Systems and methods for post-treatment of dry adhesive microstructures

{
  "publication_number": "US11534926B2",
  "country": "US",
  "kind": "B2",
  "title": "Systems and methods for post-treatment of dry adhesive microstructures",
  "abstract": "Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.",
  "claims": [
    "1. A system for manipulating an object, comprising: a backing layer; a printed circuit board coupled to said backing layer; a plurality of microstructure stalks coupled to said backing layer, wherein a microstructure stalk of said plurality of microstructure stalks comprises material doped with a conductive additive; and a polymer layer disposed at a tip of said microstructure stalk of said plurality of microstructure stalks, wherein a longitudinal axis of said polymer layer is different from a longitudinal axis of said microstructure stalk.",
    "2. The system of claim 1, wherein said conductive additive comprises a carbon nanotube.",
    "3. The system of claim 1, wherein said conductive additive comprises carbon black.",
    "4. The system of claim 1, wherein said conductive additive protrudes from an outer surface of said microstructure stalk as asperities.",
    "5. The system of claim 1, wherein respective longitudinal axes of each of said plurality of microstructure is oriented substantially along the same direction with respect to a plane of said backing layer.",
    "6. The system of claim 5, wherein said same direction is not normal to said plane of said backing layer.",
    "7. The system of claim 1, wherein said longitudinal axis of said polymer layer is substantially parallel to a plane of said backing layer.",
    "8. The system of claim 1, wherein said microstructure stalk is at most 60 micrometers in height from said backing layer.",
    "9. The system of claim 1, wherein said printed circuit board comprises a plurality of sensing electrodes, and wherein said plurality of sensing electrodes are configured to detect engagement of said polymer layer with a surface.",
    "10. A method for manipulating an object, comprising: (a) providing a gripping system comprising (i) a backing layer, (ii) a printed circuit board coupled to said backing layer, and (iii) a plurality of microstructure stalks coupled to said backing layer, wherein a microstructure stalk of said plurality of microstructure stalks comprises material doped with a conductive additive, and (iv) a polymer layer disposed at a tip of said microstructure stalk of said plurality of microstructure stalks, wherein a longitudinal axis of said polymer layer is different from a longitudinal axis of said microstructure stalk; and (b) contacting a surface of said object with said polymer layer to engage said object.",
    "11. The method of claim 10, wherein said conductive additive comprises a carbon nanotube.",
    "12. The method of claim 10, wherein said conductive additive comprises carbon black.",
    "13. The method of claim 10, wherein said conductive additive protrudes from an outer surface of said microstructure stalk as asperities.",
    "14. The method of claim 10, wherein respective longitudinal axes of each of said plurality of microstructure is oriented substantially along the same direction with respect to a plane of said backing layer.",
    "15. The method of claim 14, wherein said same direction is not normal to said plane of said backing layer.",
    "16. The method of claim 10, wherein said longitudinal axis of said polymer layer is substantially parallel to a plane of said backing layer.",
    "17. The method of claim 10, wherein said microstructure stalk is at most 60 micrometers in height from said backing layer.",
    "18. The method of claim 10, wherein said printed circuit board comprises a plurality of sensing electrodes.",
    "19. The method of claim 10, further comprising using said plurality of sensing electrodes to detect engagement of said polymer layer with said surface of said object."
  ],
  "description_excerpt": "Artificial fibrillar microstructures have been shown to mimic the dry adhesive capabilities of micro-scale setae on the toes of the gecko lizard. In particular, individual fibrillar microstructures can be configured to conform to an adhering surface to improve real contact area and thereby increase attractive forces (e.g., intermolecular van der Waals forces) between the individual fibers and the contact surface. Dry adhesives, which are not dependent on liquid secretion, can adhere to and release from contact surfaces without leaving residue on the surfaces and with minimal contamination, allowing for repeated uses and longer lifetimes.\n\nPhysical characteristics and material properties of fibrillar microstructures can enhance or diminish their adhesive performance. For instance, synthetic fibrillar microstructures may be fabricated or post-treated to comprise tips having specific shapes, such as mushroom-like flaps, that can increase the real contact area between the individual fibers and the contact surface and significantly enhance the dry adhesive performance of these synthetic fibrillar microstructures. In another instance, the synthetic fibrillar microstructures may be fabricated or post-treated to comprise materials having different material properties. In some instances, different material properties, such as material conductivity, may allow for sensing systems to be integrated into the microstructures.\n\nRecognized herein are systems and methods for the post-treatment of dry adhesive microstructures that can improve adhesive performance.",
  "cpc": [
    "B25J 15/0085",
    "B81B 2207/056",
    "B81C 1/00",
    "B81C 1/00206",
    "C08K 2201/001",
    "C08K 3/04",
    "C08K 3/041",
    "C09J 11/04",
    "C09J 201/00",
    "C09J 2301/31",
    "C09J 7/00",
    "C09J 9/02"
  ],
  "ipc": [
    "B25J 15/00",
    "B81C 1/00",
    "C09J 11/04",
    "C09J 201/00",
    "C09J 7/00",
    "C09J 9/02"
  ],
  "assignees": [
    "OnRobot AS"
  ],
  "inventors": [
    "Mohammad DADKHAH TEHRANI",
    "Nicholas Wettels"
  ],
  "filing_date": "2020-03-30",
  "publication_date": "2022-12-27",
  "grant_date": "2022-12-27",
  "priority_date": "2017-03-16",
  "application_number": "US-202016833900-A",
  "family_id": "63520914",
  "cited_by_count": 2,
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