MLchartDataset catalogue

Patent · US8807905B2 · B2 · US

Linear semiconductor processing facilities

(11) Publication number
US8807905B2
(21) Application number
13/158,883
(22) Filing date
2011-06-13
(30) Priority date
2003-11-10
(43) Publication date
2014-08-19
(45) Date of grant
2014-08-19
(51) IPC
B25J 17/00; B25J 9/04; B65G 1/00; B66C 1/00; F26B 13/30; F26B 5/04; G06F 19/00; G06F 7/00; H01L /; H01L 21/00; H01L 21/67; H01L 21/677
(52) CPC
  • H10P Generic processes or apparatus for the manufacture or treatment of devices covered by class H10: 72/0454, 72/0441, 72/0452, 72/0456, 72/0458, 72/0461, 72/0462, 72/0464, 72/0466, 72/0468, 72/0604, 72/0606, 72/3202, 72/3216, 72/3221, 72/3222, 72/3302, 72/3304, 72/3306, 72/3311, 72/3312, 72/3412, 72/50, 72/7602, 72/7611
  • B25J Manipulators; chambers provided with manipulation devices: 9/042
  • H01L Semiconductor devices; electric solid state devices not otherwise provided for: 21/67161, 21/67178, 21/67184
  • Y10S Technical subjects covered by former uspc cross-reference art collections [xracs] and digests: 414/135, 414/137, 414/139
  • Y10T Technical subjects covered by former us classification: 74/20305
(73) Assignee
Brooks Automation Inc
(72) Inventors
Peter van der Meulen
(54) Title
Linear semiconductor processing facilities
(57) Abstract

Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.

Full text
View on Google Patents

Claims (14)

  1. A system comprising: a front end module operating in an atmospheric environment; a first robotic handler operating in a vacuum environment; a load lock coupling the front end module to the first robotic handler, the load lock having stacked workpiece transfer planes adapted to transfer workpieces between the atmospheric environment and the vacuum environment and allowing workpieces to enter or exit the system along different transfer planes; a second robotic handler operating in the vacuum environment, the second robotic handler operable to exchange the workpieces with the first robotic handler, wherein at least one of the first robotic handler and the second robotic handler is adapted to move the workpiece in at least two different horizontal planes and another of the first robotic handler and the second robotic handler is substantially vertically fixed and includes a transport arm for transporting the workpiece along at least one intermediate transfer plane; a second load lock coupled to the second robotic handler, the second load lock having stacked transfer planes for allowing workpieces to enter or exit the system along different transfer planes; and a second equipment front end module coupled to the second load lock, the second equipment front end module operating in an atmospheric environment, where the second load lock is adapted to exchange workpieces between the vacuum environment of the second robotic handler and the atmospheric environment along the stacked transfer planes; wherein passage of workpieces between the first and second robotic handlers is along the at least one intermediate workpiece transfer plane, each of the at least one intermediate workpiece transfer plane being disposed between the stacked workpiece transfer planes of the first and second load locks and independent of other ones of the at least one intermediate workpiece transfer planes for transferring workpieces to respective process modules aligned with the at least one intermediate transfer plane.
  2. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a z motor for moving between the at least two different horizontal planes.
  3. The system of claim 1 further comprising a buffer for exchanging workpieces between the first robotic handler and the second robotic handler.
  4. The system of claim 1 wherein the at least two different horizontal planes allow independent transfer of a plurality of workpieces.
  5. The system of claim 1 wherein the first robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the first robotic handler and the first robotic handler configured to move workpieces among the two or more process modules.
  6. The system of claim 5 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.
  7. The system of claim 1 wherein the second robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the second robotic handler and the second robotic handler configured to move workpieces among the two or more process modules.
  8. The system of claim 7 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.
  9. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a dual-arm robot.
  10. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes dual robots.
  11. The system of claim 1 wherein the load lock includes two load locks vertically stacked with respect to one another.
  12. The system of claim 1 wherein the front end modules include an atmospheric robotic handler.
  13. The system of claim 1 further comprising a third robotic handler operating in the vacuum environment, the third robotic handler operable to exchange workpieces with the first and second robotic handlers.
  14. The system of claim 13 further comprising a third load lock coupled to the third robotic handler, the third load lock adapted to exchange workpieces between the vacuum environment of the third robotic handler and the atmospheric environment.

Description

1. Field of the Invention

This invention relates to the field of semiconductor manufacturing, and more particularly to machines used for material handling and transport in a vacuum environment.

2. Description of the Related Art

Current semiconductor manufacturing equipment takes several different forms, each of which has significant drawbacks. Cluster tools, machines that arrange a group of semiconductor processing modules radially about a central robotic arm, take up a large amount of space, are relatively slow, and, by virtue of their architecture, are limited to a small number of semiconductor process modules, typically a maximum of about five or six. Linear tools, while offering much greater flexibility and the potential for greater speed than cluster tools, do not fit well with the current infrastructure of most current semiconductor fabrication facilities; moreover, linear motion of equipment components within the typical vacuum environment of semiconductor manufacturing leads to problems in current linear systems, such as unacceptable levels of particles that are generated by friction among components. Several hybrid architectures exist that use a combination of a radial process module arrangement and a linear arrangement.

One form of linear system uses a rail or track, with a moving cart that can hold an item that is handled by the manufacturing equipment. The cart may or may not hold the material on a moveable arm that is mounted to it.

Citations (197)

  • US3294670A
  • US3584847A
  • US3968018A
  • US6076652A
  • US6467605B1
  • US3796163A
  • US4015558A
  • US3834555A
  • US3874525A
  • US3925182A
  • US3976330A
  • US4184448A
  • US4299533A
  • US4275978A
  • US4318767A
  • US4398720A
  • US4433951A
  • US4392776A
  • US4529460A
  • US4730976A
  • US4909701A
  • US4666366A
  • US4584045A
  • US4702668A
  • US4712971A
  • US4813732A
  • US4749465A
  • US4875825A
  • US4724322A
  • US4701096A
  • US6103055A
  • US5308431A
  • US5344542A
  • US4917556A
  • US4775281A
  • US4951601A
  • US4825808A
  • US4817556A
  • US4831270A
  • US5020475A
  • US5058526A
  • US5536128A
  • US5076205A
  • US5064340A
  • US5013210A
  • US5227708A
  • US5447409A
  • US5203443A
  • US5234303A
  • US5286296A
  • US5259881A
  • US5534761A
  • US5377425A
  • US5314541A
  • US5180275A
  • US5333986A
  • US5897710A
  • US5404894A
  • US5426865A
  • US5391035A
  • US5571325A
  • US5431529A
  • US5577879A
  • US5899658A
  • US5720590A
  • US5433020A
  • US6296735B1
  • US5417537A
  • US5820679A
  • US5539975A
  • US5538390A
  • US5447431A
  • US5511005A
  • US5563798A
  • US5740062A
  • US6900459B2
  • US5486080A
  • US5657553A
  • US5586585A
  • US6609876B2
  • US6837663B2
  • US5957651A
  • US5700127A
  • US5765982A
  • US5888048A
  • US6066210A
  • US6155131A
  • US5751003A
  • US5810549A
  • US5765983A
  • US6062798A
  • US5980194A
  • US6440178B2
  • US6425722B1
  • US6053980A
  • US6048154A
  • US6250869B1
  • US6126381A
  • US6059507A
  • US5894760A
  • US6073366A
  • US6450750B1
  • US6264748B1
  • US6048162A
  • US6238161B1
  • US6002840A
  • US6235634B1
  • US6257045B1
  • US6293749B1
  • US6315512B1
  • US6257827B1
  • US6533530B1
  • US6149379A
  • US6146077A
  • US6135854A
  • US6155768A
  • US6125551A
  • US6641348B1
  • US6293291B1
  • US6503365B1
  • US6253464B1
  • US6547510B1
  • US6267549B1
  • US6142722A
  • US6073828A
  • US6283355B1
  • US6375746B1
  • US6286230B1
  • US6017820A
  • US6744228B1
  • US6949844B2
  • US6719516B2
  • US6960057B1
  • US6405101B1
  • US7198448B2
  • US6618645B2
  • US6898487B2
  • US6453214B1
  • JP2000177842A
  • JP2000183129A
  • US6382895B1
  • US6485250B2
  • US6678572B1
  • US6517304B1
  • US6736582B1
  • US6841485B1
  • US6944584B1
  • US6227793B1
  • US6440261B1
  • US6592673B2
  • US6318951B1
  • US20010041120A1
  • US6242748B1
  • US6400115B1
  • US6309161B1
  • US6949143B1
  • US6640151B1
  • US6514032B1
  • US6506009B1
  • US6575689B2
  • US6439824B1
  • US6840732B2
  • US6669434B2
  • US20020094265A1
  • US6494666B2
  • US6601888B2
  • JP2002332570A
  • US6852194B2
  • US20040219001A1
  • US6918731B2
  • US6758113B2
  • US6643563B2
  • US6950716B2
  • US6586336B2
  • JP2003142360A
  • US6719517B2
  • US6729824B2
  • US20030131458A1
  • US6976400B1
  • US6761085B1
  • US6779962B2
  • US6900877B2
  • US6889447B2
  • US20050105991A1
  • US20040151562A1
  • US6869263B2
  • US6813543B2
  • US6760976B1
  • US6934606B1
  • US20050194096A1
  • US20050095087A1
  • US20050223837A1
  • WO2005048313A3
  • US20060263177A1
  • US7210246B2
  • US20080085173A1
  • WO2005091337A1
Record as JSON 
{
  "publication_number": "US8807905B2",
  "country": "US",
  "kind": "B2",
  "title": "Linear semiconductor processing facilities",
  "abstract": "Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.",
  "claims": [
    "1. A system comprising: a front end module operating in an atmospheric environment; a first robotic handler operating in a vacuum environment; a load lock coupling the front end module to the first robotic handler, the load lock having stacked workpiece transfer planes adapted to transfer workpieces between the atmospheric environment and the vacuum environment and allowing workpieces to enter or exit the system along different transfer planes; a second robotic handler operating in the vacuum environment, the second robotic handler operable to exchange the workpieces with the first robotic handler, wherein at least one of the first robotic handler and the second robotic handler is adapted to move the workpiece in at least two different horizontal planes and another of the first robotic handler and the second robotic handler is substantially vertically fixed and includes a transport arm for transporting the workpiece along at least one intermediate transfer plane; a second load lock coupled to the second robotic handler, the second load lock having stacked transfer planes for allowing workpieces to enter or exit the system along different transfer planes; and a second equipment front end module coupled to the second load lock, the second equipment front end module operating in an atmospheric environment, where the second load lock is adapted to exchange workpieces between the vacuum environment of the second robotic handler and the atmospheric environment along the stacked transfer planes; wherein passage of workpieces between the first and second robotic handlers is along the at least one intermediate workpiece transfer plane, each of the at least one intermediate workpiece transfer plane being disposed between the stacked workpiece transfer planes of the first and second load locks and independent of other ones of the at least one intermediate workpiece transfer planes for transferring workpieces to respective process modules aligned with the at least one intermediate transfer plane.",
    "2. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a z motor for moving between the at least two different horizontal planes.",
    "3. The system of claim 1 further comprising a buffer for exchanging workpieces between the first robotic handler and the second robotic handler.",
    "4. The system of claim 1 wherein the at least two different horizontal planes allow independent transfer of a plurality of workpieces.",
    "5. The system of claim 1 wherein the first robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the first robotic handler and the first robotic handler configured to move workpieces among the two or more process modules.",
    "6. The system of claim 5 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.",
    "7. The system of claim 1 wherein the second robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the second robotic handler and the second robotic handler configured to move workpieces among the two or more process modules.",
    "8. The system of claim 7 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.",
    "9. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a dual-arm robot.",
    "10. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes dual robots.",
    "11. The system of claim 1 wherein the load lock includes two load locks vertically stacked with respect to one another.",
    "12. The system of claim 1 wherein the front end modules include an atmospheric robotic handler.",
    "13. The system of claim 1 further comprising a third robotic handler operating in the vacuum environment, the third robotic handler operable to exchange workpieces with the first and second robotic handlers.",
    "14. The system of claim 13 further comprising a third load lock coupled to the third robotic handler, the third load lock adapted to exchange workpieces between the vacuum environment of the third robotic handler and the atmospheric environment."
  ],
  "description_excerpt": "1. Field of the Invention\n\nThis invention relates to the field of semiconductor manufacturing, and more particularly to machines used for material handling and transport in a vacuum environment.\n\n2. Description of the Related Art\n\nCurrent semiconductor manufacturing equipment takes several different forms, each of which has significant drawbacks. Cluster tools, machines that arrange a group of semiconductor processing modules radially about a central robotic arm, take up a large amount of space, are relatively slow, and, by virtue of their architecture, are limited to a small number of semiconductor process modules, typically a maximum of about five or six. Linear tools, while offering much greater flexibility and the potential for greater speed than cluster tools, do not fit well with the current infrastructure of most current semiconductor fabrication facilities; moreover, linear motion of equipment components within the typical vacuum environment of semiconductor manufacturing leads to problems in current linear systems, such as unacceptable levels of particles that are generated by friction among components. Several hybrid architectures exist that use a combination of a radial process module arrangement and a linear arrangement.\n\nOne form of linear system uses a rail or track, with a moving cart that can hold an item that is handled by the manufacturing equipment. The cart may or may not hold the material on a moveable arm that is mounted to it.",
  "cpc": [
    "H10P 72/0454",
    "B25J 9/042",
    "H01L 21/67161",
    "H01L 21/67178",
    "H01L 21/67184",
    "H10P 72/0441",
    "H10P 72/0452",
    "H10P 72/0456",
    "H10P 72/0458",
    "H10P 72/0461",
    "H10P 72/0462",
    "H10P 72/0464",
    "H10P 72/0466",
    "H10P 72/0468",
    "H10P 72/0604",
    "H10P 72/0606",
    "H10P 72/3202",
    "H10P 72/3216",
    "H10P 72/3221",
    "H10P 72/3222",
    "H10P 72/3302",
    "H10P 72/3304",
    "H10P 72/3306",
    "H10P 72/3311",
    "H10P 72/3312",
    "H10P 72/3412",
    "H10P 72/50",
    "H10P 72/7602",
    "H10P 72/7611",
    "Y10S 414/135",
    "Y10S 414/137",
    "Y10S 414/139",
    "Y10T 74/20305"
  ],
  "ipc": [
    "B25J 17/00",
    "B25J 9/04",
    "B65G 1/00",
    "B66C 1/00",
    "F26B 13/30",
    "F26B 5/04",
    "G06F 19/00",
    "G06F 7/00",
    "H01L /",
    "H01L 21/00",
    "H01L 21/67",
    "H01L 21/677"
  ],
  "assignees": [
    "Brooks Automation Inc"
  ],
  "inventors": [
    "Peter van der Meulen"
  ],
  "filing_date": "2011-06-13",
  "publication_date": "2014-08-19",
  "grant_date": "2014-08-19",
  "priority_date": "2003-11-10",
  "application_number": "US-201113158883-A",
  "family_id": "34594927",
  "cited_by_count": 18,
  "citations": [
    "US3294670A",
    "US3584847A",
    "US3968018A",
    "US6076652A",
    "US6467605B1",
    "US3796163A",
    "US4015558A",
    "US3834555A",
    "US3874525A",
    "US3925182A",
    "US3976330A",
    "US4184448A",
    "US4299533A",
    "US4275978A",
    "US4318767A",
    "US4398720A",
    "US4433951A",
    "US4392776A",
    "US4529460A",
    "US4730976A",
    "US4909701A",
    "US4666366A",
    "US4584045A",
    "US4702668A",
    "US4712971A",
    "US4813732A",
    "US4749465A",
    "US4875825A",
    "US4724322A",
    "US4701096A",
    "US6103055A",
    "US5308431A",
    "US5344542A",
    "US4917556A",
    "US4775281A",
    "US4951601A",
    "US4825808A",
    "US4817556A",
    "US4831270A",
    "US5020475A",
    "US5058526A",
    "US5536128A",
    "US5076205A",
    "US5064340A",
    "US5013210A",
    "US5227708A",
    "US5447409A",
    "US5203443A",
    "US5234303A",
    "US5286296A",
    "US5259881A",
    "US5534761A",
    "US5377425A",
    "US5314541A",
    "US5180275A",
    "US5333986A",
    "US5897710A",
    "US5404894A",
    "US5426865A",
    "US5391035A",
    "US5571325A",
    "US5431529A",
    "US5577879A",
    "US5899658A",
    "US5720590A",
    "US5433020A",
    "US6296735B1",
    "US5417537A",
    "US5820679A",
    "US5539975A",
    "US5538390A",
    "US5447431A",
    "US5511005A",
    "US5563798A",
    "US5740062A",
    "US6900459B2",
    "US5486080A",
    "US5657553A",
    "US5586585A",
    "US6609876B2",
    "US6837663B2",
    "US5957651A",
    "US5700127A",
    "US5765982A",
    "US5888048A",
    "US6066210A",
    "US6155131A",
    "US5751003A",
    "US5810549A",
    "US5765983A",
    "US6062798A",
    "US5980194A",
    "US6440178B2",
    "US6425722B1",
    "US6053980A",
    "US6048154A",
    "US6250869B1",
    "US6126381A",
    "US6059507A",
    "US5894760A",
    "US6073366A",
    "US6450750B1",
    "US6264748B1",
    "US6048162A",
    "US6238161B1",
    "US6002840A",
    "US6235634B1",
    "US6257045B1",
    "US6293749B1",
    "US6315512B1",
    "US6257827B1",
    "US6533530B1",
    "US6149379A",
    "US6146077A",
    "US6135854A",
    "US6155768A",
    "US6125551A",
    "US6641348B1",
    "US6293291B1",
    "US6503365B1",
    "US6253464B1",
    "US6547510B1",
    "US6267549B1",
    "US6142722A",
    "US6073828A",
    "US6283355B1",
    "US6375746B1",
    "US6286230B1",
    "US6017820A",
    "US6744228B1",
    "US6949844B2",
    "US6719516B2",
    "US6960057B1",
    "US6405101B1",
    "US7198448B2",
    "US6618645B2",
    "US6898487B2",
    "US6453214B1",
    "JP2000177842A",
    "JP2000183129A",
    "US6382895B1",
    "US6485250B2",
    "US6678572B1",
    "US6517304B1",
    "US6736582B1",
    "US6841485B1",
    "US6944584B1",
    "US6227793B1",
    "US6440261B1",
    "US6592673B2",
    "US6318951B1",
    "US20010041120A1",
    "US6242748B1",
    "US6400115B1",
    "US6309161B1",
    "US6949143B1",
    "US6640151B1",
    "US6514032B1",
    "US6506009B1",
    "US6575689B2",
    "US6439824B1",
    "US6840732B2",
    "US6669434B2",
    "US20020094265A1",
    "US6494666B2",
    "US6601888B2",
    "JP2002332570A",
    "US6852194B2",
    "US20040219001A1",
    "US6918731B2",
    "US6758113B2",
    "US6643563B2",
    "US6950716B2",
    "US6586336B2",
    "JP2003142360A",
    "US6719517B2",
    "US6729824B2",
    "US20030131458A1",
    "US6976400B1",
    "US6761085B1",
    "US6779962B2",
    "US6900877B2",
    "US6889447B2",
    "US20050105991A1",
    "US20040151562A1",
    "US6869263B2",
    "US6813543B2",
    "US6760976B1",
    "US6934606B1",
    "US20050194096A1",
    "US20050095087A1",
    "US20050223837A1",
    "WO2005048313A3",
    "US20060263177A1",
    "US7210246B2",
    "US20080085173A1",
    "WO2005091337A1"
  ]
}

Record 5,111 of 8,000 in Patents full text (MLC-0201). Request the full dataset.