Substrate transport vacuum platform

{
  "publication_number": "US10269604B2",
  "country": "US",
  "kind": "B2",
  "title": "Substrate transport vacuum platform",
  "abstract": "An apparatus including a first device configured to support at least one substrate thereon; and a first transport having the device connected thereto. The transport is configured to carry the device. The transport includes a plurality of supports which are movable relative to one another along a linear path; at least one magnetic bearing which at least partially couples the supports to one another. A first one of the magnetic bearings includes a first permanent magnet and a second magnet. The first permanent magnet is connected to a first one of the supports. A magnetic field adjuster is connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet.",
  "claims": [
    "1. An apparatus comprising: a first device configured to support at least one substrate thereon, where the first device comprises at least one of an articulate robot and a substrate shuttle configured to move the substrate in a substrate processing apparatus or between substrate processing apparatus; and a first transport having the first device connected thereto, where the transport is configured to carry the first device, where the first transport comprises: a plurality of supports, where at least one of the supports is movable relative to one another one of the supports along a linear path; at least one magnetic bearing which at least partially couples the supports to one another, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to a first one of the supports; and a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet.",
    "2. An apparatus as in claim 1 where the supports comprise at least one stationary guide rail.",
    "3. An apparatus as in claim 1 where the second magnet is connected to one of the first support and the second support.",
    "4. An apparatus as in claim 1 where the second magnet comprises an electromagnet or a permanent magnet.",
    "5. An apparatus as in claim 1 where the first support comprises a first capacitive interface; where a second one of the supports comprises a second capacitive interface, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling and to allow heat transfer between the first and second capacitive interfaces.",
    "6. An apparatus as in claim 1 where the first support comprises a heat radiator thereon, where the first magnetic bearing is a non-contacting bearing, and where the apparatus further comprises: a first power coupling between the first support and a second one of the supports, where the first power coupling is a non-contacting power coupling; and a first heat pump connected to the first support, where at least one of the first magnetic bearing and the first power coupling comprise at least one active heat generating component, and where the first heat pump is configured to pump heat from the at least one active heat generating component to the heat radiator.",
    "7. An apparatus as in claim 1 further comprising a non-contacting communications coupling between the supports.",
    "8. An apparatus comprising: a first device configured to support at least one substrate thereon; and a first transport having the first device connected thereto, where the transport is configured to carry the first device, where the first transport comprises: a plurality of supports, where at least one of the supports is movable relative to one another one of the supports along a linear path; at least one magnetic bearing which at least partially couples the supports to one another, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to a first one of the supports; and a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet, where the supports form a non-contacting thermal coupling having interleaved opposing surfaces configured to transfer heat to one another by radiation and convection as a function of pressure.",
    "9. An apparatus comprising: a first device configured to support at least one substrate thereon; and a first transport having the first device connected thereto, where the transport is configured to carry the first device, where the first transport comprises: a plurality of supports, where at least one of the supports is movable relative to one another one of the supports along a linear path; at least one magnetic bearing which at least partially couples the supports to one another, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to a first one of the supports; and a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet, a second device configured to support at least one substrate thereon; and a second transport having the second device connected thereto, where the second transport is configured to carry the second device, where the second transport comprises: a plurality of second supports which are movable relative to one another along a linear path; and at least one second magnetic bearing which at least partially couples the second supports, where the transports are configured to move the devices with the devices at least partially passing over one another.",
    "10. A substrate transport apparatus comprising: a chamber forming an enclosed environment; and an apparatus comprising: a first device configured to support at least one substrate thereon, where the first device comprises at least one of an articulate robot and a substrate shuttle; and a first transport having the first device connected thereto, where the transport is configured to carry the first device, where the first transport comprises: a plurality of supports, where at least one of the supports is movable relative to one another one of the supports along a linear path; at least one magnetic bearing which at least partially couples the supports to one another, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to a first one of the supports; and a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet, where a second one of the supports is stationarily on a wall of the chamber.",
    "11. An apparatus comprising: a device configured to support at least one substrate thereon; and a transport having the device connected thereto, where the transport is configured to carry the device, where the transport comprises: a first support comprising a first capacitive interface; and a second support comprising a second capacitive interface, where the second support is movably connected relative to the first support along a linear path, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling and to allow heat transfer between the first and second capacitive interfaces; and a second device configured to support at least one substrate thereon; and a second transport having the second device connected thereto, where the second transport is configured to carry the second device, where the second transport comprises: a plurality of second supports which are movable relative to one another along a linear path; and at least one second magnetic bearing which at least partially couples the second supports, where the transports are configured to move the devices with the devices at least partially passing over one another.",
    "12. An apparatus as in claim 11 where the capacitive interfaces comprise interleaved opposing surfaces configured to transfer heat to one another by radiation and convection as a function of pressure.",
    "13. An apparatus as in claim 11 where the apparatus comprises: at least one magnetic bearing which at least partially couples the first and second supports to one another, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to the first support; and a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet.",
    "14. An apparatus as in claim 13 where the second magnet is connected to one of the first support and the second support.",
    "15. An apparatus as in claim 13 where the second magnet comprises an electromagnet or a permanent magnet.",
    "16. An apparatus as in claim 11 where the device comprises at least one of an articulate robot and a substrate shuttle.",
    "17. An apparatus as in claim 11 where the supports comprise at least one stationary guide rail.",
    "18. An apparatus as in claim 11 where the first support comprises a heat radiator thereon, where the first magnetic bearing is a non-contacting bearing, and where the apparatus further comprises: a first power coupling between the first support and the second support, where the first power coupling is a non-contacting power coupling; and a first heat pump connected to the first support, where at least one of the first magnetic bearing and the first power coupling comprise at least one active heat generating component, and where the first heat pump is configured to pump heat from the at least one active heat generating component to the heat radiator.",
    "19. An apparatus as in claim 11 further comprising a non-contacting communications coupling between the supports.",
    "20. A substrate transport apparatus comprising: a chamber forming an enclosed environment; and the apparatus as in claim 11, where the second support is stationarily on a wall of the chamber.",
    "21. An apparatus comprising: a device configured to support at least one substrate thereon; and a transport having the device connected thereto, where the transport is configured to carry the device, where the transport comprises: a plurality of supports which are movable relative to one another along a linear path, where a first one of the supports comprises a heat radiator thereon; a first magnetic bearing which at least partially couples the supports, where the first magnetic bearing is a non-contacting bearing; a first power coupling between the supports, where the first power coupling is a non-contacting power coupling; and a first heat pump connected to the first support, where at least one of the first magnetic bearing and the first power coupling comprise at least one active heat generating component, and where the first heat pump is configured to pump heat from the at least one active heat generating component to the heat radiator.",
    "22. An apparatus as in claim 21 where the first heat pump comprises a vapor compression heat pump or thermoelectric heat pump."
  ],
  "description_excerpt": "The exemplary and non-limiting embodiments relate generally to a system for transporting substrates and, more particularly, to a system for transporting substrates, in vacuum, having a linear configuration.\n\nSubstrate processing systems for semiconductor, LED or other suitable applications may involve the transport of substrates in a vacuum or other suitable environment. In the applications requiring vacuum transport there are platform architectures that involve the use of single or alternately the use of tandem or quad process modules. Single process modules may have a single processing location, whereas tandem or quad process modules may have two processing locations where two substrates may be processed next to each other and picked or placed by a vacuum robot at the same time. The process modules are typically arranged in a radial arrangement on a vacuum chamber having a robot that transfers substrates between the process modules and load locks. A problem arises in the use of process modules where a large number of modules are provided. A large radial transport chamber is required to transport the substrates to and from load locks, and to and from the one or more modules, requiring a large footprint or floor space. With footprint cost at a premium within a micro-electronics fabrication environment, there is a desire for a substrate transport platform with a reduced footprint.",
  "cpc": [
    "H10P 72/3204",
    "F16C 32/0434",
    "F16C 32/0465",
    "F16C 32/0472",
    "H01L 21/67709",
    "H01L 21/67742",
    "H02J 50/05",
    "H02J 50/10",
    "H02J 50/12",
    "H02J 50/90",
    "H10P 72/3302"
  ],
  "ipc": [
    "F16C 32/04",
    "H01L 21/677",
    "H02J 4/25",
    "H02J 50/10",
    "H02J 50/12",
    "H02J 50/90",
    "H02K 7/09"
  ],
  "assignees": [
    "Persimmon Technologies Corp"
  ],
  "inventors": [
    "Christopher Hofmeister",
    "Martin Hosek"
  ],
  "filing_date": "2015-01-21",
  "publication_date": "2019-04-23",
  "grant_date": "2019-04-23",
  "priority_date": "2014-01-21",
  "application_number": "US-201514601455-A",
  "family_id": "53679702",
  "cited_by_count": 9,
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}