Semiconductor device

{
  "publication_number": "US10916483B2",
  "country": "US",
  "kind": "B2",
  "title": "Semiconductor device",
  "abstract": "An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.",
  "claims": [
    "1. A semiconductor device, comprising: an insert electrode having an insert hole into which a bolt is inserted from outside; a nut which has a screw hole to be screwed with said bolt and is disposed on an inside of said insert electrode so that said screw hole is communicated with said insert hole; at least one semiconductor element being electrically connected to said insert electrode, wherein said nut and said insert electrode are press fit to form a press fit structure, said press fit structure including: a plurality of protrusions provided on an outer periphery of said nut, and a plurality of concave parts provided on an edge of said insert hole, and each of said plurality of protrusions is pressed into a corresponding one of each of said plurality of concave parts; and a resin sealing said inside of said insert electrode, said nut, and said at least one semiconductor element."
  ],
  "description_excerpt": "The present invention relates to a semiconductor device, and particularly to a semiconductor device including an insert electrode to be connected to an external electrode.\n\nKnown as a semiconductor device used as a power module used for a motor control and an inverter of an air conditioner, for example, is a semiconductor device including a heatsink, a heat radiation insulating substrate joined to the heatsink, a semiconductor element disposed on the heat radiation insulating substrate, and an insert electrode for connecting the semiconductor element to an external electrode.\n\nA nut is disposed on an inside of the insert electrode, and a bolt can be screwed from an outside of the insert electrode (that is to say, an outside of the semiconductor device). The inside of the insert electrode, the nut, and the semiconductor element, for example, are sealed with a sealing resin.\n\nWhen there is a slight gap between the insert electrode and the nut at a time of resin sealing (also referred to as a resin molding), the resin enters the gap. Then, an intrusion of the resin between the insert electrode and the nut occurs after the resin sealing.\n\nThe intrusion of the resin between the insert electrode and the nut causes a creeping of the resin at a time of tightening the bolt. The creeping of the resin causes a reduction in axial force while in use or right after tightening the bolt. The reduction in axial force may seriously degrade an assumed quality of the power module. Thus, the prevention of the intrusion of the resin is a significantly important factor in performing the resin sealing.",
  "cpc": [
    "H10W 76/18",
    "F16B 37/048",
    "H01L 23/04",
    "H01L 23/08",
    "H01L 23/48",
    "H10W 72/00",
    "H10W 76/12"
  ],
  "ipc": [
    "F16B 37/04",
    "H01L 23/04",
    "H01L 23/08",
    "H01L 23/48"
  ],
  "assignees": [
    "Mitsubishi Electric Corp"
  ],
  "inventors": [
    "Takahiko Murakami",
    "Mitsunori Aiko",
    "Takaaki Shirasawa",
    "Natsuki Tsuji"
  ],
  "filing_date": "2019-04-23",
  "publication_date": "2021-02-09",
  "grant_date": "2021-02-09",
  "priority_date": "2015-07-27",
  "application_number": "US-201916391815-A",
  "family_id": "57884183",
  "cited_by_count": 0,
  "citations": [
    "JPS50118369U",
    "JPS63109014U",
    "JPH01127259A",
    "US5090919A",
    "JPH04127411U",
    "US5281493A",
    "JPH06120390A",
    "US5373105A",
    "JPH09283681A",
    "JP2002005128A",
    "JP2002076255A",
    "US6521983B1",
    "JP2004106468A",
    "JP2005277012A",
    "JP2007263295A",
    "US8134838B2",
    "JP2012222009A"
  ]
}