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Patent · US2024057464A1 · A1 · US

Manufacturing equipment for light-emitting device

(11) Publication number
US2024057464A1
(21) Application number
18/260,841
(22) Filing date
2022-01-07
(30) Priority date
2021-01-14
(43) Publication date
2024-02-15
(51) IPC
C23C 14/56; C23C 16/54; G03F 7/00; H01L 21/67; H10K 71/00
(52) CPC
  • H10P Generic processes or apparatus for the manufacture or treatment of devices covered by class H10: 72/0454, 72/0461, 72/0466, 72/30, 72/72, 72/7602, 72/78
  • B65G Transport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors: 49/07
  • C23C Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general: 14/56, 14/566, 16/54
  • G03F Photomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; materials therefor; originals therefor; apparatus specially adapted therefor: 7/0005
  • G09F Displaying; advertising; signs; labels or name-plates; seals: 9/00
  • H01L Semiconductor devices; electric solid state devices not otherwise provided for: 21/67167, 21/67184, 21/68707
  • H05B Electric heating; electric light sources not otherwise provided for; circuit arrangements for electric light sources, in general: 33/02, 33/10
  • H10K Organic electric solid-state devices: 59/1201, 59/35, 59/873, 71/16, 71/233, 71/811
(73) Assignee
Semiconductor Energy Laboratory Co Ltd
(72) Inventors
Shingo Eguchi; Hiroki Adachi; Kenichi Okazaki; Yasumasa Yamane; Naoto Kusumoto; Kensuke Yoshizumi; Shunpei Yamazaki
(54) Title
Manufacturing equipment for light-emitting device
(57) Abstract

Manufacturing equipment of a light-emitting device with which steps from formation to sealing of a light-emitting element can be successively performed can be provided. In the manufacturing equipment of a light-emitting device, a deposition step, a lithography step, an etching step, and a sealing step by forming a protective layer for forming an organic EL element can be successively performed, whereby a downscaled organic EL element achieving high luminance and high reliability can be formed. Moreover, the manufacturing equipment can have an in-line system where apparatuses are arranged in the order of process steps for the light-emitting device, resulting in high throughput manufacturing.

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Claims (1)

  1. A manufacturing equipment of a light-emitting device, comprising: a first cluster to an eleventh cluster and a first loadlock chamber to a tenth loadlock chamber, wherein the first cluster is connected to the second cluster through the first loadlock chamber, wherein the second cluster is connected to the third cluster through the second loadlock chamber, wherein the third cluster is connected to the fourth cluster through the third loadlock chamber, wherein the fourth cluster is connected to the fifth cluster through the fourth loadlock chamber, wherein the fifth cluster is connected to the sixth cluster through the fifth loadlock chamber, wherein the sixth cluster is connected to the seventh cluster through the sixth loadlock chamber, wherein the seventh cluster is connected to the eighth cluster through the seventh loadlock chamber, wherein the eighth cluster is connected to the ninth cluster through the eighth loadlock chamber, wherein the ninth cluster is connected to the tenth cluster through the ninth loadlock chamber, wherein the tenth cluster is connected to the eleventh cluster through the tenth loadlock chamber, wherein each of the first cluster, the third cluster, the fourth cluster, the sixth cluster, the seventh cluster, the ninth cluster and the eleventh cluster is independently connected to a vacuum pump to reduce each pressure, wherein each of atmospheres in the second cluster, the fifth cluster, the eighth cluster and the tenth cluster is independently connected to an inert gas atmosphere, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises a first carrying device and a first plurality of deposition apparatuses, wherein each of the third cluster, the sixth cluster and the ninth cluster independently comprises a second carrying device, an etching apparatus and an ashing apparatus, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises a third carrying device and a plurality of apparatuses to perform lithography, wherein the tenth cluster comprises a fourth carrying device and an etching apparatus, wherein the eleventh cluster comprises a fifth carrying device and a second plurality of deposition apparatuses, wherein the first carrying device comprises a substrate fixing portion, and wherein the first carrying device has a mechanism of rotating the substrate fixing portion to reverse a substrate. 2 - 14. (canceled) 15. The manufacturing equipment of a light-emitting device according to claim 1, further comprising a twelfth cluster and an eleventh loadlock chamber, wherein the twelfth cluster is connected to the first cluster through the eleventh loadlock chamber, wherein an atmosphere in the twelfth cluster is connected to an inert gas atmosphere, and wherein the twelfth cluster comprises a cleaning apparatus and a baking apparatus. 16. The manufacturing equipment of a light-emitting device according to claim 15, wherein the twelfth cluster comprises a load chamber, and wherein the eleventh cluster comprises an unload chamber. 17. The manufacturing equipment of a light-emitting device, according to claim 1, further comprising a thirteenth cluster, a fourteenth cluster, a twelfth loadlock chamber and a thirteenth loadlock chamber, wherein the thirteenth cluster is connected to the third cluster through the third loadlock chamber, wherein the thirteenth cluster is connected to the fourth cluster through the twelfth loadlock chamber, wherein the fourteenth cluster is connected to the sixth cluster through the sixth loadlock chamber, wherein the fourteenth cluster is connected to the seventh cluster through the thirteenth loadlock chamber, wherein each of atmospheres in the thirteenth cluster and the fourteenth cluster is independently connected to an inert gas atmosphere, and wherein each of the thirteenth cluster and the fourteenth cluster independently comprises a cleaning apparatus and a baking apparatus. 18. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises one or more of an evaporation apparatus, a sputtering apparatus, a chemical vapor deposition apparatus and an atomic layer deposition apparatus. 19. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the third cluster, the sixth cluster and the ninth cluster comprises a dry etching apparatus. 20. The manufacturing equipment of a light-emitting device according to claim 1, wherein the tenth cluster comprises a wet etching apparatus. 21. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises an application apparatus, a light-exposure apparatus, a developing apparatus and a baking apparatus in the plurality of apparatuses to perform lithography. 22. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the second cluster, the fifth cluster and the eighth cluster independently further comprises an application apparatus and a nanoimprint apparatus in the plurality of apparatuses to perform lithography. 23. The manufacturing equipment of a light-emitting device according to claim 1, wherein the manufacturing equipment is configured to manufacture a light-emitting device on a silicon wafer. 24. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the first plurality of deposition apparatuses comprises an alignment mechanism and a mask jig, and wherein the alignment mechanism has a mechanism of attaching a substrate to the mask jig. 25. A manufacturing equipment of a light-emitting device, comprising: a first cluster to an eleventh cluster and a first loadlock chamber to a tenth loadlock chamber, wherein the first cluster is connected to the second cluster through the first loadlock chamber, wherein the second cluster is connected to the third cluster through the second loadlock chamber, wherein the third cluster is connected to the fourth cluster through the third loadlock chamber, wherein the fourth cluster is connected to the fifth cluster through the fourth loadlock chamber, wherein the fifth cluster is connected to the sixth cluster through the fifth loadlock chamber, wherein the sixth cluster is connected to the seventh cluster through the sixth loadlock chamber, wherein the seventh cluster is connected to the eighth cluster through the seventh loadlock chamber, wherein the eighth cluster is connected to the ninth cluster through the eighth loadlock chamber, wherein the ninth cluster is connected to the tenth cluster through the ninth loadlock chamber, wherein the tenth cluster is connected to the eleventh cluster through the tenth loadlock chamber, wherein the first cluster, the third cluster, the fourth cluster, the sixth cluster, the seventh cluster, the ninth cluster and the eleventh cluster is independently connected to a vacuum pump to reduce each pressure, wherein each of atmospheres in the second cluster, the fifth cluster, the eighth cluster and the tenth cluster is connected to inert gas atmospheres, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises a first carrying device, a substrate transfer device and a first plurality of deposition apparatuses, wherein each of the third cluster, the sixth cluster and the ninth cluster independently comprises a second carrying device, an etching apparatus and an ashing apparatus, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises a third carrying device and a plurality of apparatuses to perform lithography, wherein the tenth cluster comprises a fourth carrying device and an etching apparatus, wherein the eleventh cluster comprises a fifth carrying device and a second plurality of deposition apparatuses, and in each of the first cluster, the fourth cluster and the seventh cluster: wherein the substrate transfer device comprises a stage, a sixth carrying device and a seventh carrying device; wherein the stage has a place to place a mask jig on the stage; wherein the first carrying device is configure to carry the mask jig; wherein the sixth carrying device has a mechanism of reversing a substrate to be mounted and a mechanism of mounting the substrate on the mask jig; and wherein the seventh carrying device has a mechanism of taking out the substrate from being mounted on the mask jig and a mechanism of reversing the substrate. 26. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first cluster, the fourth cluster and the seventh cluster has an alignment mechanism, in each of the first cluster, the fourth cluster and the seventh cluster: wherein the substrate transfer device comprises a camera; wherein the sixth carrying device has a substrate rotation mechanism; and wherein the alignment mechanism is configured to adjust a position of the substrate by using the camera and the substrate rotation mechanism in order to mount the substrate on the mask jig. 27. The manufacturing equipment of a light-emitting device according to claim 26, wherein the mask jig is configured to mount a plurality of substrates. 28. The manufacturing equipment of a light-emitting device according to claim 25, further comprising a twelfth cluster and an eleventh loadlock chamber, wherein the twelfth cluster is connected to the first cluster through the eleventh loadlock chamber, wherein an atmosphere in the twelfth cluster is connected to an inert gas atmosphere, and wherein the twelfth cluster comprises a cleaning apparatus and a baking apparatus. 29. The manufacturing equipment of a light-emitting device according to claim 28, wherein the twelfth cluster comprises a load chamber, and wherein the eleventh cluster comprises an unload chamber. 30. The manufacturing equipment of a light-emitting device, according to claim 25, further comprising a thirteenth cluster, a fourteenth cluster, a twelfth loadlock chamber and a thirteenth loadlock chamber, wherein the thirteenth cluster is connected to the third cluster through the third loadlock chamber, wherein the thirteenth cluster is connected to the fourth cluster through the twelfth loadlock chamber, wherein the fourteenth cluster is connected to the sixth cluster through the sixth loadlock chamber, wherein the fourteenth cluster is connected to the seventh cluster through the thirteenth loadlock chamber, wherein each of atmospheres in the thirteenth cluster and the fourteenth cluster is independently connected to an inert gas atmosphere, and wherein each of the thirteenth cluster and the fourteenth cluster independently comprises a cleaning apparatus and a baking apparatus. 31. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises one or more of an evaporation apparatus, a sputtering apparatus, a chemical vapor deposition apparatus and an atomic layer deposition apparatus. 32. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the third cluster, the sixth cluster and the ninth cluster comprises a dry etching apparatus. 33. The manufacturing equipment of a light-emitting device according to claim 25, wherein the tenth cluster comprises a wet etching apparatus. 34. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises an application apparatus, a light-exposure apparatus, a developing apparatus and a baking apparatus in the plurality of apparatuses to perform lithography. 35. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the second cluster, the fifth cluster and the eighth cluster independently further comprises an application apparatus and a nanoimprint apparatus in the plurality of apparatuses to perform lithography. 36. The manufacturing equipment of a light-emitting device according to claim 25, wherein the manufacturing equipment is configured to manufacture a light-emitting device on a silicon wafer. 37. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first plurality of deposition apparatuses comprises an alignment mechanism and a mask jig, and wherein the alignment mechanism has a mechanism of attaching a substrate to the mask jig.

Description

One embodiment of the present invention relates to manufacturing equipment and a manufacturing method of a light-emitting device.

Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. One embodiment of the present invention relates to a process, a machine, manufacture, or a composition of matter. Accordingly, more specific examples of the technical field of one embodiment of the present invention disclosed in this specification include a semiconductor device, a display device, a liquid crystal display device, a light-emitting apparatus, a lighting device, a power storage device, a memory device, an image capturing device, an operation method thereof, and a manufacturing method thereof.

In recent years, higher-resolution display panels have been required. Examples of devices that require high-resolution display panels include a smartphone, a tablet terminal, and a notebook computer. Furthermore, higher resolution has been required for a stationary display device such as a television device or a monitor device along with an increase in definition. An example of a device required to have the highest resolution is a device for virtual reality (VR) or augmented reality (AR).

Citations (5)

  • US20020132396A1
  • US20050102064A1
  • US20080219812A1
  • US20180230624A1
  • US20190006238A1
Record as JSON
{
  "publication_number": "US2024057464A1",
  "country": "US",
  "kind": "A1",
  "title": "Manufacturing equipment for light-emitting device",
  "abstract": "Manufacturing equipment of a light-emitting device with which steps from formation to sealing of a light-emitting element can be successively performed can be provided. In the manufacturing equipment of a light-emitting device, a deposition step, a lithography step, an etching step, and a sealing step by forming a protective layer for forming an organic EL element can be successively performed, whereby a downscaled organic EL element achieving high luminance and high reliability can be formed. Moreover, the manufacturing equipment can have an in-line system where apparatuses are arranged in the order of process steps for the light-emitting device, resulting in high throughput manufacturing.",
  "claims": [
    "1. A manufacturing equipment of a light-emitting device, comprising: a first cluster to an eleventh cluster and a first loadlock chamber to a tenth loadlock chamber, wherein the first cluster is connected to the second cluster through the first loadlock chamber, wherein the second cluster is connected to the third cluster through the second loadlock chamber, wherein the third cluster is connected to the fourth cluster through the third loadlock chamber, wherein the fourth cluster is connected to the fifth cluster through the fourth loadlock chamber, wherein the fifth cluster is connected to the sixth cluster through the fifth loadlock chamber, wherein the sixth cluster is connected to the seventh cluster through the sixth loadlock chamber, wherein the seventh cluster is connected to the eighth cluster through the seventh loadlock chamber, wherein the eighth cluster is connected to the ninth cluster through the eighth loadlock chamber, wherein the ninth cluster is connected to the tenth cluster through the ninth loadlock chamber, wherein the tenth cluster is connected to the eleventh cluster through the tenth loadlock chamber, wherein each of the first cluster, the third cluster, the fourth cluster, the sixth cluster, the seventh cluster, the ninth cluster and the eleventh cluster is independently connected to a vacuum pump to reduce each pressure, wherein each of atmospheres in the second cluster, the fifth cluster, the eighth cluster and the tenth cluster is independently connected to an inert gas atmosphere, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises a first carrying device and a first plurality of deposition apparatuses, wherein each of the third cluster, the sixth cluster and the ninth cluster independently comprises a second carrying device, an etching apparatus and an ashing apparatus, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises a third carrying device and a plurality of apparatuses to perform lithography, wherein the tenth cluster comprises a fourth carrying device and an etching apparatus, wherein the eleventh cluster comprises a fifth carrying device and a second plurality of deposition apparatuses, wherein the first carrying device comprises a substrate fixing portion, and wherein the first carrying device has a mechanism of rotating the substrate fixing portion to reverse a substrate. 2 - 14. (canceled) 15. The manufacturing equipment of a light-emitting device according to claim 1, further comprising a twelfth cluster and an eleventh loadlock chamber, wherein the twelfth cluster is connected to the first cluster through the eleventh loadlock chamber, wherein an atmosphere in the twelfth cluster is connected to an inert gas atmosphere, and wherein the twelfth cluster comprises a cleaning apparatus and a baking apparatus. 16. The manufacturing equipment of a light-emitting device according to claim 15, wherein the twelfth cluster comprises a load chamber, and wherein the eleventh cluster comprises an unload chamber. 17. The manufacturing equipment of a light-emitting device, according to claim 1, further comprising a thirteenth cluster, a fourteenth cluster, a twelfth loadlock chamber and a thirteenth loadlock chamber, wherein the thirteenth cluster is connected to the third cluster through the third loadlock chamber, wherein the thirteenth cluster is connected to the fourth cluster through the twelfth loadlock chamber, wherein the fourteenth cluster is connected to the sixth cluster through the sixth loadlock chamber, wherein the fourteenth cluster is connected to the seventh cluster through the thirteenth loadlock chamber, wherein each of atmospheres in the thirteenth cluster and the fourteenth cluster is independently connected to an inert gas atmosphere, and wherein each of the thirteenth cluster and the fourteenth cluster independently comprises a cleaning apparatus and a baking apparatus. 18. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises one or more of an evaporation apparatus, a sputtering apparatus, a chemical vapor deposition apparatus and an atomic layer deposition apparatus. 19. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the third cluster, the sixth cluster and the ninth cluster comprises a dry etching apparatus. 20. The manufacturing equipment of a light-emitting device according to claim 1, wherein the tenth cluster comprises a wet etching apparatus. 21. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises an application apparatus, a light-exposure apparatus, a developing apparatus and a baking apparatus in the plurality of apparatuses to perform lithography. 22. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the second cluster, the fifth cluster and the eighth cluster independently further comprises an application apparatus and a nanoimprint apparatus in the plurality of apparatuses to perform lithography. 23. The manufacturing equipment of a light-emitting device according to claim 1, wherein the manufacturing equipment is configured to manufacture a light-emitting device on a silicon wafer. 24. The manufacturing equipment of a light-emitting device according to claim 1, wherein each of the first plurality of deposition apparatuses comprises an alignment mechanism and a mask jig, and wherein the alignment mechanism has a mechanism of attaching a substrate to the mask jig. 25. A manufacturing equipment of a light-emitting device, comprising: a first cluster to an eleventh cluster and a first loadlock chamber to a tenth loadlock chamber, wherein the first cluster is connected to the second cluster through the first loadlock chamber, wherein the second cluster is connected to the third cluster through the second loadlock chamber, wherein the third cluster is connected to the fourth cluster through the third loadlock chamber, wherein the fourth cluster is connected to the fifth cluster through the fourth loadlock chamber, wherein the fifth cluster is connected to the sixth cluster through the fifth loadlock chamber, wherein the sixth cluster is connected to the seventh cluster through the sixth loadlock chamber, wherein the seventh cluster is connected to the eighth cluster through the seventh loadlock chamber, wherein the eighth cluster is connected to the ninth cluster through the eighth loadlock chamber, wherein the ninth cluster is connected to the tenth cluster through the ninth loadlock chamber, wherein the tenth cluster is connected to the eleventh cluster through the tenth loadlock chamber, wherein the first cluster, the third cluster, the fourth cluster, the sixth cluster, the seventh cluster, the ninth cluster and the eleventh cluster is independently connected to a vacuum pump to reduce each pressure, wherein each of atmospheres in the second cluster, the fifth cluster, the eighth cluster and the tenth cluster is connected to inert gas atmospheres, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises a first carrying device, a substrate transfer device and a first plurality of deposition apparatuses, wherein each of the third cluster, the sixth cluster and the ninth cluster independently comprises a second carrying device, an etching apparatus and an ashing apparatus, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises a third carrying device and a plurality of apparatuses to perform lithography, wherein the tenth cluster comprises a fourth carrying device and an etching apparatus, wherein the eleventh cluster comprises a fifth carrying device and a second plurality of deposition apparatuses, and in each of the first cluster, the fourth cluster and the seventh cluster: wherein the substrate transfer device comprises a stage, a sixth carrying device and a seventh carrying device; wherein the stage has a place to place a mask jig on the stage; wherein the first carrying device is configure to carry the mask jig; wherein the sixth carrying device has a mechanism of reversing a substrate to be mounted and a mechanism of mounting the substrate on the mask jig; and wherein the seventh carrying device has a mechanism of taking out the substrate from being mounted on the mask jig and a mechanism of reversing the substrate. 26. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first cluster, the fourth cluster and the seventh cluster has an alignment mechanism, in each of the first cluster, the fourth cluster and the seventh cluster: wherein the substrate transfer device comprises a camera; wherein the sixth carrying device has a substrate rotation mechanism; and wherein the alignment mechanism is configured to adjust a position of the substrate by using the camera and the substrate rotation mechanism in order to mount the substrate on the mask jig. 27. The manufacturing equipment of a light-emitting device according to claim 26, wherein the mask jig is configured to mount a plurality of substrates. 28. The manufacturing equipment of a light-emitting device according to claim 25, further comprising a twelfth cluster and an eleventh loadlock chamber, wherein the twelfth cluster is connected to the first cluster through the eleventh loadlock chamber, wherein an atmosphere in the twelfth cluster is connected to an inert gas atmosphere, and wherein the twelfth cluster comprises a cleaning apparatus and a baking apparatus. 29. The manufacturing equipment of a light-emitting device according to claim 28, wherein the twelfth cluster comprises a load chamber, and wherein the eleventh cluster comprises an unload chamber. 30. The manufacturing equipment of a light-emitting device, according to claim 25, further comprising a thirteenth cluster, a fourteenth cluster, a twelfth loadlock chamber and a thirteenth loadlock chamber, wherein the thirteenth cluster is connected to the third cluster through the third loadlock chamber, wherein the thirteenth cluster is connected to the fourth cluster through the twelfth loadlock chamber, wherein the fourteenth cluster is connected to the sixth cluster through the sixth loadlock chamber, wherein the fourteenth cluster is connected to the seventh cluster through the thirteenth loadlock chamber, wherein each of atmospheres in the thirteenth cluster and the fourteenth cluster is independently connected to an inert gas atmosphere, and wherein each of the thirteenth cluster and the fourteenth cluster independently comprises a cleaning apparatus and a baking apparatus. 31. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first cluster, the fourth cluster and the seventh cluster independently comprises one or more of an evaporation apparatus, a sputtering apparatus, a chemical vapor deposition apparatus and an atomic layer deposition apparatus. 32. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the third cluster, the sixth cluster and the ninth cluster comprises a dry etching apparatus. 33. The manufacturing equipment of a light-emitting device according to claim 25, wherein the tenth cluster comprises a wet etching apparatus. 34. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the second cluster, the fifth cluster and the eighth cluster independently comprises an application apparatus, a light-exposure apparatus, a developing apparatus and a baking apparatus in the plurality of apparatuses to perform lithography. 35. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the second cluster, the fifth cluster and the eighth cluster independently further comprises an application apparatus and a nanoimprint apparatus in the plurality of apparatuses to perform lithography. 36. The manufacturing equipment of a light-emitting device according to claim 25, wherein the manufacturing equipment is configured to manufacture a light-emitting device on a silicon wafer. 37. The manufacturing equipment of a light-emitting device according to claim 25, wherein each of the first plurality of deposition apparatuses comprises an alignment mechanism and a mask jig, and wherein the alignment mechanism has a mechanism of attaching a substrate to the mask jig."
  ],
  "description_excerpt": "One embodiment of the present invention relates to manufacturing equipment and a manufacturing method of a light-emitting device.\n\nNote that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. One embodiment of the present invention relates to a process, a machine, manufacture, or a composition of matter. Accordingly, more specific examples of the technical field of one embodiment of the present invention disclosed in this specification include a semiconductor device, a display device, a liquid crystal display device, a light-emitting apparatus, a lighting device, a power storage device, a memory device, an image capturing device, an operation method thereof, and a manufacturing method thereof.\n\nIn recent years, higher-resolution display panels have been required. Examples of devices that require high-resolution display panels include a smartphone, a tablet terminal, and a notebook computer. Furthermore, higher resolution has been required for a stationary display device such as a television device or a monitor device along with an increase in definition. An example of a device required to have the highest resolution is a device for virtual reality (VR) or augmented reality (AR).",
  "cpc": [
    "H10P 72/0454",
    "B65G 49/07",
    "C23C 14/56",
    "C23C 14/566",
    "C23C 16/54",
    "G03F 7/0005",
    "G09F 9/00",
    "H01L 21/67167",
    "H01L 21/67184",
    "H01L 21/68707",
    "H05B 33/02",
    "H05B 33/10",
    "H10K 59/1201",
    "H10K 59/35",
    "H10K 59/873",
    "H10K 71/16",
    "H10K 71/233",
    "H10K 71/811",
    "H10P 72/0461",
    "H10P 72/0466",
    "H10P 72/30",
    "H10P 72/72",
    "H10P 72/7602",
    "H10P 72/78"
  ],
  "ipc": [
    "C23C 14/56",
    "C23C 16/54",
    "G03F 7/00",
    "H01L 21/67",
    "H10K 71/00"
  ],
  "assignees": [
    "Semiconductor Energy Laboratory Co Ltd"
  ],
  "inventors": [
    "Shingo Eguchi",
    "Hiroki Adachi",
    "Kenichi Okazaki",
    "Yasumasa Yamane",
    "Naoto Kusumoto",
    "Kensuke Yoshizumi",
    "Shunpei Yamazaki"
  ],
  "filing_date": "2022-01-07",
  "publication_date": "2024-02-15",
  "priority_date": "2021-01-14",
  "application_number": "US-202218260841-A",
  "family_id": "82447062",
  "cited_by_count": 0,
  "citations": [
    "US20020132396A1",
    "US20050102064A1",
    "US20080219812A1",
    "US20180230624A1",
    "US20190006238A1"
  ]
}

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