Printable component structure with electrical contact

{
  "publication_number": "US2017047303A1",
  "country": "US",
  "kind": "A1",
  "title": "Printable component structure with electrical contact",
  "abstract": "A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.",
  "claims": [
    "1. A printable component, comprising: a semiconductor structure with a top side and a bottom side; one or more top electrical contacts on the top side of the semiconductor structure; one or more bottom electrical contacts exposed on the bottom side of the semiconductor structure; and one or more electrically conductive spikes in electrical contact with the one or more top electrical contacts, wherein each spike protrudes from the top side of the semiconductor structure and forms an exposed electrical contact. 2 - 6. (canceled) 7. The printable component of claim 1, wherein the semiconductor structure is a multi-layer semiconductor structure having sub-layers. 8. The printable component of claim 1, wherein the semiconductor sub-layers comprises one or more members selected from the group consisting of one or more of a doped semiconductor layer, an n-doped semiconductor layer, and a p-doped semiconductor layer. 9 - 11. (canceled) 12. The printable component of claim 1, wherein the spike is a multi-layer spike having a spike coated with an electrically conductive spike layer. 13. (canceled) 14. The printable component of claim 1, comprising one or more electrically conductive bottom spikes in electrical contact with the one or more bottom electrical contacts, wherein each bottom spike protrudes from the bottom side of the semiconductor structure. 15 - 20. (canceled) 21. A printed structure, comprising: a destination substrate and one or more backplane electrical contacts; and one or more printable components of any one of claims 1 to 20, wherein the backplane electrical contacts are electrically connected to the bottom electrical contacts. 22. The printed structure of claim 21, wherein two or more bottom electrical contacts are electrically connected to a common backplane electrical contact. 23. The printed structure of claim 21, wherein the spike is a multi-layer spike having a spike material coated with an electrically conductive spike layer. 24. The printed structure of claim 21, comprising an insulator disposed over at least a portion of the destination substrate and at least a portion of the printable component structure, and exposing a portion of the spike. 25. The printed structure of claim 24, comprising a conductor disposed over at least a portion of the insulator and in electrical contact with the spike. 26. The printed structure of claim 25, comprising a plurality of the printable component structures of claim 1, an insulator disposed over at least a portion of each of the printable component structures and exposing a portion of each of the spikes, and the conductor in electrical contact with each of the spikes. 27. (canceled) 28. The printed structure of claim 21, comprising one or more electrically conductive bottom spikes in electrical contact with the one or more bottom electrical contacts, wherein each bottom spike protrudes from the bottom side of the semiconductor structure and is electrically connected to a bottom electrical contact. 29 - 30. (canceled) 31. A method of making a printed structure, comprising: providing one or more printable component structures according to claim 1 on a source substrate; providing a destination substrate having one or more backplane electrical contacts; micro transfer printing the one or more printable component structures from the source substrate onto the destination substrate; disposing an insulator over at least a portion of each of the one or more printable component structures; and disposing a conductor over at least a portion of the insulator and over at least a portion of the one or more spikes so that the conductor is in electrical contact with the one or more spikes of each of the one or more printable component structures. 32. The method of claim 31, wherein the spike protrudes from the insulator after the insulator is disposed over at least a portion of each of the one or more printable component structures. 33. The method of claim 31, comprising: contacting the stamp to the source wafer, wherein a pillar of the stamp is displaced when placed in contact with the spike of the printable component structure on the source wafer; and removing the stamp from the source wafer to release and align the printable component structure. 34. The method of claim 31, comprising blanket etching the dielectric to expose the spike. 35 - 42. (canceled) 43. A stamp for micro transfer printing, comprising: a body; and one or more pillars extending from the body, each pillar having a structured pillar surface at an side of the pillar opposite the body, wherein the structured surface has a first planar portion and a second recessed portion. 44 - 46. (canceled) 47. The stamp of claim 43, wherein the stamp comprises at least one of more than one hundred, one thousand, ten thousand, or ten million pillars. 48 - 57. (canceled) 58. A printed structure, comprising: a destination substrate; a printable component comprising a semiconductor structure with a top side and a bottom side, the bottom side of the printable component disposed on the destination substrate; and one or more electrically conductive spikes protruding from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure and each spike forming an exposed electrical contact. 59 - 68. (canceled) 69. The printed structure of claim 1, wherein one or more spikes are located closer to an end of the printable component structures than to the center of the printable component structures or one or more of the bottom electrical contacts are located closer to an end of the printable component structures than to the center."
  ],
  "description_excerpt": "The present invention relates to structures and methods for electrically interconnecting chiplets using micro transfer printing.\n\nSubstrates with electronically active components distributed over the extent of the substrate may be used in a variety of electronic systems, including flat-panel imaging devices, such as flat-panel liquid crystal or organic light emitting diode (OLED) display devices, and flat-panel solar cells. A variety of methods may be used to distribute electronically active circuits over substrates, including forming the electronically active circuits on a substrate and forming the components on separate substrates and placing them on a substrate. In the latter case, a variety of assembly technologies for device packaging may be used.\n\nThe electronically active components are typically formed on a substrate by sputtering a layer of inorganic semiconductor material or by spin-coating organic material over the entire substrate. Inorganic semiconductor materials can be processed to improve their electronic characteristics, for example amorphous silicon can be treated to form low-temperature or high-temperature poly-crystalline silicon. In other process methods, microcrystalline semiconductor layers can be formed by using an underlying seeding layer. These methods typically improve the electron mobility of the semiconductor layer. The substrate and layer of semiconductor material can be photo-lithographically processed to define electronically active components, such as transistors.",
  "cpc": [
    "H05K 1/112",
    "G03F 7/70283",
    "H01L 2224/1144",
    "H01L 2224/13017",
    "H01L 2224/13023",
    "H01L 2224/1357",
    "H01L 2224/1418",
    "H01L 2224/17107",
    "H01L 24/11",
    "H01L 24/13",
    "H01L 24/14",
    "H01L 24/17",
    "H05K 2201/09409",
    "H05K 2201/09472",
    "H05K 2201/0979",
    "H05K 2201/10143",
    "H05K 3/305",
    "H05K 3/3436",
    "H10W 70/05",
    "H10W 72/01215",
    "H10W 72/01231",
    "H10W 72/01236",
    "H10W 72/01253",
    "H10W 72/0198",
    "H10W 72/071",
    "H10W 72/072",
    "H10W 72/07207",
    "H10W 72/07236",
    "H10W 72/07254",
    "H10W 72/20",
    "H10W 72/223",
    "H10W 72/227",
    "H10W 72/234",
    "H10W 72/241",
    "H10W 72/242",
    "H10W 72/244",
    "H10W 72/247",
    "H10W 72/248",
    "H10W 72/252",
    "H10W 72/255",
    "H10W 72/29",
    "H10W 72/90",
    "H10W 90/724",
    "H10W 99/00",
    "Y02P 70/50"
  ],
  "ipc": [
    "G03F 7/20",
    "H01L 23/00",
    "H05K 1/11",
    "H05K 3/34"
  ],
  "assignees": [
    "X Celeprint Ltd"
  ],
  "inventors": [
    "Matthew Meitl",
    "Christopher Bower",
    "Ronald S. Cok"
  ],
  "filing_date": "2015-08-11",
  "publication_date": "2017-02-16",
  "priority_date": "2015-08-10",
  "application_number": "US-201514823917-A",
  "family_id": "57995809",
  "cited_by_count": 42,
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}