Patent · US11783971B2 · B2 · US
Joint, electrical feedthrough, and sensor
- (11) Publication number
- US11783971B2
- (21) Application number
- 17/569,750
- (22) Filing date
- 2022-01-06
- (30) Priority date
- 2021-01-08
- (43) Publication date
- 2023-10-10
- (45) Date of grant
- 2023-10-10
- (51) IPC
- C03C 27/04; G01D 11/24; H01B 17/30
- (52) CPC
- H01B Cables; conductors; insulators; selection of materials for their conductive, insulating or dielectric properties: 17/305, 3/00, 7/02
- C03C Chemical composition of glasses, glazes or vitreous enamels; surface treatment of glass; surface treatment of fibres or filaments made from glass, minerals or slags; joining glass to glass or other materials: 27/00, 27/042, 3/066, 3/122, 3/15, 3/155, 8/24
- C04B Lime, magnesia; slag; cements; compositions thereof, e.g. mortars, concrete or like building materials; artificial stone {}; ceramics; refractories; treatment of natural stone: 2237/10, 37/023
- C09J Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives: 1/00
- F16B Devices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges; joints or jointing: 11/006
- G01D Measuring not specially adapted for a specific variable; arrangements for measuring two or more variables not covered in a single other subclass; tariff metering apparatus; measuring or testing not otherwise provided for: 11/245
- G01L Measuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure: 1/18
- H01C Resistors: 1/14
- H01G Capacitors; capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices of the electrolytic type: 2/103, 4/35, 9/08, 9/10
- H01R Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors: 13/405, 13/5216, 13/74
- (73) Assignee
- Kistler Holding AG
- (72) Inventors
- Giovanni Mastrogiacomo; Hans Beat Maerki; Thomas Cadonau
- (54) Title
- Joint, electrical feedthrough, and sensor
- (57) Abstract
A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10 −6 K −1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10 −6 K −1. The ceramic member has a maximum coefficient of thermal expansion of 8-10 −6 K −1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.
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Claims (18)
- A joint that joins an alloy member having a coefficient of thermal expansion of at least 9-10 −6 K −1 and a ceramic member having a maximum coefficient of thermal expansion of 8-10 −6 K −1, the joint comprising: a glass joining agent made of a glass having a melting point below 800° C., a bismuth content of at least 10% and a coefficient of thermal expansion of at least 9-10 −6 K −1; a first material bonded joint that is disposed between the glass joining agent and the alloy member and joins the glass joining agent to the alloy member; a second material bonded joint that joins the glass joining agent to the ceramic member; wherein the second material bonded joint between the glass joining agent and the ceramic member defines a mixing region that is a partial region of the ceramic member; and wherein the mixing region has a higher bismuth content compared to the bismuth content of the ceramic member outside of the mixing region.
- The joint according to claim 1, wherein the mixing region is located spatially adjacent to the glass joining agent; and wherein the bismuth content in the mixing region increases towards the glass joining agent.
- The joint according to claim 1, wherein the bismuth content decreases from the glass joining agent to the mixing region.
- The joint according to claim 3, wherein the mixing region has a spatial extension from the glass joining agent of at least 0. 001 mm; and wherein the mixing region is delimited by the extension of the ceramic member and is further delimited within the ceramic member by a plane in which the bismuth content in the ceramic member equals 1/e of the bismuth content in the ceramic member in the mixing region directly adjacent to the glass joining agent.
- The joint according to claim 1, wherein the glass joining agent is free of lead; and wherein the glass joining agent is made of a glass having a melting temperature below 650° C.
- The joint according to claim 1, wherein the glass joining agent is free of lead; and wherein the glass joining agent is made of a glass having a melting temperature below 800° C.
- The joint according to claim 1, wherein the ceramic member is electrically insulating; and wherein the ceramic member has a content that includes aluminum oxide, zirconium oxide, silicon oxide or a mixture of these materials; and wherein said content is at least 95%.
- The joint according to claim 7, wherein said content is at least 70%.
- The joint according to claim 1, wherein the alloy member has a polycrystalline structure; and wherein the average grain size of the polycrystalline structure on average is less than 0.01 mm.
- The joint according to claim 1, wherein the alloy member is a martensitic steel having the EN material numbers 1.4542, 1.4534 or 1.4614.
- The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3, 1% to 10% B 2 O 3, 10% to 50 % ZnO, 1% to 10% SiO 2, 0.1% to 1% Al 2 O 3.
- The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3, 1% to 10% B 2 O 3, 1% to 10% ZnO, 0.1% to 1% CeO 2.
- The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3;, 1% to 10% B 2 O 3, 1% to 10% ZnO, 0.1% to 1% CeO 2, 0.1% to 1% ZrO 2.
- An electrical feedthrough for conducting electrical charges from a first region to a second region, the electrical feedthrough comprising: a first alloy member that defines a housing that includes a wall extending along a longitudinal axis and defining a wall opening about the longitudinal axis; a second alloy member that defines an electrical conductor that elongates along the longitudinal axis and is disposed at least partially within the wall opening of the housing; a ceramic member, which is electrically insulating and at least partially disposed within the wall opening and radially enclosing at least a portion of the elongation of the electrical conductor along the longitudinal axis so as to electrically insulate the electrical conductor from the wall opening; a first joint that joins the electrical conductor and the ceramic member; a second joint that joins the housing wall and the ceramic member; wherein each of the first joint and the second joint includes a glass joining agent disposed within the wall opening adjacent to the ceramic member at a mixing region of the ceramic member and radially surrounding at least a portion of the elongation of the electrical conductor along the longitudinal axis; wherein the glass joining agent is made of a glass having a melting point below 800° C., a bismuth content of at least 10% and a coefficient of thermal expansion of at least 9-10 −6 K −1; and wherein the mixing region has a higher bismuth content compared to the bismuth content of the ceramic member outside of the mixing region.
- The electrical feedthrough according to claim 14, wherein the first joint and the second joint are configured to effect a seal between the first region and the second region.
- The electrical feedthrough according to claim 15, wherein the tight seal between the first region and the second region is not impaired by permanent or temporary temperatures off up to 350° C.
- The electrical feedthrough according to claim 14, wherein the electrical conductor is defined by a diameter, wherein an insulation path is defined by a portion of the elongation of the electrical conductor along the longitudinal axis electrically insulated from the wall opening by the ceramic member and the glass joining agent, wherein the ratio of the length of the insulation path to the diameter of the electrical conductor is greater than three.
- The electrical feedthrough according to claim 14, wherein the length of the joining agent along the longitudinal axis is at least two times smaller than the diameter of the joining agent in a direction perpendicular to the longitudinal axis.
Description
The present invention relates to a joint that connects an alloy member to a ceramic member by means of a glass joining agent with characteristic melting point, bismuth content and coefficient of thermal expansion. The invention also relates to an electrical feedthrough that includes this joint, and a sensor that includes at least one such electrical feedthrough.
Temperature-resistant material bonded joints between different materials are required in a variety of industrial products. Generally, a material bonded joint between two members to be bonded to one another is formed for this purpose by means of a bonding agent. However, due to the different coefficients of thermal expansion, it is often difficult to achieve a temperature-resistant material bonded joint between a ceramic member and an alloy member consisting of a metal alloy, in the following shortly called “alloy,” or of a metal or is severely restricted regarding the choice of material. In metallurgy, an alloy is defined as a material comprising at least two chemical elements at least one of which is a metal that together exhibit the property of metallic bonding. For clarity, the term metal alloy (or shortly “alloy” will be used in the following to refer to a pure metal or a metal alloy or other metallic material. If the joint is produced with the members to be joined brought to high temperatures, for example by soldering using a metal solder as the bonding agent at the melting temperature of the solder, strong forces will act on the joint at temperatures different from the melting temperature of the solder.
Citations (22)
- US3638076A
- US4016437A
- JPS5895673A
- JPH0891950A
- US6111198A
- EP0978888A1
- EP1688160A2
- JP2007186395A
- US20110000531A1
- EP2388101A1
- US20160056570A1
- JP2015005801A
- CN105612019A
- US20160228966A1
- JP2015205801A
- DE102014016600A1
- US20160293301A1
- JP2016216300A
- CN105481253B
- CN108511641B
- WO2020104571A1
- US20210280934A1
Record as JSON
{
"publication_number": "US11783971B2",
"country": "US",
"kind": "B2",
"title": "Joint, electrical feedthrough, and sensor",
"abstract": "A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10 −6 K −1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10 −6 K −1. The ceramic member has a maximum coefficient of thermal expansion of 8-10 −6 K −1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.",
"claims": [
"1. A joint that joins an alloy member having a coefficient of thermal expansion of at least 9-10 −6 K −1 and a ceramic member having a maximum coefficient of thermal expansion of 8-10 −6 K −1, the joint comprising: a glass joining agent made of a glass having a melting point below 800° C., a bismuth content of at least 10% and a coefficient of thermal expansion of at least 9-10 −6 K −1; a first material bonded joint that is disposed between the glass joining agent and the alloy member and joins the glass joining agent to the alloy member; a second material bonded joint that joins the glass joining agent to the ceramic member; wherein the second material bonded joint between the glass joining agent and the ceramic member defines a mixing region that is a partial region of the ceramic member; and wherein the mixing region has a higher bismuth content compared to the bismuth content of the ceramic member outside of the mixing region.",
"2. The joint according to claim 1, wherein the mixing region is located spatially adjacent to the glass joining agent; and wherein the bismuth content in the mixing region increases towards the glass joining agent.",
"3. The joint according to claim 1, wherein the bismuth content decreases from the glass joining agent to the mixing region.",
"4. The joint according to claim 3, wherein the mixing region has a spatial extension from the glass joining agent of at least 0. 001 mm; and wherein the mixing region is delimited by the extension of the ceramic member and is further delimited within the ceramic member by a plane in which the bismuth content in the ceramic member equals 1/e of the bismuth content in the ceramic member in the mixing region directly adjacent to the glass joining agent.",
"5. The joint according to claim 1, wherein the glass joining agent is free of lead; and wherein the glass joining agent is made of a glass having a melting temperature below 650° C.",
"6. The joint according to claim 1, wherein the glass joining agent is free of lead; and wherein the glass joining agent is made of a glass having a melting temperature below 800° C.",
"7. The joint according to claim 1, wherein the ceramic member is electrically insulating; and wherein the ceramic member has a content that includes aluminum oxide, zirconium oxide, silicon oxide or a mixture of these materials; and wherein said content is at least 95%.",
"8. The joint according to claim 7, wherein said content is at least 70%.",
"9. The joint according to claim 1, wherein the alloy member has a polycrystalline structure; and wherein the average grain size of the polycrystalline structure on average is less than 0.01 mm.",
"10. The joint according to claim 1, wherein the alloy member is a martensitic steel having the EN material numbers 1.4542, 1.4534 or 1.4614.",
"11. The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3, 1% to 10% B 2 O 3, 10% to 50 % ZnO, 1% to 10% SiO 2, 0.1% to 1% Al 2 O 3.",
"12. The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3, 1% to 10% B 2 O 3, 1% to 10% ZnO, 0.1% to 1% CeO 2.",
"13. The joint according to claim 1, wherein the glass joining agent comprises more than 50% Bi 2 O 3;, 1% to 10% B 2 O 3, 1% to 10% ZnO, 0.1% to 1% CeO 2, 0.1% to 1% ZrO 2.",
"14. An electrical feedthrough for conducting electrical charges from a first region to a second region, the electrical feedthrough comprising: a first alloy member that defines a housing that includes a wall extending along a longitudinal axis and defining a wall opening about the longitudinal axis; a second alloy member that defines an electrical conductor that elongates along the longitudinal axis and is disposed at least partially within the wall opening of the housing; a ceramic member, which is electrically insulating and at least partially disposed within the wall opening and radially enclosing at least a portion of the elongation of the electrical conductor along the longitudinal axis so as to electrically insulate the electrical conductor from the wall opening; a first joint that joins the electrical conductor and the ceramic member; a second joint that joins the housing wall and the ceramic member; wherein each of the first joint and the second joint includes a glass joining agent disposed within the wall opening adjacent to the ceramic member at a mixing region of the ceramic member and radially surrounding at least a portion of the elongation of the electrical conductor along the longitudinal axis; wherein the glass joining agent is made of a glass having a melting point below 800° C., a bismuth content of at least 10% and a coefficient of thermal expansion of at least 9-10 −6 K −1; and wherein the mixing region has a higher bismuth content compared to the bismuth content of the ceramic member outside of the mixing region.",
"15. The electrical feedthrough according to claim 14, wherein the first joint and the second joint are configured to effect a seal between the first region and the second region.",
"16. The electrical feedthrough according to claim 15, wherein the tight seal between the first region and the second region is not impaired by permanent or temporary temperatures off up to 350° C.",
"17. The electrical feedthrough according to claim 14, wherein the electrical conductor is defined by a diameter, wherein an insulation path is defined by a portion of the elongation of the electrical conductor along the longitudinal axis electrically insulated from the wall opening by the ceramic member and the glass joining agent, wherein the ratio of the length of the insulation path to the diameter of the electrical conductor is greater than three.",
"18. The electrical feedthrough according to claim 14, wherein the length of the joining agent along the longitudinal axis is at least two times smaller than the diameter of the joining agent in a direction perpendicular to the longitudinal axis."
],
"description_excerpt": "The present invention relates to a joint that connects an alloy member to a ceramic member by means of a glass joining agent with characteristic melting point, bismuth content and coefficient of thermal expansion. The invention also relates to an electrical feedthrough that includes this joint, and a sensor that includes at least one such electrical feedthrough.\n\nTemperature-resistant material bonded joints between different materials are required in a variety of industrial products. Generally, a material bonded joint between two members to be bonded to one another is formed for this purpose by means of a bonding agent. However, due to the different coefficients of thermal expansion, it is often difficult to achieve a temperature-resistant material bonded joint between a ceramic member and an alloy member consisting of a metal alloy, in the following shortly called “alloy,” or of a metal or is severely restricted regarding the choice of material. In metallurgy, an alloy is defined as a material comprising at least two chemical elements at least one of which is a metal that together exhibit the property of metallic bonding. For clarity, the term metal alloy (or shortly “alloy” will be used in the following to refer to a pure metal or a metal alloy or other metallic material. If the joint is produced with the members to be joined brought to high temperatures, for example by soldering using a metal solder as the bonding agent at the melting temperature of the solder, strong forces will act on the joint at temperatures different from the melting temperature of the solder.",
"cpc": [
"H01B 17/305",
"C03C 27/00",
"C03C 27/042",
"C03C 3/066",
"C03C 3/122",
"C03C 3/15",
"C03C 3/155",
"C03C 8/24",
"C04B 2237/10",
"C04B 37/023",
"C09J 1/00",
"F16B 11/006",
"G01D 11/245",
"G01L 1/18",
"H01B 3/00",
"H01B 7/02",
"H01C 1/14",
"H01G 2/103",
"H01G 4/35",
"H01G 9/08",
"H01G 9/10",
"H01R 13/405",
"H01R 13/5216",
"H01R 13/74"
],
"ipc": [
"C03C 27/04",
"G01D 11/24",
"H01B 17/30"
],
"assignees": [
"Kistler Holding AG"
],
"inventors": [
"Giovanni Mastrogiacomo",
"Hans Beat Maerki",
"Thomas Cadonau"
],
"filing_date": "2022-01-06",
"publication_date": "2023-10-10",
"grant_date": "2023-10-10",
"priority_date": "2021-01-08",
"application_number": "US-202217569750-A",
"family_id": "74494712",
"cited_by_count": 0,
"citations": [
"US3638076A",
"US4016437A",
"JPS5895673A",
"JPH0891950A",
"US6111198A",
"EP0978888A1",
"EP1688160A2",
"JP2007186395A",
"US20110000531A1",
"EP2388101A1",
"US20160056570A1",
"JP2015005801A",
"CN105612019A",
"US20160228966A1",
"JP2015205801A",
"DE102014016600A1",
"US20160293301A1",
"JP2016216300A",
"CN105481253B",
"CN108511641B",
"WO2020104571A1",
"US20210280934A1"
]
}
Record 647 of 8,000 in Patents full text (MLC-0201). Request the full dataset.