Semiconductor module with gripping sockets, methods for gripping, for moving and for electrically testing a semiconductor module

{
  "publication_number": "US10143099B2",
  "country": "US",
  "kind": "B2",
  "title": "Semiconductor module with gripping sockets, methods for gripping, for moving and for electrically testing a semiconductor module",
  "abstract": "One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.",
  "claims": [
    "1. A method for gripping a semiconductor module, comprising the steps: providing a semiconductor module, the semiconductor module comprising: an outer housing having four side walls; a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side; a semiconductor chip, which is arranged on the upper side and in the outer housing; and a first gripping socket, which is formed as an indentation and extends from the outer side of the outer housing into a first of the side walls; providing a positioning device, which has a first gripping finger; and gripping the semiconductor module by means of the positioning device, the first gripping finger engaging in the first gripping socket, moving the semiconductor module by means of the positioning device after the gripping, wherein the semiconductor module is turned upside down by the positioning device during the moving of the semiconductor module.",
    "2. The method as claimed in claim 1, wherein the semiconductor module comprises a second gripping socket, which is formed as an indentation and extends from the outer side of the outer housing into a second of the side walls; and the positioning device has a second gripping finger, which engages in the second gripping socket during the gripping of the semiconductor module.",
    "3. A method for moving a semiconductor module, comprising: providing a semiconductor module, the semiconductor module comprising: an outer housing having four side walls; a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side; a semiconductor chip, which is arranged on the upper side and in the outer housing; and a first gripping socket, which is formed as an indentation and extends from the outer side of the outer housing into a first of the side walls; providing a positioning device, which has a first gripping finger; gripping the semiconductor module by means of the positioning device, the first gripping finger engaging in the first gripping socket; and moving the semiconductor module by means of the positioning device after the gripping wherein the semiconductor module is turned upside down by the positioning device during the moving of the semiconductor module.",
    "4. A method for electrically testing a semiconductor module, the semiconductor module comprising an outer housing having four side walls, a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side, a semiconductor chip, which is arranged on the upper side and in the outer housing, a first gripping socket, which is formed as an indentation and extends from the outer side of the outer housing into a first of the side walls; and a number of external electrical terminals on a side of the outer housing that faces away from the circuit carrier, the method comprising the following steps: providing an electrical measuring adapter; moving the semiconductor module by means of a positioning device after gripping the semiconductor module by means of the positioning device in such a way that the semiconductor module is positioned relative to the measuring adapter so that the external electrical terminals face toward the measuring adapter, wherein the semiconductor module is turned upside down by the positioning device during the moving of the semiconductor module; and electrically contacting the external terminals by means of the measuring adapter and subsequently testing the electrical functionality of the semiconductor module."
  ],
  "description_excerpt": "The present invention relates to semiconductor modules and to methods for gripping, moving and electrically testing the latter.\n\nFor semi-automated, or in the ideal case fully automated fabrication, as used expediently for example in the production of large numbers of parts (for example in the automotive field), it is advantageous if the semiconductor modules can pass through the automatic part of the fabrication, or the fully automatic fabrication, as far as possible without manual intervention. To this end, the semiconductor modules have previously been taken up by a magnetic holder of a positioning device. As the semiconductor modules have usually consisted essentially of nonmagnetic parts, magnetic fastening nuts have been integrated into the module housing, although this entails high complexity and costs.\n\nThe object of the present invention is to provide measures which allow straightforward and economical semiautomatic or fully automatic fabrication and/or testing of a semiconductor module.\n\nAccording to a first embodiment, a semiconductor module includes an outer housing having four side walls and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip located on the upper side is arranged in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.\n\nAccording to a second embodiment, a method for gripping a semiconductor module configured according to the first embodiment is disclosed.",
  "cpc": [
    "H05K 5/023",
    "B25J 11/0095",
    "G01R 31/2601",
    "G01R 31/2607",
    "G01R 31/2808",
    "G01R 31/2893",
    "G01R 31/44",
    "H01L 21/68728",
    "H01L 21/68735",
    "H01L 21/68778",
    "H01L 2224/32225",
    "H05K 5/0065",
    "H05K 5/0069",
    "H05K 5/0091",
    "H10P 72/7608",
    "H10P 72/7611",
    "H10P 72/7622",
    "H10W 90/734"
  ],
  "ipc": [
    "B25J 11/00",
    "G01R 31/20",
    "G01R 31/26",
    "G01R 31/28",
    "G01R 31/44",
    "H01L 21/687",
    "H05K 5/00",
    "H05K 5/02"
  ],
  "assignees": [
    "Infineon Technologies AG"
  ],
  "inventors": [
    "Rene Cordes",
    "Christoph Koch",
    "Michael Larisch",
    "Sven Schennetten"
  ],
  "filing_date": "2015-08-19",
  "publication_date": "2018-11-27",
  "grant_date": "2018-11-27",
  "priority_date": "2014-08-21",
  "application_number": "US-201514830333-A",
  "family_id": "55273711",
  "cited_by_count": 5,
  "citations": [
    "US6211462B1",
    "US20030203158A1",
    "US20070134359A1",
    "US20070138466A1",
    "US7793819B2",
    "CN101689018A",
    "US20090236202A1",
    "CN101963647A",
    "US20120293967A1",
    "CN102446910A"
  ]
}