Pad removal device and method

{
  "publication_number": "US10272661B2",
  "country": "US",
  "kind": "B2",
  "title": "Pad removal device and method",
  "abstract": "A pad removal device includes a pad guide having a first end and a second end along a first direction, an actuator attached to the first end, and a control assembly coupled to the actuator. The control assembly is configured to cause the actuator to move the first end toward the second end along the first direction, and the pad guide is configured to extend in a second direction perpendicular to the first direction by an amount dependent on a distance between the first end and the second end.",
  "claims": [
    "1. A pad removal device comprising: a pad guide having a first end and a second end along a first direction and a central portion between the two ends wherein the central portion is free of any affixing components; at least one affixing component attached only to a periphery of the pad guide; an actuator attached to the first end; and a control assembly coupled to the actuator, the control assembly configured to cause the actuator to move the first end toward the second end along the first direction, wherein the pad guide is configured to extend in a second direction perpendicular to the first direction by an amount dependent on a distance between the first end and the second end.",
    "2. The pad removal device of claim 1, wherein the pad guide comprises a clipper at each of the first end and the second end, and each clipper is configured to affix the pad guide to a chemical mechanical planarization (CMP) polishing pad.",
    "3. The pad removal device of claim 1, wherein the pad guide comprises at least one of a plurality of hinged plate segments or an elastic plate.",
    "4. The pad removal device of claim 1, wherein the actuator comprises one of a telescoping arm or a moveable stage.",
    "5. The pad removal device of claim 1, wherein the control assembly comprises one of a screw device or a pneumatic controller.",
    "6. The pad removal device of claim 1, wherein the control assembly comprises a winding device and the actuator comprises a wire.",
    "7. The pad removal device of claim 1, wherein the control assembly is configured to control a speed at which the actuator moves the first end toward the second end.",
    "8. The pad removal device of claim 7, wherein the speed includes a predetermined value and the control assembly comprises a controller configured to cause the actuator to move the first end toward the second end at the predetermined value.",
    "9. The pad removal device of claim 7, wherein the control assembly comprises a user interface configured to receive a value of the speed.",
    "10. The pad removal device of claim 1, wherein the control assembly comprises a carrier.",
    "11. The pad removal device of claim 1, further comprising another actuator, wherein the control assembly is coupled to the another actuator, and configured to cause the another actuator to move the second end toward the first end along the first direction.",
    "12. A method of removing a pad, the method comprising: affixing a first end of a pad guide to a first pad edge location; affixing a second end of the pad guide to a second pad edge location; pulling the first end toward the second end using an actuator; and using the pad guide, in response to the pulling the first end toward the second end, pulling each of the first pad edge location and the second pad edge location in a removal direction away from a pad center region.",
    "13. The method of claim 12, further comprising pulling the second end toward the first end using another actuator.",
    "14. The method of claim 12, further comprising, using a controller, controlling a speed at which the actuator pulls the first end toward the second end.",
    "15. The method of claim 14, wherein controlling the speed comprises increasing the speed as a distance between the first end and the second end decreases.",
    "16. The method of claim 14, wherein controlling the speed comprises controlling the speed using one of a screw device, a pneumatic controller, or a winding device.",
    "17. The method of claim 12, wherein: the pad guide comprises a plurality of plate segments, and the pulling each of the first pad edge location and the second pad edge location in the removal direction comprises a first segment of the plurality of plate segments rotating about a hinge relative to a second segment of the plurality of plate segments.",
    "18. The method of claim 12, wherein the pulling the first end toward the second end using the actuator comprises reducing a length of a telescoping arm.",
    "19. The method of claim 12, further comprising: affixing a first end of a second pad guide to a third pad edge location; affixing a second end of the second pad guide to a fourth pad edge location; pulling the first end of the second pad guide toward the second end of the second pad guide using another actuator; and using the second pad guide, in response to the pulling the first end of the second pad guide and the second end of the second pad guide toward each other, pulling each of the third pad edge location and the fourth pad edge location in the removal direction.",
    "20. A pad removal device comprising: a pad guide comprising a plurality of plate segments joined by a corresponding plurality of hinges; and a first end and a second end along a first direction; a first telescoping arm attached to the first end; a second telescoping arm attached to the second end; and a control assembly configured to simultaneously reduce a length of the first telescoping arm and a length of the second telescoping arm, wherein the pad guide is configured to extend in a second direction perpendicular to the first direction by an amount dependent on an amount of the reduction of the length of the first telescoping arm and an amount of the reduction of the length of the second telescoping arm."
  ],
  "description_excerpt": "Integrated circuit (IC) manufacturing often includes chemical mechanical planarization (CMP) processing operations in which chemical slurries and polish heads are applied to IC wafers. To facilitate control of movement and pressure during such operations, a wafer is typically supported by a CMP pad bonded to a platen. After a CMP pad reaches its useful lifetime, it is separated from the platen and replaced.\n\nAspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.\n\nFIGS. 1A-1E are diagrams of one or more pad removal devices, in accordance with some embodiments.\n\nFIGS. 2A-2C are diagrams of a pad guide, in accordance with some embodiments.\n\nFIGS. 3A-3C are diagrams of a pad guide, in accordance with some embodiments.\n\nFIG. 4 is a schematic diagram of a telescoping arm, in accordance with some embodiments.\n\nFIG. 5 is a schematic diagram of an actuating assembly, in accordance with some embodiments.\n\nFIG. 6 is a schematic diagram of an actuating assembly, in accordance with some embodiments.\n\nFIG. 7 is a flowchart of a method of removing a pad, in accordance with some embodiments.\n\nFIG. 8 is a schematic view of a system for controlling a pad removal device, in accordance with some embodiments.",
  "cpc": [
    "B32B 43/006",
    "B24B 37/34",
    "B32B 2307/538",
    "B32B 37/12",
    "B32B 7/12",
    "Y10T 156/1168",
    "Y10T 156/1978",
    "Y10T 156/1989"
  ],
  "ipc": [
    "B24B 37/34",
    "B32B 37/12",
    "B32B 43/00",
    "B32B 7/12"
  ],
  "assignees": [
    "Taiwan Semiconductor Manufacturing Co TSMC Ltd"
  ],
  "inventors": [
    "Chunhung Chen",
    "Sheng-Chen Wang"
  ],
  "filing_date": "2017-04-17",
  "publication_date": "2019-04-30",
  "grant_date": "2019-04-30",
  "priority_date": "2017-04-17",
  "application_number": "US-201715488958-A",
  "family_id": "63791465",
  "cited_by_count": 7,
  "citations": [
    "US7187162B2",
    "US9296193B2",
    "US20160329235A1",
    "US9724906B2",
    "US20160176181A1",
    "US20170077459A1"
  ]
}