Patent · US10192734B2 · B2 · US
Short inorganic trisilylamine-based polysilazanes for thin film deposition
- (11) Publication number
- US10192734B2
- (21) Application number
- 15/661,576
- (22) Filing date
- 2017-07-27
- (30) Priority date
- 2016-12-11
- (43) Publication date
- 2019-01-29
- (45) Date of grant
- 2019-01-29
- (52) CPC
- H10P Generic processes or apparatus for the manufacture or treatment of devices covered by class H10: 14/6682, 14/6336, 14/6339, 14/6689, 14/69215, 14/69433
- C07F Acyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium: 7/10
- C23C Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general: 16/345, 16/402, 16/45553
- H01L Electric elements: 21/02164, 21/0217, 21/02211, 21/02222, 21/02274, 21/0228
- (73) Assignee
- AIR LIQUIDE ADVANCED MAT INC; LAIR LIQUIDE SA POUR L ETUDE ET LEXPLOITATION DES PROCEDES GEORGES CLAUDE; AIR LIQUIDE ADVANCED MAT LLC; LAIR LIQUIDE SA POUR LETUDE ET LEXPLORATION DES PROCEDES GEORGES CLAUDE
- (54) Title
- Short inorganic trisilylamine-based polysilazanes for thin film deposition
- (57) Abstract
Si-containing film forming compositions comprising Si - C free and volatile silazane-containing precursors are disclosed. The compositions may be used to deposit high purity thin films. The Si - C free and volatile silazane-containing precursors have the formulae: [(SiR 3) 2 NSiH 2] m - NH 2-m - C≡N, with m =1 or 2; (a) [(SiR 3) 2 NSiH 2] n - NL 3-n,with n =2 or 3; (b) (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2; and (c) (SiR′ 3) 2 N - SiH 2 - N(SiR′ 3) 2; (d) with each R independently selected from H, a dialkylamino group, or an amidinate; each R′ independently selected from H, a dialkylamino group, or an amidinate, with the provision that all R′ are not H; and L is selected from H or a C 1 -C 6 hydrocarbyl group.
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Claims (11)
- A silicon-containing film forming composition comprising a precursor selected from the group consisting of: [(SiR 3) 2 NSiH 2] m - NH 2-m - C≡N, with m= 1 or 2; (a) [(SiR 3) 2 NSiH 2] n - NL 3-n,with n= 2 or 3; (b) (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2; and (c) (SiR′ 3) 2 N - SiH 2 - N(SiR′ 3) 2; (d) wherein each R is independently selected from H, a dialkylamino group having the formula NR 1 R 2, or an amidinate, Each R′ is independently selected from H, a dialkylamino group having the formula NR 1 R 2, or an amidinate, with the provision that all R′ are not H, R 1 and R 2 are independently selected from H or a C1-C12 hydrocarbyl group, with the provision that R 1 and R 2 cannot be simultaneously equal to H, and that if R 1 is H, then R 2 is a C 2 -C12 hydrocarbyl group, and NR′ R 2 may together form an N-containing heterocyclic ligand, and L is selected from H or a C 1 -C 6 hydrocarbyl group.
- The silicon-containing film forming composition of claim 1, wherein the precursor is (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NR 1 R 2), (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2, [(SiH 3) 2 NSiH 2] - NH - C≡N, or [(SiH 3) 2 NSiH 2] 2 N - C≡N.
- The silicon-containing film forming composition of claim 1, wherein the precursor is [(SiH 3) 2 NSiH 2] 2 NH or [(SiH 3) 2 NSiH 2] 3 N.
- The silicon-containing film forming composition of claim 1, wherein the precursor is (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NMe 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NEt 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NEtMe), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NiPr 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NtBu 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NnBu 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NsecBu 2), or (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NHtBu).
- A method of deposit a silicon-containing film on a substrate by a chemical vapor deposition method, the method comprising introducing into a reactor containing a substrate a vapor including the Si-containing film forming composition of claim 1; depositing at least part of the precursor onto the substrate to form the silicon-containing film on the substrate using a chemical vapor deposition process.
- The method of claim 5, wherein the chemical vapor deposition method is an atomic layer deposition process or a plasma enhanced atomic layer deposition process.
- The method of claim 5, wherein the silicon-containing film is a silicon oxide film.
- The method of claim 5, wherein the silicon-containing film is a silicon nitride film.
- The method of claim 5, wherein the substrate is a silicon wafer.
- The method of claim 5, wherein the substrate is glass.
- The method of claim 5, wherein the substrate is an organic material.
Citations (57)
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Record as JSON
{
"publication_number": "US10192734B2",
"country": "US",
"kind": "B2",
"title": "Short inorganic trisilylamine-based polysilazanes for thin film deposition",
"abstract": "Si-containing film forming compositions comprising Si - C free and volatile silazane-containing precursors are disclosed. The compositions may be used to deposit high purity thin films. The Si - C free and volatile silazane-containing precursors have the formulae: [(SiR 3) 2 NSiH 2] m - NH 2-m - C≡N, with m =1 or 2; (a) [(SiR 3) 2 NSiH 2] n - NL 3-n,with n =2 or 3; (b) (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2; and (c) (SiR′ 3) 2 N - SiH 2 - N(SiR′ 3) 2; (d) with each R independently selected from H, a dialkylamino group, or an amidinate; each R′ independently selected from H, a dialkylamino group, or an amidinate, with the provision that all R′ are not H; and L is selected from H or a C 1 -C 6 hydrocarbyl group.",
"claims": [
"1. A silicon-containing film forming composition comprising a precursor selected from the group consisting of: [(SiR 3) 2 NSiH 2] m - NH 2-m - C≡N, with m= 1 or 2; (a) [(SiR 3) 2 NSiH 2] n - NL 3-n,with n= 2 or 3; (b) (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2; and (c) (SiR′ 3) 2 N - SiH 2 - N(SiR′ 3) 2; (d) wherein each R is independently selected from H, a dialkylamino group having the formula NR 1 R 2, or an amidinate, Each R′ is independently selected from H, a dialkylamino group having the formula NR 1 R 2, or an amidinate, with the provision that all R′ are not H, R 1 and R 2 are independently selected from H or a C1-C12 hydrocarbyl group, with the provision that R 1 and R 2 cannot be simultaneously equal to H, and that if R 1 is H, then R 2 is a C 2 -C12 hydrocarbyl group, and NR′ R 2 may together form an N-containing heterocyclic ligand, and L is selected from H or a C 1 -C 6 hydrocarbyl group.",
"2. The silicon-containing film forming composition of claim 1, wherein the precursor is (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NR 1 R 2), (SiH 3) 2 NSiH 2 - O - SiH 2 N(SiH 3) 2, [(SiH 3) 2 NSiH 2] - NH - C≡N, or [(SiH 3) 2 NSiH 2] 2 N - C≡N.",
"3. The silicon-containing film forming composition of claim 1, wherein the precursor is [(SiH 3) 2 NSiH 2] 2 NH or [(SiH 3) 2 NSiH 2] 3 N.",
"4. The silicon-containing film forming composition of claim 1, wherein the precursor is (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NMe 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NEt 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NEtMe), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NiPr 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NtBu 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NnBu 2), (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NsecBu 2), or (SiH 3) 2 N - SiH 2 - N(SiH 3)(SiH 2 NHtBu).",
"5. A method of deposit a silicon-containing film on a substrate by a chemical vapor deposition method, the method comprising introducing into a reactor containing a substrate a vapor including the Si-containing film forming composition of claim 1; depositing at least part of the precursor onto the substrate to form the silicon-containing film on the substrate using a chemical vapor deposition process.",
"6. The method of claim 5, wherein the chemical vapor deposition method is an atomic layer deposition process or a plasma enhanced atomic layer deposition process.",
"7. The method of claim 5, wherein the silicon-containing film is a silicon oxide film.",
"8. The method of claim 5, wherein the silicon-containing film is a silicon nitride film.",
"9. The method of claim 5, wherein the substrate is a silicon wafer.",
"10. The method of claim 5, wherein the substrate is glass.",
"11. The method of claim 5, wherein the substrate is an organic material."
],
"cpc": [
"H10P 14/6682",
"C07F 7/10",
"C23C 16/345",
"C23C 16/402",
"C23C 16/45553",
"H01L 21/02164",
"H01L 21/0217",
"H01L 21/02211",
"H01L 21/02222",
"H01L 21/02274",
"H01L 21/0228",
"H10P 14/6336",
"H10P 14/6339",
"H10P 14/6689",
"H10P 14/69215",
"H10P 14/69433"
],
"assignees": [
"AIR LIQUIDE ADVANCED MAT INC",
"LAIR LIQUIDE SA POUR L ETUDE ET LEXPLOITATION DES PROCEDES GEORGES CLAUDE",
"AIR LIQUIDE ADVANCED MAT LLC",
"LAIR LIQUIDE SA POUR LETUDE ET LEXPLORATION DES PROCEDES GEORGES CLAUDE"
],
"filing_date": "2017-07-27",
"publication_date": "2019-01-29",
"grant_date": "2019-01-29",
"priority_date": "2016-12-11",
"application_number": "US-201715661576-A",
"family_id": "60243685",
"citations": [
"DE1158972B",
"EP2000561A1",
"KR20120024473A",
"KR20120099270A",
"KR20130135793A",
"KR20140057908A",
"US2005070717A1",
"US2005181633A1",
"US2006222583A1",
"US2007010072A1",
"US2008045723A1",
"US2008241575A1",
"US2008268642A1",
"US2009075490A1",
"US2009111284A1",
"US2009137100A1",
"US2009256127A1",
"US2009291872A1",
"US2009291874A1",
"US2009299084A1",
"US2010104755A1",
"US2010221428A1",
"US2011129616A1",
"US2012017934A1",
"US2012058282A1",
"US2012213940A1",
"US2012220139A1",
"US2013089487A1",
"US2013143018A1",
"US2013189854A1",
"US2013224097A1",
"US2013323435A1",
"US2014051264A1",
"US2014158580A1",
"US2014193953A1",
"US2015376211A1",
"US2016049293A1",
"US2016225616A1",
"US4675424A",
"US5413813A",
"US5874368A",
"US7638645B2",
"US7838329B2",
"US8357430B2",
"US8409513B2",
"US8771807B2",
"WO2006136584A1",
"WO2007008705A2",
"WO2009087609A2",
"WO2011056519A2",
"WO2015047914A1",
"WO2015190749A1",
"WO2016065219A1",
"WO2016065221A1",
"WO2016160990A1",
"WO2017070192A1",
"WO2017147150A1"
]
}
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