Overhead manufacturing, processing and storage system

{
  "publication_number": "US10497596B2",
  "country": "US",
  "kind": "B2",
  "title": "Overhead manufacturing, processing and storage system",
  "abstract": "This disclosure relates generally to substrate and manufacturing system, processes and methods. In one example embodiment, to methods, apparatus, and systems which provides improved substrate processing and manufacturing wherein at least a portion of the system, apparatus or method may be in an overhead system, such as attached to a ceiling or overhead mounts, such that floor space and other efficiencies may be founded.",
  "claims": [
    "1. A substrate processing system comprising: a storage system for storing a plurality of substrates; a processing system for performing at least one action on the plurality of substrates; a loading system for loading and unloading the plurality of substrates to and from the storage system and the processing system; and a transportation system for transporting the substrates between the storage system, the processing system, and the loading system; wherein each of the storage system, the processing system, the loading system, and the transportation system is ceiling mounted.",
    "2. The substrate processing system of claim 1, wherein each of the storage system, the processing system, the loading system, and the transportation system being ceiling mounted reduces a foot print of the substrate processing system.",
    "3. The substrate processing system of claim 1, wherein the storage system includes a high density container and a low density container, wherein the high density container holds substrates at a higher density than the low density container.",
    "4. The substrate processing system of claim 3, wherein the low density container includes a Front Opening Unified Pod (FOUP) container.",
    "5. The substrate processing system of claim 1, wherein the storage system includes an opener station, an ID reading station, a transfer station, or a high density storage.",
    "6. The substrate processing system of claim 1, further comprising an operator station that is located on a floor and that provides access to the storage system, the processing system, the loading system, and the transportation system.",
    "7. The substrate processing system of claim 1, further comprising a controller unit.",
    "8. The substrate processing system of claim 7, wherein the controller unit is a user operable drop down controller.",
    "9. The substrate processing system of claim 8, wherein the user operable drop down controller is configured to move vertically and horizontally in reference to a ceiling.",
    "10. The substrate processing system of claim 8, wherein the user operable drop down controller is configured to be manually pulled down by a user.",
    "11. The substrate processing system of claim 1, wherein the transportation system includes an overhead transportation track (OHT).",
    "12. The substrate processing system of claim 1, wherein the storage system, the processing system, the loading system, and the transportation system are integrated with conventional non-ceiling systems.",
    "13. The substrate processing system of claim 1, wherein space underneath the storage system, the processing system, the loading system, and the transportation system is free for logistical operations.",
    "14. A substrate processing system comprising: a low density container; and a high density container that holds substrates at a higher density than the low density container; a storage system for storing a plurality of substrates; a processing system for performing at least one action on the plurality of substrates; a loading system for loading and unloading the plurality of substrates to and from the storage system and the processing system; and a transportation system for transporting the substrates between the storage system, the processing system, and the loading system; wherein each of the storage system, the processing system, the loading system, and the transportation system is ceiling mounted.",
    "15. The substrate processing system of claim 14, wherein the storage system includes an opener station, an ID reading station, a transfer station, or a high density storage.",
    "16. The substrate processing system of claim 14, further comprising a controller unit including a user operable drop down controller."
  ],
  "description_excerpt": "This disclosure relates generally to substrate and manufacturing system, processes and methods. In one example embodiment, to methods, apparatus, and systems which provides an improved substrate and manufacturing system, process and method wherein at least a portion of the system process or method may be in an overhead system, such as attached to a ceiling or overhead mounts.\n\nWithin many fields such as specifically within substrate manufacturing and related industries, the efficient and proper handling, storage and processing of materials such as substrates may be exceedingly important. Since the introduction of the 300 mm wafer semiconductor material, Front Opening Unified Pods, or “FOUPs,” have become the standard storage and transport method of substrates and similar materials. FOUPs have been used to isolate and hold silicon wafers for use in semiconductor production. Semiconductors, fundamental in the design of digital circuitry, microprocessors, and transistors, require these wafers to remain in as close to immaculate condition as storage units allow.\n\nAccordingly, FOUPs allow wafers to be transferred between other machines used in the processing and measurement of wafers. A recent improvement to this standard has been the Tec-Cell containers of which provide much higher density and volume of wafer or substrate storage as well as other improved abilities over prior FOUPs.",
  "cpc": [
    "H10P 72/3221",
    "B65G 47/61",
    "H01L 21/67706",
    "H01L 21/67733",
    "H01L 21/67769",
    "H01L 21/67781",
    "H10P 72/3202",
    "H10P 72/3218",
    "H10P 72/3222",
    "H10P 72/3404",
    "H10P 72/3412"
  ],
  "ipc": [
    "B65G 47/61",
    "H01L 21/677"
  ],
  "assignees": [
    "Murata Machinery Ltd"
  ],
  "inventors": [
    "Gerhard Dovids",
    "Yves Fenner",
    "John Fiddes",
    "Christian Wohanka",
    "Bernd Rahrbach"
  ],
  "filing_date": "2017-10-24",
  "publication_date": "2019-12-03",
  "grant_date": "2019-12-03",
  "priority_date": "2016-10-24",
  "application_number": "US-201715791610-A",
  "family_id": "62147768",
  "cited_by_count": 0,
  "citations": [
    "US6460364B1",
    "US20030235486A1",
    "US20060182553A1",
    "US20170000673A1"
  ]
}