Fastening structure for thermal module

{
  "publication_number": "US9169858B2",
  "country": "US",
  "kind": "B2",
  "title": "Fastening structure for thermal module",
  "abstract": "A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary.",
  "claims": [
    "1. A fastening structure connecting a longitudinally extending thermal module to a mainboard, the thermal module comprising a plurality of transverse radiating fins arranged along a length thereof, a bottom surface disposed on the mainboard, an opposing top surface, and opposing side surfaces each comprising a recess, the fastening structure comprising: opposing first and second body sections, wherein: the first body section comprises a fastening portion for connecting the fastening structure to the mainboard, and the second body section comprises: an elastic press portion adjacent the first body section and comprising opposing elastic press arms extending upwardly therefrom, and a flexible space between the elastic press arms defined by a longitudinal slot; and an insertion unit distal to the first body section and comprising first and second insertion sections on either side of the flexible space, each insertion section comprising a stop section extending laterally inward from an outer edge thereof; wherein in an insertion position, the elastic press arms are deflected outwardly away from the flexible space, thereby allowing the insertion unit to be slid longitudinally over the to surface with the insertion sections aligned with the recesses in the opposing side surfaces of the thermal module, and wherein in a locked position, the elastic press arms are released such that the stop sections engage with passages defined between two adjacent radiating fins, thereby preventing longitudinal removal of the fastening structure from the thermal module.",
    "2. The fastening structure as claimed in claim 1, wherein the elastic press portion includes at least one elastic press arm and at least one opening, the opening penetrating the second body section in a thickness direction thereof and being located at a position between the elastic press arms and one lateral side of the second body section.",
    "3. The fastening structure as claimed in claim 1, wherein the thermal module includes a heat radiating unit and a heat transfer unit, and the heat transfer unit having an end extended through the heat radiating unit and another opposite end attached to a base."
  ],
  "description_excerpt": "The present invention relates to a fastening structure for thermal module, and more particularly to a fastening structure that can be quickly assembled to a thermal module for fastening the latter to a mainboard and can also be conveniently separated from the thermal module whenever reworking is necessary.\n\nThanks to the progress in various technological fields, 3C products (Communication, Consumer electronics, and Computer products) have been constantly improved. For instance, the currently available computer systems now have quicker and quicker computing speed, and the central processing unit (CPU) or the microprocessor of a computer system performing the major computing function thereof has more powerful processing capability. However, the size of the CPU or microprocessor for the computer system does not increase along with the enhanced ability thereof, but is even reduced in some cases. That is, the density of the integrated circuits provided on the CPU or the microprocessor is obviously increased. Thus, heat produced by the CPU or the microprocessor during operation thereof also largely increases to adversely raise the surface temperature of the CPU or the microprocessor even to a level higher than 100° C. To prevent the CPU or the microprocessor from being damaged or causing burnout of nearby elements due to the high temperature thereof, it is necessary to have some mechanism for timely removing the produced heat from the CPU or the microprocessor.",
  "cpc": [
    "F16B 2/065",
    "F16B 21/078",
    "F16B 21/088",
    "F16B 43/025",
    "F16B 5/0241",
    "F28D 15/0275",
    "F28F 2275/20",
    "H01L 2023/4087",
    "H01L 23/427",
    "H01L 2924/00",
    "H01L 2924/0002",
    "H10W 40/60",
    "H10W 40/73",
    "Y10T 403/54",
    "Y10T 403/7033"
  ],
  "ipc": [
    "F16B 2/06",
    "F16B 21/07",
    "F16B 21/08",
    "F16B 43/02",
    "F16B 5/02",
    "H01L 23/40",
    "H01L 23/427"
  ],
  "assignees": [
    "ASIA VITAL COMPONENTS CO LTD"
  ],
  "inventors": [
    "LIN SHENG-HUANG"
  ],
  "filing_date": "2014-05-15",
  "publication_date": "2015-10-27",
  "grant_date": "2015-10-27",
  "priority_date": "2012-02-02",
  "application_number": "US-201414278122-A",
  "family_id": "48903015",
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}