MLchartDataset catalogue

Patent · US10685832B1 · B1 · US

Substrate processing apparatus

(11) Publication number
US10685832B1
(21) Application number
16/557,442
(22) Filing date
2019-08-30
(30) Priority date
2019-03-12
(43) Publication date
2020-06-16
(45) Date of grant
2020-06-16
(52) CPC
  • H10P Generic processes or apparatus for the manufacture or treatment of devices covered by class H10: 14/6334, 14/6512, 14/6681, 14/6903, 72/0402, 72/0431, 72/0432, 72/0434, 72/3311, 72/7618, 72/7621, 72/7624, 95/90
  • C23C Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general: 16/345, 16/4401, 16/45517, 16/45527, 16/45551, 16/45553, 16/4584, 16/4585, 16/4586, 16/46
  • H01L Electric elements: 21/02123, 21/02208, 21/02271, 21/67754
(73) Assignee
KOKUSAI ELECTRIC CORP
(54) Title
Substrate processing apparatus
(57) Abstract

There is provided a technique that includes a metal container including a process chamber configured to process a substrate, a substrate mounting plate rotatably installed in the container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface thereof, a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces, a heat attenuator installed between the heater and the container, a gas supply part configured to supply a gas to the process chamber, and a support part configured to rotate the substrate mounting plate.

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Claims (8)

  1. A substrate processing apparatus, comprising: a metal container including a process chamber configured to process a substrate; a substrate mounting plate rotatably installed in the metal container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface of the substrate mounting plate; a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces; a heat attenuator installed between the heater and the metal container; a gas supply part configured to supply a gas to the process chamber; and a support part configured to rotate the substrate mounting plate, and including: a metal core portion configured to fix the substrate mounting plate; and a second cover disposed between the metal core portion and the process chamber, wherein the heat attenuator is installed on the second cover and configured to be adjacent to the metal core portion via a space.
  2. The apparatus of claim 1, wherein a heater unit, which is isolated from an atmosphere in the process chamber and constituted with a metal wall, a quartz window and the heater, is installed at a bottom portion of the metal container.
  3. The apparatus of claim 2, wherein a metal exhaust structure and a first cover adjacent to the metal exhaust structure are installed at the bottom portion of the metal container.
  4. The apparatus of claim 3, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover.
  5. The apparatus of claim 2, wherein the heat attenuator is configured as a cover coated with fine quartz particles on a surface of the cover.
  6. The apparatus of claim 1, wherein a metal exhaust structure and a first cover adjacent to the metal exhaust structure are installed at a bottom portion of the metal container.
  7. The apparatus of claim 6, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover.
  8. The apparatus of claim 1, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover.

Citations (5)

  • JP2013084898A
  • US2013078823A1
  • US2016032457A1
  • US2016379868A1
  • US2018374672A1
Record as JSON
{
  "publication_number": "US10685832B1",
  "country": "US",
  "kind": "B1",
  "title": "Substrate processing apparatus",
  "abstract": "There is provided a technique that includes a metal container including a process chamber configured to process a substrate, a substrate mounting plate rotatably installed in the container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface thereof, a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces, a heat attenuator installed between the heater and the container, a gas supply part configured to supply a gas to the process chamber, and a support part configured to rotate the substrate mounting plate.",
  "claims": [
    "1. A substrate processing apparatus, comprising: a metal container including a process chamber configured to process a substrate; a substrate mounting plate rotatably installed in the metal container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface of the substrate mounting plate; a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces; a heat attenuator installed between the heater and the metal container; a gas supply part configured to supply a gas to the process chamber; and a support part configured to rotate the substrate mounting plate, and including: a metal core portion configured to fix the substrate mounting plate; and a second cover disposed between the metal core portion and the process chamber, wherein the heat attenuator is installed on the second cover and configured to be adjacent to the metal core portion via a space.",
    "2. The apparatus of claim 1, wherein a heater unit, which is isolated from an atmosphere in the process chamber and constituted with a metal wall, a quartz window and the heater, is installed at a bottom portion of the metal container.",
    "3. The apparatus of claim 2, wherein a metal exhaust structure and a first cover adjacent to the metal exhaust structure are installed at the bottom portion of the metal container.",
    "4. The apparatus of claim 3, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover.",
    "5. The apparatus of claim 2, wherein the heat attenuator is configured as a cover coated with fine quartz particles on a surface of the cover.",
    "6. The apparatus of claim 1, wherein a metal exhaust structure and a first cover adjacent to the metal exhaust structure are installed at a bottom portion of the metal container.",
    "7. The apparatus of claim 6, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover.",
    "8. The apparatus of claim 1, wherein the heat attenuator is constituted as a cover coated with fine quartz particles on a surface of the cover."
  ],
  "cpc": [
    "H10P 14/6334",
    "C23C 16/345",
    "C23C 16/4401",
    "C23C 16/45517",
    "C23C 16/45527",
    "C23C 16/45551",
    "C23C 16/45553",
    "C23C 16/4584",
    "C23C 16/4585",
    "C23C 16/4586",
    "C23C 16/46",
    "H01L 21/02123",
    "H01L 21/02208",
    "H01L 21/02271",
    "H01L 21/67754",
    "H10P 14/6512",
    "H10P 14/6681",
    "H10P 14/6903",
    "H10P 72/0402",
    "H10P 72/0431",
    "H10P 72/0432",
    "H10P 72/0434",
    "H10P 72/3311",
    "H10P 72/7618",
    "H10P 72/7621",
    "H10P 72/7624",
    "H10P 95/90"
  ],
  "assignees": [
    "KOKUSAI ELECTRIC CORP"
  ],
  "filing_date": "2019-08-30",
  "publication_date": "2020-06-16",
  "grant_date": "2020-06-16",
  "priority_date": "2019-03-12",
  "application_number": "US-201916557442-A",
  "family_id": "71075225",
  "citations": [
    "JP2013084898A",
    "US2013078823A1",
    "US2016032457A1",
    "US2016379868A1",
    "US2018374672A1"
  ]
}

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