Substrate structures applied in flexible electrical devices and fabrication method thereof

{
  "publication_number": "US2010068483A1",
  "country": "US",
  "kind": "A1",
  "title": "Substrate structures applied in flexible electrical devices and fabrication method thereof",
  "abstract": "A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention also provides a method for fabricating the substrate structure.",
  "claims": [
    "1. A substrate structure applied in flexible electrical devices, comprising: a carrier; a release layer overlying the carrier with a first area; and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier.",
    "2. The substrate structure applied in flexible electrical devices as claimed in claim 1, wherein the carrier comprises glass or silicon wafer.",
    "3. The substrate structure applied in flexible electrical devices as claimed in claim 1, wherein the adhesion force of the release layer to the carrier is 0B-1B.",
    "4. The substrate structure applied in flexible electrical devices as claimed in claim 1, wherein the release layer comprises parylene or cyclic olefin copolymers (COC).",
    "5. The substrate structure applied in flexible electrical devices as claimed in claim 1, wherein the adhesion force of the flexible substrate to the carrier is 1-5B.",
    "6. The substrate structure applied in flexible electrical devices as claimed in claim 1, wherein the flexible substrate comprises polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyacrylate (PA), polynorbornene (PNB), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate (PEN) or polyetherimide (PEI).",
    "7. The substrate structure applied in flexible electrical devices as claimed in claim 6, wherein the polyimide (PI) has formula (I): wherein A comprises wherein X and Y comprise hydrogen, methyl, trifluoromethyl, hydroxyl, - OR, bromine, chlorine or iodine, and Z comprises - O -, - CH2-, - C(CH3)2-, - SO2-, - Ar - O - Ar -, - Ar - CH2-Ar -, - Ar - C(CH3)2-Ar - or - Ar - SO2-Ar -, wherein R comprises C1-18 alkyl, and Ar is benzene; B comprises wherein X and Y comprise hydrogen, methyl, trifluoromethyl, hydroxyl, - OR, bromine, chlorine or iodine, and Z comprises - O -, - CH2-, - C(CH3)2-, - SO2-, - Ar - O - Ar -, - Ar - CH2-Ar -, - Ar - C(CH3)2-Ar - or - Ar - SO2-Ar -, wherein R comprises C1-18 alkyl, and Ar is benzene; and n is an integer greater than 1.",
    "8. The substrate structure applied in flexible electrical devices as claimed in claim 6, wherein the flexible substrate further comprises siloxane compounds.",
    "9. The substrate structure applied in flexible electrical devices as claimed in claim 8, wherein the flexible substrate further comprises silicon oxide.",
    "10. A method for fabricating a substrate structure applied in flexible electrical devices, comprising: providing a carrier; forming a release layer on the carrier with a first area; and forming a flexible substrate on the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier.",
    "11. The method for fabricating a substrate structure applied in flexible electrical devices as claimed in claim 10, wherein the release layer is formed on the carrier by coating or evaporation.",
    "12. The method for fabricating a substrate structure applied in flexible electrical devices as claimed in claim 10, wherein the flexible substrate is formed on the release layer and the carrier by coating.",
    "13. The method for fabricating a substrate structure applied in flexible electrical devices as claimed in claim 10, further comprising cutting a portion of the flexible substrate and the carrier along two ends or the inside of the release layer to separate the release layer, the flexible substrate and the carrier."
  ],
  "cpc": [
    "H10K 77/111",
    "B32B 2250/44",
    "B32B 2307/546",
    "B32B 2307/58",
    "B32B 2457/20",
    "B32B 27/08",
    "B32B 27/18",
    "B32B 27/28",
    "B32B 27/281",
    "B32B 27/283",
    "B32B 27/285",
    "B32B 27/286",
    "B32B 27/288",
    "B32B 27/308",
    "B32B 27/325",
    "B32B 27/36",
    "B32B 27/365",
    "B32B 7/06",
    "G09F 9/30",
    "H05K 1/0393",
    "H05K 2203/016",
    "H05K 3/007",
    "Y02E 10/549",
    "Y10T 156/10",
    "Y10T 428/24",
    "Y10T 428/24942"
  ],
  "assignees": [
    "IND TECH RES INST"
  ],
  "filing_date": "2008-12-08",
  "publication_date": "2010-03-18",
  "priority_date": "2008-09-15",
  "application_number": "US-33006108-A",
  "family_id": "42007494",
  "citations": [
    "US2002134497A1",
    "US2006240202A1",
    "US2007059854A1",
    "US2007091062A1",
    "US2008099134A1"
  ]
}