Mounting member

{
  "publication_number": "US10777446B2",
  "country": "US",
  "kind": "B2",
  "title": "Mounting member",
  "abstract": "Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 μm or more transferred onto the silicon wafer is 100 particles/cm 2 or less.",
  "claims": [
    "1. A mounting member, comprising an aggregate of carbon nanotubes for forming a mounting surface, wherein the mounting surface is a carbon nanotube aggregate-side surface, wherein a ratio of a plain view area of recessed portions occurring in the carbon nanotube aggregate-side surface to a total area of the carbon nanotube aggregate-side surface is 5% or less, and wherein if the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 μm or more transferred onto the silicon wafer is 9,000 particles/cm 2 or less.",
    "2. The mounting member according to claim 1, further comprising a substrate, wherein the aggregate of the carbon nanotubes is fixed to the substrate.",
    "3. The mounting member according to claim 1, wherein the carbon nanotube aggregate-side surface has a coefficient of static friction against a glass surface of 2.0 or more.",
    "4. The mounting member according to claim 1, wherein an average of diameters of the carbon nanotubes is from 1 nm to 800 nm.",
    "5. The mounting member according to claim 1, wherein a portion including a tip of each of the carbon nanotubes is covered with an inorganic material.",
    "6. The mounting member according to claim 1, wherein the mounting member is used in transport of a semiconductor part."
  ],
  "description_excerpt": "The present invention relates to a mounting member.\n\nIn transporting a material, a production intermediate, a product, or the like (hereinafter sometimes referred to as “object to be processed”) in a manufacturing process for a semiconductor device or the like, the object to be processed is transported through use of a carrying member, such as a movable arm or a movable table (see, for example, Patent Literatures 1 and 2). In such transport, there is a demand for a member on which the object to be processed is to be mounted (mounting member) to have such a strong gripping force as to prevent the object to be processed from shifting in position while being transported. In addition, such demand has increased year by year along with a demand for a faster manufacturing process.\n\nHowever, a related-art mounting member is formed of an elastic material, such as a resin, and has a problem in that the elastic material is liable to adhere and remain on the object to be processed and contaminates the object to be processed. In addition, the mounting member formed of the elastic material, such as a resin, has low heat resistance, and has a problem in that its gripping force is reduced under a high temperature environment.\n\nWhen a material such as ceramics is used for the mounting member, contamination of the object to be processed is prevented, and temperature dependence of a gripping force is reduced. However, a mounting member formed of such material has a problem of inherently having a weak gripping force, and being unable to sufficiently retain the object to be processed even at normal temperature.",
  "cpc": [
    "H10P 72/7616",
    "B65G 49/07",
    "B82Y 30/00",
    "B82Y 40/00",
    "C01B 2202/36",
    "C01B 32/158",
    "C01B 32/16",
    "C01P 2004/50",
    "H01L 21/677",
    "H01L 21/683",
    "H01L 21/68757",
    "H10K 85/221",
    "H10P 14/3464",
    "H10P 72/30",
    "H10P 72/70"
  ],
  "ipc": [
    "B65G 49/07",
    "B82Y 30/00",
    "B82Y 40/00",
    "C01B 32/158",
    "C01B 32/16",
    "H01L 21/677",
    "H01L 21/683",
    "H01L 21/687",
    "H10K 99/00"
  ],
  "assignees": [
    "Nitto Denko Corp"
  ],
  "inventors": [
    "Shotaro Masuda",
    "Tomoaki Ichikawa",
    "Yohei Maeno"
  ],
  "filing_date": "2017-01-10",
  "publication_date": "2020-09-15",
  "grant_date": "2020-09-15",
  "priority_date": "2016-01-15",
  "application_number": "US-201716069942-A",
  "family_id": "59311010",
  "cited_by_count": 0,
  "citations": [
    "JP2001351961A",
    "US20040184981A1",
    "US20060068195A1",
    "US20090130372A1",
    "US20100170533A1",
    "EP2051289A1",
    "JP2008140949A",
    "US20080216565A1",
    "WO2008152940A1",
    "EP2266921A1",
    "EP2269951A1",
    "US8025971B2",
    "US8827339B2",
    "US9218917B2",
    "US9795994B2",
    "US9731422B2",
    "JP2013138152A",
    "US9279828B2",
    "US9606041B2",
    "US20150174768A1",
    "US9698035B2",
    "JP2015135963A",
    "US9343350B2",
    "JP2015201638A",
    "US20150287626A1",
    "WO2016027601A1",
    "US20170263494A1",
    "US20170271193A1"
  ]
}