Thermally conductive sheet feeder and method for feeding thermally conductive sheet

{
  "publication_number": "US9385063B2",
  "country": "US",
  "kind": "B2",
  "title": "Thermally conductive sheet feeder and method for feeding thermally conductive sheet",
  "abstract": "Provided by the present invention are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet, which are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet using an emboss carrier tape, wherein the emboss carrier tape provided on its surface with a plurality of pockets, each having one thermally conductive sheet accommodated therein, and a cover film to protect surface of the emboss carrier tape are rolled up in a reel-like form.",
  "claims": [
    "1. A thermally conductive sheet feeder wherein an emboss carrier tape provided on its surface with a plurality of pockets, each having one thermally conductive sheet accommodated therein, and a cover film to protect surface of the emboss carrier tape are rolled up in a reel form, wherein the thermally conductive sheet is composed of a reinforcing layer, and a thermally conductive resin layer laminated on one surface of the reinforcing layer or thermally conductive resin layers laminated on both surfaces of the reinforcing layer, the thermally conductive resin layers being the same or different; a tacking energy of at least one surface of the thermally conductive sheet is 70 μJ or less; thickness of the thermally conductive sheet is in the range of 60 μm or more to 600 μm or less; the thermally conductive resin layer contains 300 parts by mass or more of thermally conductive filler relative to 100 parts by mass of a silicone rubber; and each thermally conductive sheet is accommodated in each pocket of the emboss carrier tape in the thermally conductive sheet feeder such that the tacking energy of the thermally conductive sheet is the same between a surface of the cover film side and a surface of the pocket's bottom side, or the tacking energy of the thermally conductive sheet of the cover film side is lower than that of the pocket's bottom side.",
    "2. The thermally conductive sheet feeder according to claim 1, wherein thermal conductivity of the thermally conductive resin layer is 1.0 W/mK or more.",
    "3. The thermally conductive sheet feeder according to claim 1, wherein thermal conductivity of the thermally conductive resin layer is 3.0 W/mK or more.",
    "4. The thermally conductive sheet feeder according to claim 1, wherein the reinforcing layer is an aluminum foil.",
    "5. A method for feeding a thermally conductive sheet wherein a thermally conductive sheet accommodated in a pocket of the emboss carrier tape of the thermally conductive sheet feeder according to claim 1 is fed by sucking up the sheet one by one from the pocket by using a vacuum nozzle whereby carrying out an automatic mounting thereof.",
    "6. The thermally conductive sheet feeder according to claim 1, wherein the pockets have a depth such that there is an allowance of 3 to 5 mm above the thermally conductive sheet accommodated therein.",
    "7. The thermally conductive sheet feeder according to claim 1, wherein the reinforcing layer comprises a metal foil having a thickness in the range of 20 to 150 μm.",
    "8. The thermally conductive sheet feeder according to claim 1, wherein the thickness of the thermally conductive sheet is in the range of 200 μm or more to 400 μm or less.",
    "9. The thermally conductive sheet feeder according to claim 1, wherein the thermally conductive resin layer contains 300 parts by mass or more to 1300 parts by mass by less of thermally conductive filler relative to 100 parts by mass of the silicon rubber.",
    "10. The thermally conductive sheet feeder according to claim 1, wherein the thermally conductive filler has a median particle diameter in the range of 0.1 to 200 μm."
  ],
  "description_excerpt": "The present invention relates to a thermally conductive sheet feeder and to a method for feeding a thermally conductive sheet.\n\nAs LSI chip, including CPU, driver IC, and memory that are used in electronic devices such as a personal computer, a digital video disc, and a cell phone, advances toward a higher performance, a higher speed, further downsizing, and a higher integration, they themselves generate significant heat thereby leading to temperature rise of the chip due to this heat, which in turn causes malfunction and destruction of the chip. Therefore, in order to suppress the temperature rise of the chip in action, many methods for heat diffusion and heat-diffusing members used for it have been proposed.\n\nIn the past, in electronic devices and so forth, in order to suppress the temperature rise of the chip in action, a heat sink in which a metal plate having a high thermal conductivity made of such materials as aluminum and copper has been used. This heat sink conducts a heat generated by the chip thereby releasing the heat from its surface by utilizing the temperature difference with the outer environment.\n\nIn order to efficiently conduct the heat generated from the chip to the heat sink, it is necessary to intimately contact the heat sink to the chip; however, there are a difference in heights among chips and a tolerance caused by assembling of them. Therefore, a flexible sheet or grease is inserted between the chip and the heat sink, whereby thermal conduction is realized from the chip to the heat sink through the sheet or the grease.",
  "cpc": [
    "H10W 40/226",
    "B25J 11/00",
    "B65B 15/04",
    "B65D 73/02",
    "H01L 23/3672",
    "H01L 23/3737",
    "H01L 2924/00",
    "H01L 2924/0002",
    "H05K 13/0084",
    "H10W 40/10",
    "H10W 40/251",
    "Y02P 70/50"
  ],
  "ipc": [
    "B25J 11/00",
    "B65B 15/04",
    "B65D 73/02",
    "H01K 13/02",
    "H01L 23/367",
    "H01L 23/373",
    "H05K 13/00"
  ],
  "assignees": [
    "Shin Etsu Chemical Co Ltd"
  ],
  "inventors": [
    "Yasuhisa Ishihara",
    "Akihiro Endo"
  ],
  "filing_date": "2013-03-29",
  "publication_date": "2016-07-05",
  "grant_date": "2016-07-05",
  "priority_date": "2012-05-14",
  "application_number": "US-201314390669-A",
  "family_id": "49583393",
  "cited_by_count": 3,
  "citations": [
    "JPH05310264A",
    "JPH07149365A",
    "JPH11292188A",
    "JP2002080617A",
    "US20030180484A1",
    "JP2003026280A",
    "US20030151898A1",
    "JP2004039829A",
    "JP2005228955A",
    "JP2008120445A",
    "JP2009123766A",
    "JP2010010599A",
    "WO2010104010A1",
    "US20120003429A1",
    "US20100294780A1",
    "JP2011225257A",
    "JP2012012033A"
  ]
}