Substrate treating apparatus and apparatus and method for eccentricity inspection

{
  "publication_number": "US11158079B2",
  "country": "US",
  "kind": "B2",
  "title": "Substrate treating apparatus and apparatus and method for eccentricity inspection",
  "abstract": "Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.",
  "claims": [
    "1. A substrate treating apparatus comprising: a process chamber having a process space inside; a pedestal configured to support a substrate in the process space and to rotate the substrate about a support shaft of a spin chuck; and an camera system configured to inspect eccentricity of the support shaft, the eccentricity corresponding to an angle between an axis through a center of the support shaft and a vertical direction perpendicular to the ground, wherein the camera system includes, a camera configured to obtain an image of the substrate supported on the pedestal, and processing circuitry configured to obtain edge data of the substrate from the image of the substrate and measure an amount of eccentricity of the support shaft, based on the edge data.",
    "2. The substrate treating apparatus of claim 1, wherein the processing circuitry is configured to receive a first image obtained for the substrate in a state in which the support shaft is not eccentrically located, obtain first edge data of the substrate from the first image, and model an estimation equation for measuring the amount of eccentricity of the support shaft, based on the first edge data, wherein the substrate is supported on the pedestal, and to receive a second image obtained for the substrate during a process, obtain second edge data of the substrate from the second image, and measure the amount of eccentricity of the support shaft by comparing the second edge data with the estimation equation, wherein the substrate is supported on the pedestal.",
    "3. The substrate treating apparatus of claim 2, wherein the processing circuitry is further configured to determine the eccentricity by comparing the amount of eccentricity of the support shaft with a set reference value, and to generate a warning when the eccentricity occurs.",
    "4. The substrate treating apparatus of claim 2, wherein the processing circuitry is configured to set a region of interest (ROI) including an edge portion of the substrate in the first image; to detect an edge of the substrate in the region of interest (ROI) of the first image to obtain the first edge data, and to calculate the estimation equation, based on at least three pieces of point data included in the first edge data.",
    "5. The substrate treating apparatus of claim 4, wherein the region of interest (ROI) includes an upper left edge region or an upper right edge region of the substrate in the first image.",
    "6. The substrate treating apparatus of claim 4, wherein the processing circuitry is configured to obtain three pieces of point data from the first edge data, to estimate a quadratic equation, based on the three pieces of point data, to verify the quadratic equation by calculating an error between the quadratic equation and the first edge data, and to determine a quadratic equation having an error, among quadratic equations obtained by varying the three pieces of point data, to be the estimation equation.",
    "7. The substrate treating apparatus of claim 4, wherein the processing circuitry is configured to to detect an edge of the substrate in a region of interest (ROI) of the second image, to obtain the second edge data from the edge of the substrate that is detected in the region of interest (ROI) of the second image, and to calculate the amount of eccentricity of the support shaft, based on a difference between the second edge data and the estimation equation.",
    "8. The substrate treating apparatus of claim 1, further comprising: a lighting configured to supply light to the substrate supported on the pedestal, wherein the lighting includes a plurality of lens-type lamps configured to supply the light toward different edge regions of the substrate in different directions, and adjacent regions among the edge regions of the substrate that are illuminated by the lens-type lamps have an overlapping area therebetween.",
    "9. The substrate treating apparatus of claim 8, wherein the lighting further includes a frame and a plurality of brackets mounted on the frame so as to be directed toward the different edge regions of the substrate, and the lens-type lamps are coupled to upper surfaces of the brackets, and the substrate treating apparatus is configured to adjust irradiation directions of the lens-type lamps depending on angles of the upper surfaces of the brackets.",
    "10. An eccentricity inspection apparatus comprising: a camera system configured to obtain an image of a substrate supported to be rotatable about a support shaft of a spin chuck of a pedestal in a process space of a process chamber and processing circuitry configured to obtain edge data of the substrate from the image of the substrate and measure an amount of eccentricity of the support shaft, based on the edge data, the eccentricity corresponding to an angle between an axis through a center of the support shaft and a vertical direction perpendicular to the ground.",
    "11. The eccentricity inspection apparatus of claim 10, wherein the processing circuitry is configured to receive a first image obtained for the substrate in a state in which the support shaft is not eccentrically located, obtain first edge data of the substrate from the first image, and model an estimation equation for measuring the amount of eccentricity of the support shaft, based on the first edge data, wherein the substrate is supported on the pedestal, and to receive a second image obtained for the substrate during a process, obtain second edge data of the substrate from the second image, and measure the amount of eccentricity of the support shaft by comparing the second edge data with the estimation equation, wherein the substrate is supported on the pedestal.",
    "12. The eccentricity inspection apparatus of claim 11, wherein the processing circuitry is further configured to to determine eccentricity by comparing the amount of eccentricity of the support shaft with a set reference value, and to generate a warning when the eccentricity occurs.",
    "13. The eccentricity inspection apparatus of claim 11, wherein the processing circuitry is configured to obtain three pieces of point data from the first edge data, to estimate a quadratic equation, based on the three pieces of point data, to verify the quadratic equation by calculating an error between the quadratic equation and the first edge data, and to determine a quadratic equation having an error among quadratic equations obtained by varying the three pieces of point data, to be the estimation equation.",
    "14. An eccentricity inspection method comprising: receiving an image of a substrate supported to be rotatable about a support shaft of a spin chuck of a pedestal in a process space of a process chamber; and obtaining edge data of the substrate from the image and measuring an amount of eccentricity of the support shaft, based on the edge data, the eccentricity corresponding to an angle between an axis through a center of the support shaft and a vertical direction perpendicular to the ground.",
    "15. The eccentricity inspection method of claim 14, wherein the measuring of the amount of eccentricity includes: determining eccentricity by comparing the amount of eccentricity of the support shaft with a set reference value; and generating a warning when the eccentricity occurs.",
    "16. The eccentricity inspection method of claim 14, wherein the measuring of the amount of eccentricity includes: receiving a first image obtained for the substrate in a state in which the support shaft is not eccentrically located; obtaining first edge data of the substrate from the first image; modeling an estimation equation for measuring the amount of eccentricity of the support shaft, based on the first edge data, wherein the substrate is supported on the pedestal; receiving a second image obtained for the substrate during a process; obtaining second edge data of the substrate from the second image; and calculating the amount of eccentricity of the support shaft by comparing the second edge data with the estimation equation, wherein the substrate is supported on the pedestal.",
    "17. The eccentricity inspection method of claim 16, wherein the modeling of the estimation equation includes: setting a region of interest (ROI) including an edge portion of the substrate in the first image; obtaining the first edge data by detecting an edge of the substrate in the region of interest (ROI) of the first image; and calculating the estimation equation, based on at least three pieces of point data included in the first edge data.",
    "18. The eccentricity inspection method of claim 17, wherein the calculating of the estimation equation includes: obtaining three pieces of point data from the first edge data; estimating a quadratic equation based on the three pieces of point data; verifying the quadratic equation by calculating an error between the quadratic equation and the first edge data; and determining a quadratic equation having an error, among quadratic equations obtained by varying the three pieces of point data, to be the estimation equation.",
    "19. The eccentricity inspection method of claim 18, wherein in determining the quadratic equation having the error to be the estimation equation, the estimation equation is calculated based on three pieces of point data not included in regions that are related to a notch of the substrate and a chuck pin configured to support the substrate, respectively, in the region of interest (ROI) of the first image.",
    "20. The eccentricity inspection method of claim 16, wherein the calculating of the amount of eccentricity of the support shaft includes: detecting an edge of the substrate in a region of interest (ROI) of the second image; obtaining the second edge data from the edge of the substrate that is detected in the region of interest (ROI) of the second image; and calculating the amount of eccentricity of the support shaft, based on a difference between the second edge data and the estimation equation."
  ],
  "description_excerpt": "Embodiments of the inventive concept described herein relate to a substrate treating apparatus and an apparatus and method for eccentricity inspection, and more particularly, relate to a substrate treating apparatus and an eccentricity inspection apparatus and method for inspecting eccentricity of a support shaft of a spin chuck supporting a substrate, based on image processing.\n\nSemiconductor elements are manufactured through various processes such as deposition, etching, cleaning, drying, and the like. For example, a cleaning process is performed to remove various types of contaminants adhering to the surface of a substrate because the contaminants such as particles, organic contaminants, metal contaminants, and the like that remain on the surface of the substrate greatly affect characteristics and manufacturing yield of semiconductor elements. A spin chuck is used to support and rotate a substrate in various processes including a cleaning process. The spin chuck is an apparatus for rotating the substrate at high speed to perform a process and is a very important component in a cleaning facility. In the case where bearings of the spin chuck are damaged or the force to grip chuck pins is weakened, the substrate may be eccentrically located when the spin chuck rotates. Due to this, a processing liquid may be scattered to contaminate a chamber, the substrate may be damaged, or a process accident may be caused.",
  "cpc": [
    "G06T 7/64",
    "G06T 2207/10016",
    "G06T 2207/30148",
    "G06T 2207/30164",
    "G06T 7/0004",
    "G06T 7/0006",
    "G06T 7/11",
    "G06T 7/13",
    "H01L 21/68792",
    "H10P 72/04",
    "H10P 72/0414",
    "H10P 72/06",
    "H10P 72/0606",
    "H10P 72/0612",
    "H10P 72/0616",
    "H10P 72/7608",
    "H10P 72/7618",
    "H10P 72/7626",
    "H10P 74/23",
    "H10P 95/00"
  ],
  "ipc": [
    "G06T 7/00",
    "G06T 7/11",
    "G06T 7/13",
    "G06T 7/64",
    "H10P 72/00",
    "H10P 72/76",
    "G06K 9/00"
  ],
  "assignees": [
    "Semes Co Ltd"
  ],
  "inventors": [
    "Ohyeol Kwon",
    "Soo Young Park",
    "Jihyun Lee",
    "Young Ho Choo"
  ],
  "filing_date": "2019-11-15",
  "publication_date": "2021-10-26",
  "grant_date": "2021-10-26",
  "priority_date": "2018-11-23",
  "application_number": "US-201916685345-A",
  "family_id": "70771487",
  "cited_by_count": 4,
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}