Bolster plate assembly for printed circuit board

{
  "publication_number": "US2009059530A1",
  "country": "US",
  "kind": "A1",
  "title": "Bolster plate assembly for printed circuit board",
  "abstract": "A bolster plate assembly for a printed circuit board includes a first structure member, a second structure member rotatably mounted to the first structure member, and a plurality of locking members. Two spaced, elongated sliding slots are defined in the first structure member. Two spaced, elongated sliding slots are defined in the second structure member. The locking members are slidably attached in the sliding slots of the first and second structure members.",
  "claims": [
    "1. A bolster plate assembly for a printed circuit board, comprising: a first structure member defining two spaced, elongated sliding slots therein; a second structure member rotatably mounted to the first structure member, two spaced, elongated sliding slots being defined in the second structure member; and a plurality of locking members slidably attached in the sliding slots of the first and second structure members.",
    "2. The bolster plate assembly as described in claim 1, wherein each of the locking members comprises a head and a post extending from the head, and a plurality of retaining members is held on the posts of the locking members for attaching the locking members in the sliding slots of the first and second structure members.",
    "3. The bolster plate assembly as described in claim 2, wherein two elongated raised ridges are formed on the first structure member adjacent each of the sliding slots thereof, and the heads of the locking members, slidably attached in the sliding slots of the first structure member, are located between the corresponding elongated raised ridges.",
    "4. The bolster plate assembly as described in claim 3, wherein the raised ridges of the first structure members are parallel to the corresponding sliding slot thereof.",
    "5. The bolster plate assembly as described in claim 2, wherein two elongated raised ridges are formed on the second structure member adjacent each of the sliding slots thereof, and the heads of the locking members, slidably attached in the sliding slots of the second structure member, are located between the corresponding elongated raised ridges.",
    "6. The bolster plate assembly as described in claim 5, wherein the raised ridges of the second structure members are parallel to the corresponding sliding slot thereof.",
    "7. The bolster plate assembly as described in claim 1, wherein a through hole is defined in the first structure member between the two sliding slots, a through hole is defined in the second structure member between the two sliding slots, and the first and second structure members are rotatably installed together via a connecting member passing through the two through holes.",
    "8. The bolster plate assembly as described in claim 7, wherein the first structure member comprises two end portions and a coupling portion connecting with the end portions, the two sliding slots of the first structure member are respectively defined in the end portions, and the through hole thereof is defined in the coupling portion.",
    "9. The bolster plate assembly as described in claim 7, wherein the second structure member comprises two end portions and a coupling portion connecting with the end portions, the two sliding slots of the second structure member are respectively defined in the end portions, and the through hole thereof is defined in the coupling portion.",
    "10. The bolster plate assembly as described in claim 2, wherein a mounting hole is defined in each of the posts of the locking members configured for receiving a fastener.",
    "11. A thermal module comprising: a printed circuit board; a heat dissipation device positioned at a surface of the printed circuit board; and a bolster plate assembly positioned at the other surface of the printed circuit board, comprising: a first structure member defining two spaced, elongated sliding slots therein; a second structure member rotatably mounted to the first structure member, two spaced, elongated sliding slots being defined in the second structure member; and a plurality of locking members slidably attached in the sliding slots of the first and second structure members; wherein the locking members are adjusted in the corresponding sliding slots to pass through the printed circuit board for securing the heat dissipation device to the printed circuit board.",
    "12. The thermal module as described in claim 11, wherein a through hole is defined in the first structure member between the two sliding slots, a through hole is defined in the second structure member between the two sliding slots, and the first and second structure members are rotatably installed via a connecting member passing through the two through holes.",
    "13. The thermal module as described in claim 11, wherein each of the locking members comprises a head and a post extending from the head, and a plurality of retaining members is held on the posts to sandwich the printed circuit board with the corresponding heads thereby attaching the bolster plate assembly to the printed circuit board.",
    "14. The thermal module as described in claim 13, wherein two elongated raised ridges are formed on the first structure member adjacent each of the sliding slots thereof, two elongated raised ridges are formed on the second structure member adjacent each of the sliding slots thereof, and the heads of the locking members are located between the corresponding raised ridges.",
    "15. The thermal module as described in claim 11, wherein a plurality of nonconductive pads is glued on the first and second structure members configured for insulating the first and second structure members from the printed circuit board."
  ],
  "description_excerpt": "1. Field of the Invention\n\nThe present invention relates to a bolster plate assembly for a printed circuit board, and more particularly to a bolster plate assembly for reinforcing a printed circuit board.\n\n2. Description of Related Art\n\nAs the state of development of semiconductor components such as central processing units (CPUs) has evolved towards higher level of integration, the amount of heat semiconductor components generate has significantly increased. The heat must be adequately and timely removed to prevent increased temperatures from damaging the semiconductor components. One approach for solving the heat dissipation problem is to attach heat dissipation devices, which transfer or dissipate heat by means of heat sinks, to printed circuit boards such as motherboards, on which CPUs are disposed. However, as CPUs get increasingly hotter, the heat dissipation devices required to cool these CPUs likewise get larger and heavier. Thus the risk of damage to the motherboards is increased due to mechanical overloading. Therefore, there is an increasing need to distribute the force that is created by the heat dissipation device on the motherboard to minimize load conditions that could damage the motherboard. The bolster plate is invented for reinforcing the motherboard.\n\nPresently, the type of motherboard is shifting from Advanced Technology Extended (ATX) specification towards Balanced Technology Extended (BTX) specification.",
  "cpc": [
    "H05K 1/0201",
    "H05K 2201/066",
    "H05K 2201/10409",
    "H05K 2201/10598",
    "H05K 3/301",
    "H10W 40/611"
  ],
  "ipc": [
    "H05K 1/18",
    "H05K 7/20"
  ],
  "assignees": [
    "Hongfujin Precision Industry Shenzhen Co Ltd",
    "Hon Hai Precision Industry Co Ltd"
  ],
  "inventors": [
    "Ke Sun",
    "Zhen-Xing Ye",
    "Ming-Ke Chen",
    "Xiao-Zhu Chen"
  ],
  "filing_date": "2007-11-29",
  "publication_date": "2009-03-05",
  "priority_date": "2007-08-31",
  "application_number": "US-94685407-A",
  "family_id": "40407135",
  "cited_by_count": 3,
  "citations": [
    "US6625022B2",
    "US6430050B1",
    "US6480388B1",
    "US6646881B1",
    "US7170750B2",
    "US20070047211A1",
    "US20070121300A1"
  ]
}