Patents full text · MLC-0201
CPC subclass B81C
Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US10189243B2 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | 2019-01-29 | X CELEPRINT LTD |
| 2 | US9517929B2 | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses | 2016-12-13 | ROFIN-SINAR TECH INC |
| 3 | US9117940B2 | Optical systems fabricated by printing-based assembly | 2015-08-25 | UNIV ILLINOIS |
| 4 | US7982296B2 | Methods and devices for fabricating and assembling printable semiconductor elements | 2011-07-19 | UNIV ILLINOIS |
| 5 | US7932123B2 | Release strategies for making transferable semiconductor structures, devices and device components | 2011-04-26 | UNIV ILLINOIS |
| 6 | US7704684B2 | Methods and devices for fabricating three-dimensional nanoscale structures | 2010-04-27 | UNIV ILLINOIS |
| 7 | US6071819A | Flexible skin incorporating mems technology | 2000-06-06 | CALIFORNIA INST OF TECHN |
7 records in this listing. Patents full text (MLC-0201). Request the full dataset.