the element portion about the heat conducting member to abut on the heat conducting member, and three feet which extend from the pressing portion in three directions and have respective end portions fixed on the substrate, said retaining member urging the heat conducting member toward the element portion.
- The electronic apparatus according to claim 1, wherein: the heat conducting member has a pair of side portions at positions which sandwiches the pressing portion; a first foot of the three feet extends in a direction of crossing one of the pair of side portions; and a second foot and a third foot of the three feet extend in a direction of crossing the other one of the pair of side portions.
- The electronic apparatus according to claim 1, wherein: a first foot of the three feet extends in a direction away from the element portion; and a second foot and a third foot of the three feet extend in a direction separating from each other, along a direction crossing the extending direction of the first foot.
- An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which has a first element portion and is mounted on the substrate; a second circuit module which has a second element portion and is mounted side by side with the first circuit module on the substrate; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a first retaining member which has a pressing portion located at an opposite to the first element portion about the first heat conducting member to abut on the first heat conducting member, and three feet extending from the pressing portion in three directions and having respective end portions fixed on the substrate, said first retaining member urging the first heat conducting member toward the first element portion; and a second retaining member which has a pressing portion located at an opposite to the second element portion about the second heat conducting member to abut on the second heat conducting member, and three feet extending from the pressing portion in three directions and having respective end portions fixed on the substrate, said second retaining member urging the second heat conducting member toward the second element portion, wherein at least one of the three feet in the first retaining member and at least one of the three feet in the second retaining member are fixed together on the substrate, between the first circuit module and the second circuit module.
- An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which has a first element portion and is mounted on the substrate; a second circuit module which has a second element portion and is mounted side by side with the first circuit module on the substrate; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a fixing portion located between the first circuit module and the second circuit module; a first pressing portion which has an end fixed on the fixing portion, and which has the other end fixed on the substrate at a position different from the fixing portion to urge the first heat conducting member toward the first element portion; and a second pressing portion which has an end fixed on the fixing portion, and which has the other end fixed on the substrate at a position different from the fixing portion to urge the second heat conducting member toward the second element portion.
- The electronic apparatus according to claim 5, wherein lines linking the other end of the first pressing portion with the fixing portion and linking the other end of the second pressing portion with the fixing portion are parallel to a line linking the first element portion with the second element portion.
- The electronic apparatus according to claim 5, wherein the first pressing portion and the second pressing portion are provided integrally as one body.
- The electronic apparatus according to claim 6, wherein the first pressing portion and the second pressing portion are provided integrally as one body.
- An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which is mounted on the substrate and has a first element portion; a second circuit module which is mounted side by side with the first circuit module on the substrate and has a second element portion; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a first pressing portion which has a proximal portion supported between the first circuit module and the second circuit module, and which has a distal portion urge the first heat conducting member toward the first element portion; and a second pressing portion which has a proximal portion supported between the first circuit module and the second circuit module, and which has a distal portion urge the second heat conducting member toward the second element portion.
- The electronic apparatus according to claim 9, wherein the first pressing portion and the second pressing portion are provided integrally as one body.
Description
1. Field of the Invention
This invention relates to an electronic apparatus having a heat conducting member mounted on an element which is mounted on a substrate built in a housing and which generates heat.
2. Description of the Related Art
A portable computer (PC) is an electronic apparatus in which an MPU (Micro Processing Unit) executing various arithmetic operations is mounted on a substrate built in a housing. In accordance with higher density of circuits and acceleration of the operations, the amount of heat generation in the MPU tends to increase. For this reason, a cooler is provided to positively cool the MPU as seen in, for example, Jpn. Pat. Appln. KOKAI Publication No. 2003-101272.
The cooler comprises a heat receiving portion and a spring member. The heat receiving portion is in close contact with an electronic component which is a heat generating portion. The spring member has four feet that overlap four corners of the squared heat receiving portion, respectively. By fixing an end portion of each foot on the substrate, the spring member presses the heat receiving portion onto the electronic component.
As the operation speed of the MPU is accelerated, the amount of heat generation in electronic components related with the MPU tends to increase and they are needing to be cooled. Thus, further providing heat transfer components for removal of heat on the electronic components mounted in the vicinity of the MPU is reviewed.
Citations (49)
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- US5648889A
- US5731952A
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Record as JSON
{
"publication_number": "US2005117307A1",
"country": "US",
"kind": "A1",
"title": "Electronic apparatus",
"abstract": "An electronic apparatus includes a housing, a substrate, a bridge, a radiating plate, and a retaining member. The substrate is built in the housing. The bridge has an element portion and is mounted on the substrate. The radiating plate is thermally connected to the element portion. The retaining member has a pressing portion and three feet. The pressing portion is located on an opposite of the element portion about the radiating plate and abuts on the radiating plate. Three feet extend in three directions from the pressing portion and their respective end portions are fixed on the substrate. The retaining member urges the pressing portion toward the radiating plate.",
"claims": [
"1. An electronic apparatus comprising: a housing; a substrate built in the housing; a circuit module which has an element portion and is mounted on the substrate; a heat conducting member which is thermally connected to the element portion; and a retaining member having a pressing portion which is located at an opposite to the element portion about the heat conducting member to abut on the heat conducting member, and three feet which extend from the pressing portion in three directions and have respective end portions fixed on the substrate, said retaining member urging the heat conducting member toward the element portion.",
"2. The electronic apparatus according to claim 1, wherein: the heat conducting member has a pair of side portions at positions which sandwiches the pressing portion; a first foot of the three feet extends in a direction of crossing one of the pair of side portions; and a second foot and a third foot of the three feet extend in a direction of crossing the other one of the pair of side portions.",
"3. The electronic apparatus according to claim 1, wherein: a first foot of the three feet extends in a direction away from the element portion; and a second foot and a third foot of the three feet extend in a direction separating from each other, along a direction crossing the extending direction of the first foot.",
"4. An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which has a first element portion and is mounted on the substrate; a second circuit module which has a second element portion and is mounted side by side with the first circuit module on the substrate; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a first retaining member which has a pressing portion located at an opposite to the first element portion about the first heat conducting member to abut on the first heat conducting member, and three feet extending from the pressing portion in three directions and having respective end portions fixed on the substrate, said first retaining member urging the first heat conducting member toward the first element portion; and a second retaining member which has a pressing portion located at an opposite to the second element portion about the second heat conducting member to abut on the second heat conducting member, and three feet extending from the pressing portion in three directions and having respective end portions fixed on the substrate, said second retaining member urging the second heat conducting member toward the second element portion, wherein at least one of the three feet in the first retaining member and at least one of the three feet in the second retaining member are fixed together on the substrate, between the first circuit module and the second circuit module.",
"5. An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which has a first element portion and is mounted on the substrate; a second circuit module which has a second element portion and is mounted side by side with the first circuit module on the substrate; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a fixing portion located between the first circuit module and the second circuit module; a first pressing portion which has an end fixed on the fixing portion, and which has the other end fixed on the substrate at a position different from the fixing portion to urge the first heat conducting member toward the first element portion; and a second pressing portion which has an end fixed on the fixing portion, and which has the other end fixed on the substrate at a position different from the fixing portion to urge the second heat conducting member toward the second element portion.",
"6. The electronic apparatus according to claim 5, wherein lines linking the other end of the first pressing portion with the fixing portion and linking the other end of the second pressing portion with the fixing portion are parallel to a line linking the first element portion with the second element portion.",
"7. The electronic apparatus according to claim 5, wherein the first pressing portion and the second pressing portion are provided integrally as one body.",
"8. The electronic apparatus according to claim 6, wherein the first pressing portion and the second pressing portion are provided integrally as one body.",
"9. An electronic apparatus comprising: a housing; a substrate built in the housing; a first circuit module which is mounted on the substrate and has a first element portion; a second circuit module which is mounted side by side with the first circuit module on the substrate and has a second element portion; a first heat conducting member which is thermally connected to the first element portion; a second heat conducting member which is thermally connected to the second element portion; a first pressing portion which has a proximal portion supported between the first circuit module and the second circuit module, and which has a distal portion urge the first heat conducting member toward the first element portion; and a second pressing portion which has a proximal portion supported between the first circuit module and the second circuit module, and which has a distal portion urge the second heat conducting member toward the second element portion.",
"10. The electronic apparatus according to claim 9, wherein the first pressing portion and the second pressing portion are provided integrally as one body."
],
"description_excerpt": "1. Field of the Invention\n\nThis invention relates to an electronic apparatus having a heat conducting member mounted on an element which is mounted on a substrate built in a housing and which generates heat.\n\n2. Description of the Related Art\n\nA portable computer (PC) is an electronic apparatus in which an MPU (Micro Processing Unit) executing various arithmetic operations is mounted on a substrate built in a housing. In accordance with higher density of circuits and acceleration of the operations, the amount of heat generation in the MPU tends to increase. For this reason, a cooler is provided to positively cool the MPU as seen in, for example, Jpn. Pat. Appln. KOKAI Publication No. 2003-101272.\n\nThe cooler comprises a heat receiving portion and a spring member. The heat receiving portion is in close contact with an electronic component which is a heat generating portion. The spring member has four feet that overlap four corners of the squared heat receiving portion, respectively. By fixing an end portion of each foot on the substrate, the spring member presses the heat receiving portion onto the electronic component.\n\nAs the operation speed of the MPU is accelerated, the amount of heat generation in electronic components related with the MPU tends to increase and they are needing to be cooled. Thus, further providing heat transfer components for removal of heat on the electronic components mounted in the vicinity of the MPU is reviewed.",
"cpc": [
"H10W 40/611"
],
"ipc": [
"G06F 1/18",
"G06F 1/20",
"H05K 7/20",
"H10W 40/60"
],
"inventors": [
"Makoto Tanaka"
],
"filing_date": "2004-11-22",
"publication_date": "2005-06-02",
"priority_date": "2003-11-28",
"application_number": "US-99493804-A",
"family_id": "34463889",
"cited_by_count": 30,
"citations": [
"US5089936A",
"US5268817A",
"US5648889A",
"US5731952A",
"US6774870B2",
"US20020053421A1",
"US6141214A",
"US6005767A",
"US6049459A",
"US6464195B1",
"US6333847B1",
"US6282082B1",
"US6377452B1",
"US6483445B1",
"US6477871B1",
"US6231371B1",
"US6519143B1",
"US6166907A",
"US6196850B1",
"US6418017B1",
"US6430038B1",
"US6437973B1",
"US6313990B1",
"US20020018337A1",
"US6296048B1",
"US6728102B2",
"US6625022B2",
"US6396687B1",
"US6519147B2",
"US6519148B2",
"US6717798B2",
"US20020141159A1",
"US6625024B2",
"US6755626B2",
"US6654234B2",
"US6873521B2",
"US20030039097A1",
"US6809927B2",
"US6594149B2",
"US20030142474A1",
"US7054158B2",
"US6856506B2",
"US20040057197A1",
"US6809930B2",
"US20050007739A1",
"US20050052833A1",
"US20050068732A1",
"US20050164624A1",
"US7095614B2"
]
}
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