Scalable debris-free socket loading mechanism

{
  "publication_number": "US11387163B2",
  "country": "US",
  "kind": "B2",
  "title": "Scalable debris-free socket loading mechanism",
  "abstract": "A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.",
  "claims": [
    "1. A microprocessor heat sink fastener, comprising: a nut comprising a thermoplastic material and fibrous fill particles; and a bore extending along an axis of the nut, the bore defining a plurality of internal threads of the nut adjacent a bulk region of the nut, each internal thread comprising a plurality of first fibers having first and second terminating ends extending toward the bulk region and terminating within each internal thread, wherein the bulk region comprises a plurality of second fibers, and wherein the first fibers comprise a first average curvature of fibrous fill particles and the second fibers comprise a second average curvature of fibrous fill particles of fibrous fill particles less than the first average curvature.",
    "2. The microprocessor heat sink fastener of claim 1, wherein a middle portion of one of the first fibers between the first and second terminating ends is at a surface of one of the internal threads.",
    "3. The microprocessor heat sink fastener of claim 1, wherein the thermoplastic comprises polyether ether ketone (PEEK) and the fibrous fill particles comprise glass fibers.",
    "4. The microprocessor heat sink fastener of claim 3, wherein the glass fibers are not less than 15% and not more than 35% of the nut by weight.",
    "5. The microprocessor heat sink fastener of claim 1, wherein the thermoplastic is one of polyether ether ketone (PEEK), polyether ketone (PEK), or polyphenylene sulfide (PPS).",
    "6. The microprocessor heat sink fastener of claim 1, wherein the fibrous fill particles comprise glass fibers or carbon fibers.",
    "7. The microprocessor heat sink fastener of claim 1, wherein the bore extends partially through the nut.",
    "8. The microprocessor heat sink fastener of claim 1, wherein the bore extends entirely through the nut.",
    "9. The microprocessor heat sink fastener of claim 1, wherein a first density of the first fibers in each internal thread is less than a second density of the second fibers in the bulk region.",
    "10. The microprocessor heat sink fastener of claim 1, wherein the nut comprises a cylindrically symmetrical body.",
    "11. The microprocessor heat sink fastener of claim 1, wherein the first average curvatures comprise one of an inverse of a radius of a circle fit to a maximum curve of a selected one of the first the fibers or a rate of change of a unit tangent vector for a particle moving at a unit speed along the selected one of the first the fibers.",
    "12. The fastener of claim 1, wherein the nut comprises an internal driver pattern.",
    "13. The fastener of claim 1, wherein the nut comprises a length to diameter ratio of at least 1:1.",
    "14. A system comprising: a retention plate comprising threaded studs; a heatsink comprising a baseplate comprising bolt passage holes, wherein the heatsink is mounted over the retention plate, and wherein the threaded studs are through the bolt passage holes; a microprocessor under the heatsink; and the microprocessor heatsink fastener of claim 1, wherein the fastener is engaged with the threaded studs.",
    "15. The system of claim 14, wherein the nut is torqued against the baseplate of the heatsink, and wherein the heatsink is held against the microprocessor.",
    "16. The system of claim 15, wherein a load on the heatsink due to the nut being torqued against the baseplate of the heatsink is between 200-300 lbf."
  ],
  "description_excerpt": "Loading of modern land grid array (LGA) microprocessors into sockets requires the application of large for loads to ensure that all of the electrical connections between the processor package and the socket contacts are established and stable. Current methods to load a microprocessor on a socket includes placing a thermal solution, which is generally the heat transfer surface of a heatsink, on the integrated heat spreader on the die side of the microprocessor and bolted to a motherboard. The load is transferred to the microprocessor through the heatsink. Multiple fasteners and load points are used to apply the load, requiring a specific sequence of fastener tightening. In many cases, the load required to place on the microprocessor by the heatsink causes metal fasteners to wear in such a way that metal debris in the form of small metal chips and slivers is created from multiple torque cycles to which the fasteners are subjected. The metal debris can cause failures in and around the microprocessor socket.\n\nThe embodiments of the disclosure will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the disclosure, which, however, should not be taken to limit the disclosure to the specific embodiments, but are for explanation and understanding only. FIG. 1 illustrates an exploded view of an anti-tilt fastener assembly, according to some embodiments of the disclosure. FIG. 2A illustrates a top oblique view of an assembled anti-tilt base, according to some embodiments of the disclosure. FIG.",
  "cpc": [
    "H10W 40/611",
    "F16B 2/248",
    "F16B 2200/99",
    "F16B 33/006",
    "F16B 37/145",
    "F16B 5/121",
    "F16B 5/126",
    "H01L 2023/4087",
    "H01L 23/4006",
    "H01L 23/4093",
    "H10W 40/231",
    "H10W 40/235",
    "H10W 40/60",
    "H10W 40/625",
    "H10W 40/641"
  ],
  "ipc": [
    "F16B 33/00",
    "F16B 37/00",
    "F16B 37/14",
    "H01L 23/40"
  ],
  "assignees": [
    "INTEL CORP"
  ],
  "inventors": [
    "LARSON ANDREW",
    "SAHU BIJOYRAJ",
    "JAHNE CRAIG J",
    "BUDDRIUS ERIC W",
    "MIELE RALPH V"
  ],
  "filing_date": "2018-03-30",
  "publication_date": "2022-07-12",
  "grant_date": "2022-07-12",
  "priority_date": "2018-03-30",
  "application_number": "US-201815942278-A",
  "family_id": "68053839",
  "citations": [
    "DE2802465A1",
    "EP0476158A1",
    "US10030685B2",
    "US10455685B1",
    "US11143676B2",
    "US2002060064A1",
    "US2003165371A1",
    "US2003186578A1",
    "US2005112922A1",
    "US2005191890A1",
    "US2005208813A1",
    "US2005218035A1",
    "US2005266604A1",
    "US2006275100A1",
    "US2007211431A1",
    "US2009110901A1",
    "US2009191744A1",
    "US2010035456A1",
    "US2010130048A1",
    "US2011070053A1",
    "US2011249404A1",
    "US2012156913A1",
    "US2012162923A1",
    "US2012200993A1",
    "US2013183087A1",
    "US2013342997A1",
    "US2013343829A1",
    "US2014071647A1",
    "US2014161558A1",
    "US2014199873A1",
    "US2014234052A1",
    "US2015266260A1",
    "US2016285184A1",
    "US2016351526A1",
    "US2017321411A1",
    "US2018166807A1",
    "US2019304869A1",
    "US2019393631A1",
    "US2020126889A1",
    "US2020378430A1",
    "US2021318191A1",
    "US2949054A",
    "US4546408A",
    "US4756654A",
    "US4863330A",
    "US4883399A",
    "US5080547A",
    "US5209888A",
    "US5234299A",
    "US5431518A",
    "US5823729A",
    "US6109848A",
    "US6238158B1",
    "US6280222B1",
    "US6869303B1",
    "US7009844B2",
    "US7142430B2",
    "US7156670B2",
    "US7283362B2",
    "US7785125B1",
    "US7957148B1",
    "US8172597B1",
    "US8465241B2",
    "US8613580B2",
    "US8905775B2",
    "US8974165B2",
    "US9028635B2",
    "US9466900B1"
  ]
}