High density stocker with interlocking nubs

{
  "publication_number": "US10395960B2",
  "country": "US",
  "kind": "B2",
  "title": "High density stocker with interlocking nubs",
  "abstract": "A substrate stocker system includes a high-density storage chamber that comprises one or more stacks of one or more substrates in a closed position, one or more low density containers that are configured to store one or more substrates in an open position, one or more opener stations that are configured to receive one or more substrates and includes one or more separator modules for changing one or more distances between corresponding one or more adjacent substrates. The substrate stocker system further includes a first robot configured to move one or more stacks between the high-density storage chamber, and the one or more opener station, and a second robot configured to move the individual one or more substrates between the one or more opener stations and the one or more low density containers.",
  "claims": [
    "1. A substrate stocker system comprising: a high density storage chamber that comprises one or more high density containers or stacks of one or more substrates, each of the one or more substrates being supported on a respective carrier wherein the one or more high density containers or stacks are in a closed position; one or more low density containers, each of the one or more low density containers being configured to store one or more substrates; one or more opener stations, each of the one or more opener stations configured to send or receive one or more stacks or containers from the high density storage chamber and one or more substrates from the one or more low density containers, each of the one or more opener stations comprising one or more separator modules for changing one or more distances between corresponding one or more adjacent substrates in the one or more high density containers or stacks; a load port; and at least one robot configured to move: one or more containers or stacks between the high density storage chamber and the one or more opener stations; and one or more substrates between the one or more high density containers or stacks and the one or more low density containers; wherein the one or more opener stations are located between the load port and the high density storage chamber; wherein a separator module included within the one or more opener stations comprises: a conveyor belt; and a motor driven cogwheel; wherein the conveyor belt comprises a plurality of interlocking nubs which interlock into corresponding notches in individual carriers; and the conveyor belt is driven such that the plurality of interlocking nubs interlock with the carrier and move or separate the one or more carriers and substrates by one or more predefined distances.",
    "2. The substrate stocker system as claimed in claim 1, wherein one or more distances between one or more adjacent substrates of the one or more high density containers or stacks in the closed position, is less than a threshold distance defined by Semiconductor Equipment and Materials International (SEMI) standard.",
    "3. The substrate stocker system as claimed in claim 1, wherein the one or more high density containers or stacks of the one or more substrates in the closed position, are disposed within the high density storage chamber, in at least one of: a container with removable top and bottom plates, a movable high density container having a body and a door, a movable high density container having one or more shelves, a side door, and a bottom door, and a movable high density container being provided with an Overhead Transfer Vehicle (OHT).",
    "4. The substrate stocker system as claimed in claim 3, wherein the load port includes a container load port configured to receive and store the one or more movable high density containers or stacks with the OHT; and the at least one robot includes a robot configured to transfer the one or more movable high density containers or stacks with the OHT, from the container load port to the high density storage chamber.",
    "5. The substrate stocker system as claimed in claim 1, further comprising an Equipment Front End Module (EFEM) coupled to the one or more opener stations, wherein a robot is disposed within the EFEM module for moving one or more substrates between the one or more opener stations and the one or more low density containers.",
    "6. The substrate stocker system as claimed in claim 1, further comprising: an operator loading station configured to enable transfer of one or more individual substrates and carriers to and from the one or more opener stations; and an automatic loading station configured to enable automatic transfer of one or more containers to and from the high density storage chamber.",
    "7. The substrate stocker system as claimed in claim 1, wherein the one or more opener stations are provided with a separator module that includes an actuator with one or more extrusions, wherein the one or more extrusions match an individual corresponding carrier and substrate such that the one or more extrusions hold the individual carrier and substrate and wherein when the actuator is enabled, the one or more extrusions separate the one or more carriers and substrates by one or more predefined distances.",
    "8. The substrate stocker system as claimed in claim 1, further comprising an external dock cart that comprises: one or more robots for moving one or more containers and one or more carriers and substrates from or to the external dock cart, wherein the high density storage chamber includes a docking station for mating with the external dock cart, and wherein the one or more robots is configured to transfer at least one of containers and substrates between the docking station and the dock cart."
  ],
  "description_excerpt": "This application claims priority from at least U.S. Provisional Patent Application 62/412,249, filed on Oct. 24, 2016 and entitled “High Density Stocker” and U.S. Provisional Patent Application 62/355,856, filed on Jun. 28, 2016 and entitled “Substrate Storage and Processing” which application may be incorporated herein by reference in its entirety for all purposes.\n\nThis disclosure relates generally to substrate storage and processing. In one example embodiment, to an improved substrate storage system, method or apparatus. More specifically, to a storage system, apparatus or method which may provide improved efficiency in readily being able to store and provide substrates to a system such as for processing or use.\n\nWithin many fields, and specifically within substrate manufacturing and related industries, the efficient and proper handling, storage and processing of materials such as substrates is exceedingly important. Since the introduction of the 300-mm wafer semiconductor material, Front Opening Unified Pods, or “FOUPs,” have become the standard storage and transport method of substrates and similar materials. FOUPs have been used to isolate and hold silicon wafers for use in semiconductor production. Semiconductors, fundamental in the design of digital circuitry, microprocessors, and transistors, require these wafers to remain in as close to immaculate condition as storage units allow. Accordingly, FOUPs allow wafers to be transferred between other machines used in the processing and measurement of wafers.",
  "cpc": [
    "H10P 72/3411",
    "B25J 9/1617",
    "B65G 1/1375",
    "B65G 2201/0297",
    "B65G 37/005",
    "B65G 37/02",
    "H01L 21/67196",
    "H01L 21/67259",
    "H01L 21/67265",
    "H01L 21/67346",
    "H01L 21/67733",
    "H01L 21/67736",
    "H01L 21/67742",
    "H01L 21/6776",
    "H01L 21/67766",
    "H01L 21/67769",
    "H01L 21/67778",
    "H10P 72/0464",
    "H10P 72/0606",
    "H10P 72/0608",
    "H10P 72/18",
    "H10P 72/3221",
    "H10P 72/3222",
    "H10P 72/3302",
    "H10P 72/3314",
    "H10P 72/3402",
    "H10P 72/3404"
  ],
  "ipc": [
    "B25J 9/16",
    "B65G 1/137",
    "B65G 37/00",
    "B65G 37/02",
    "H01L 21/67",
    "H01L 21/673",
    "H01L 21/677"
  ],
  "assignees": [
    "Murata Machinery Ltd"
  ],
  "inventors": [
    "Gerhard Dovids",
    "Yves Fenner",
    "John Fiddes",
    "Christian Wohanka",
    "Bernd Rahrbach"
  ],
  "filing_date": "2017-10-24",
  "publication_date": "2019-08-27",
  "grant_date": "2019-08-27",
  "priority_date": "2016-10-24",
  "application_number": "US-201715791627-A",
  "family_id": "62022546",
  "cited_by_count": 1,
  "citations": [
    "JP2009260252A",
    "US20180122675A1",
    "US20180122674A1"
  ]
}