Wafer frame sorter and stocker

{
  "publication_number": "US12300532B2",
  "country": "US",
  "kind": "B2",
  "title": "Wafer frame sorter and stocker",
  "abstract": "A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.",
  "claims": [
    "1. A system, comprising: one or more memories storing software instructions for performing a method for managing storage and transfer of wafer frames; and one or more processors configured to execute the software instructions, the method including: transferring a first wafer frame cassette including a plurality of wafer frames to a first transfer port; transferring, with a robot arm, each wafer frame from the first wafer frame cassette into a respective storage slot of a plurality of storage slots; retrieving, with the robot arm, the wafer frames from their respective storage slots; and transferring, with the robot arm, the wafer frames to a second wafer frame cassette at a second transfer port.",
    "2. The system of claim 1, the method including scanning an identification of each wafer frame received at the first transfer port.",
    "3. The system of claim 2, the method including recording a storage location of each wafer frame.",
    "4. The system of claim 3, the method including controlling a humidity within each storage slot.",
    "5. The system of claim 4, the method including sensing the humidity and outputting a gas responsive to the sensed humidity.",
    "6. A system comprising: a transfer system configured to transfer a first wafer frame cassette including a plurality of wafer frames; a first transfer port configured to receive the first wafer frame cassette from the transfer system; a second transfer port; an array of storage towers including a plurality of storage slots; a control system configured to select a respective storage location for each wafer frame within the array of storage towers; and a robot arm configured to retrieve the wafer frames from the first wafer frame cassette at the first transfer port, wherein the control system is configured to control the robot arm to transfer each wafer frame to the respective storage slot, to select a wafer frame for retrieval from the array of storage towers, to identify the storage location of the selected wafer frame, and to control the robot arm to transfer the selected wafer frame from the corresponding storage spot to a second wafer frame cassette at the second transfer port.",
    "7. The system of claim 1, comprising a scanner configured to read an identity of each of the plurality of wafer frames carried by the wafer frame cassette.",
    "8. The system of claim 7, wherein the control system is configured to record the identity of each wafer frame received at the first transfer port, to control the robot arm, and to record, for each wafer frame, storage address data identifying the storage slot of the wafer frame.",
    "9. The system of claim 6, wherein the plurality of storage towers includes two rows of storage towers, wherein the robot arm is positioned between the two rows.",
    "10. The system of claim 6, wherein each storage tower includes 200 or more storage slots.",
    "11. The system of claim 6, further comprising a manual port, wherein the control system is configured to control the robot arm to retrieve wafer frames from the manual port for storage in the storage towers.",
    "12. The system of claim 6, wherein the first transfer port is an overhead hoist transfer port configured to receive wafer frame cassettes from an overhead hoist transfer system.",
    "13. The system of claim 6, wherein the scanner is a bar code reader configured to read a bar code of each wafer frame at the first transfer port.",
    "14. The system of claim 6, further comprising a humidity control system configured to control a humidity within one or more of the storage slots.",
    "15. The system of claim 14, wherein the humidity control system includes a humidity sensor and a gas output configured to control the humidity by outputting a gas.",
    "16. A method, comprising: transferring, to a first transfer port, a first wafer frame cassette including a plurality of wafer frames; selecting, with the control system, a respective storage location for each wafer frame within an array of storage towers; transferring, with a robot arm under control of the control system, each wafer frame to the respective storage location; selecting, with the control system, a wafer frame for retrieval from the array of storage towers; identifying the storage location of the selected wafer frame; transferring, with the robot arm, the selected wafer frame from the corresponding storage location to a second wafer frame cassette at a second transfer port.",
    "17. The method of claim 16, further comprising: transferring the selected wafer frame from the second transfer port to a dicing station; and dicing, at the dicing station, a semiconductor wafer carried by the selected wafer frame.",
    "18. The method of claim 16, wherein each wafer frame carries a semiconductor wafer.",
    "19. The method of claim 16, wherein the storage towers are arranged in two rows of storage towers, wherein the robot arm is positioned between the two rows of storage towers.",
    "20. The method of claim 16, comprising control a humidity within the array of storage towers."
  ],
  "description_excerpt": "The present disclosure relates to the field of semiconductor processing. The present disclosure relates more particularly to sorting and stocking wafer frames carrying semiconductor wafers.\n\nFabrication of integrated circuits is typically accomplished by performing a large number of processing steps on semiconductor wafers. The processing steps typically result in the formation of a large number of transistors in highly complex arrangements in conjunction with a semiconductor substrate. The processing steps also result in the formation of dielectric layers, metal interconnects, vias, plugs, and other integrated circuit structures and components.\n\nWhen processing of the semiconductor wafer is substantially complete, the semiconductor wafer is loaded onto a wafer frame. After the semiconductor wafer is loaded onto the wafer frame, the semiconductor wafer is diced. After dicing, the semiconductor wafer may remain on the wafer frame during storage or transport. Sorting and storing wafer frames before and after dicing can be problematic due to the potential of misplacement and breakage\n\nFIG. 1 is a block diagram of a wafer frame sorting and stocking system, according to one embodiment.\n\nFIG. 2 is a top view of a wafer frame sorting and stocking system, according to one embodiment.\n\nFIG. 3 is an illustration of a storage tower of a wafer frame sorting and stocking system, according to one embodiment.\n\nFIG. 4 is a perspective view of a wafer frame sorting and stocking system, according to one embodiment.",
  "cpc": [
    "H10P 72/7602",
    "B65G 2201/0297",
    "B65G 47/74",
    "B65G 47/905",
    "H01L 21/67271",
    "H01L 21/67294",
    "H01L 21/6773",
    "H01L 21/67733",
    "H01L 21/67742",
    "H01L 21/67769",
    "H01L 21/68707",
    "H10P 72/0611",
    "H10P 72/0618",
    "H10P 72/18",
    "H10P 72/3218",
    "H10P 72/3221",
    "H10P 72/3302",
    "H10P 72/3402",
    "H10P 72/3404"
  ],
  "ipc": [
    "H01L 21/67",
    "H01L 21/677",
    "H01L 21/687"
  ],
  "assignees": [
    "Taiwan Semiconductor Manufacturing Co TSMC Ltd"
  ],
  "inventors": [
    "Tsung-Sheng Kuo",
    "I-Lun Yang",
    "Chih-Hung Huang",
    "Jiun-Rong Pai",
    "Chung-Hsin Chien",
    "Yang-Ann Chu"
  ],
  "filing_date": "2022-01-12",
  "publication_date": "2025-05-13",
  "grant_date": "2025-05-13",
  "priority_date": "2020-03-02",
  "application_number": "US-202217574302-A",
  "family_id": "77464221",
  "cited_by_count": 0,
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}