MLchartDataset catalogue

Patent · US7704684B2 · B2 · US

Methods and devices for fabricating three-dimensional nanoscale structures

(11) Publication number
US7704684B2
(21) Application number
US-168904-A
(22) Filing date
2004-12-01
(30) Priority date
2003-12-01
(43) Publication date
2010-04-27
(45) Date of grant
2010-04-27
(52) CPC
  • B81C Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems: 99/00
  • B82B Nanostructures formed by manipulation of individual atoms, molecules, or limited collections of atoms or molecules as discrete units; manufacture or treatment thereof: 3/00
  • B82Y Specific uses or applications of nanostructures; measurement or analysis of nanostructures; manufacture or treatment of nanostructures: 10/00, 30/00, 40/00
  • G03F Photomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; materials therefor; originals therefor; apparatus specially adapted therefor: 1/50, 7/00, 7/20, 7/26, 7/70283, 7/703, 7/7035, 7/70408
  • Y10S Technical subjects covered by former uspc cross-reference art collections [xracs] and digests: 430/146
(73) Assignee
UNIV ILLINOIS
(54) Title
Methods and devices for fabricating three-dimensional nanoscale structures
(57) Abstract

The present invention provides methods and devices for fabricating 3D structures and patterns of 3D structures on substrate surfaces, including symmetrical and asymmetrical patterns of 3D structures. Methods of the present invention provide a means of fabricating 3D structures having accurately selected physical dimensions, including lateral and vertical dimensions ranging from 10s of nanometers to 1000s of nanometers. In one aspect, methods are provided using a mask element comprising a conformable, elastomeric phase mask capable of establishing conformal contact with a radiation sensitive material undergoing photoprocessing. In another aspect, the temporal and/or spatial coherence of electromagnetic radiation using for photoprocessing is selected to fabricate complex structures having nanoscale features that do not extend entirely through the thickness of the structure fabricated.

Full text
View on Google Patents

Claims (3)

  1. A method for making a 3D structure, said method comprising the steps of: providing a radiation sensitive material; generating a relief pattern on said radiation sensitive material; providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto said relief pattern; wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating a optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material; and removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure.
  2. A method for making a 3D structure, said method comprising the steps of: providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material; wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material, removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure; wherein said relief pattern comprises an array of cylindrical posts.
  3. A method for making a 3D structure, said method comprising the steps of: providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material; wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material, removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure; wherein said relief pattern comprises an array of cylindrical posts and said cylindrical posts have diameters and heights that are independently selected from a range that is greater than or equal to 50 nm and less than or equal to 5000 nm.

Citations (11)

  • JPH1126344A
  • TW367570B
  • TW494257B
  • US2002110766A1
  • US2003227116A1
  • US2004027675A1
  • US2004192082A1
  • US2005124712A1
  • US4766670A
  • US6403397B1
  • WO02073699A2
Record as JSON
{
  "publication_number": "US7704684B2",
  "country": "US",
  "kind": "B2",
  "title": "Methods and devices for fabricating three-dimensional nanoscale structures",
  "abstract": "The present invention provides methods and devices for fabricating 3D structures and patterns of 3D structures on substrate surfaces, including symmetrical and asymmetrical patterns of 3D structures. Methods of the present invention provide a means of fabricating 3D structures having accurately selected physical dimensions, including lateral and vertical dimensions ranging from 10s of nanometers to 1000s of nanometers. In one aspect, methods are provided using a mask element comprising a conformable, elastomeric phase mask capable of establishing conformal contact with a radiation sensitive material undergoing photoprocessing. In another aspect, the temporal and/or spatial coherence of electromagnetic radiation using for photoprocessing is selected to fabricate complex structures having nanoscale features that do not extend entirely through the thickness of the structure fabricated.",
  "claims": [
    "1. A method for making a 3D structure, said method comprising the steps of: providing a radiation sensitive material; generating a relief pattern on said radiation sensitive material; providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto said relief pattern; wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating a optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material; and removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure.",
    "2. A method for making a 3D structure, said method comprising the steps of: providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material; wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material, removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure; wherein said relief pattern comprises an array of cylindrical posts.",
    "3. A method for making a 3D structure, said method comprising the steps of: providing a substantially coherent beam of electromagnetic radiation; directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material; wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material; wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material, removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure; wherein said relief pattern comprises an array of cylindrical posts and said cylindrical posts have diameters and heights that are independently selected from a range that is greater than or equal to 50 nm and less than or equal to 5000 nm."
  ],
  "cpc": [
    "B81C 99/00",
    "B82B 3/00",
    "B82Y 10/00",
    "B82Y 30/00",
    "B82Y 40/00",
    "G03F 1/50",
    "G03F 7/00",
    "G03F 7/20",
    "G03F 7/26",
    "G03F 7/70283",
    "G03F 7/703",
    "G03F 7/7035",
    "G03F 7/70408",
    "Y10S 430/146"
  ],
  "assignees": [
    "UNIV ILLINOIS"
  ],
  "filing_date": "2004-12-01",
  "publication_date": "2010-04-27",
  "grant_date": "2010-04-27",
  "priority_date": "2003-12-01",
  "application_number": "US-168904-A",
  "family_id": "34657216",
  "citations": [
    "JPH1126344A",
    "TW367570B",
    "TW494257B",
    "US2002110766A1",
    "US2003227116A1",
    "US2004027675A1",
    "US2004192082A1",
    "US2005124712A1",
    "US4766670A",
    "US6403397B1",
    "WO02073699A2"
  ]
}

Record 2,504 of 5,000 in Patents full text (MLC-0201). Request the full dataset.