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Patent · US9324968B2 · B2 · US

Method of manufacturing an organic light emitting display device

(11) Publication number
US9324968B2
(21) Application number
14/091,821
(22) Filing date
2013-11-27
(30) Priority date
2013-09-13
(43) Publication date
2016-04-26
(45) Date of grant
2016-04-26
(51) IPC
H10K 71/40
(52) CPC
  • H10K Organic electric solid-state devices: 59/8731, 2102/311, 2102/351, 2102/361, 50/84, 50/8426, 50/844, 50/8445, 59/12, 59/8722, 59/873, 59/88, 71/00, 71/40, 77/111
  • H01L Semiconductor devices; electric solid state devices not otherwise provided for: 2251/5338, 2251/556, 2251/558, 27/3223, 51/0097, 51/5237, 51/5246, 51/5253, 51/5256, 51/56
(73) Assignee
Samsung Display Co Ltd
(72) Inventors
Keun Soo Lee; Young Gu Kim; Hyun Jun Cho; Young Ji Kim; Jeong Yong EOM
(54) Title
Method of manufacturing an organic light emitting display device
(57) Abstract

A manufacturing method of an organic light emitting diode (OLED) display is disclosed. The manufacturing method in accordance with an exemplary embodiment includes: preparing a flexible substrate and a display panel including a thin film encapsulation (TFE) layer for covering and protecting an OLED formed on the flexible substrate; attaching a first protection film to the TFE layer by using a first adhesive to be opposite to the TFE layer; heating a second protection film; and pressing and attaching a second protection film onto the flexible substrate by using a second adhesive.

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Claims (12)

  1. A manufacturing method of an organic light emitting diode (OLED) display, the manufacturing method comprising: adhering a first protection film to a thin film encapsulation (TFE) layer of an organic light emitting device using a first adhesive, heating a second protection film; heating a third protection film after heating the first protection film; adhering the second protection film to a flexible substrate of the organic light emitting device using a second adhesive after the heating of the second protection film; and adhering the third protection film to the first protection film by using a third adhesive after heating the first protection film, the third protection film being disposed opposite the first protection film.
  2. The manufacturing method of claim 1, wherein heating the third protection film comprises: mounting the third protection film on a third protection film stage and then heating at least one of a roller and the third protection film stage to transfer heat to the third protection film.
  3. The manufacturing method of claim 2, wherein adhering the third protection film comprises pressing and attaching the third protection film to the flexible substrate by pressing one side of both the third protection film and the third protection film stage, and moving the third protection film stage in one direction.
  4. The manufacturing method of claim 2, wherein heating of the third protection film further comprises applying heat in a temperature range of about 50° C. to 130° C. to at least one of the roller and the third protection film stage.
  5. The manufacturing method of claim 1, wherein the first adhesive has a thickness in a range of 70 to 80 μm, and the second adhesive has a thickness in a range of 20 to 30 μm.
  6. The manufacturing method of claim 1, wherein the first adhesive and the second adhesive have different elongation rates.
  7. The manufacturing method of claim 1, wherein the first adhesive comprises a silicone material.
  8. The manufacturing method of claim 1, wherein the second adhesive comprises an acryl material.
  9. The manufacturing method of claim 1, wherein each of the first protection film and the second protection film has a thickness in a range of 70 to 80 μm.
  10. The manufacturing method of claim 1, wherein the first protection film, the second protection film, and the third protection film each comprise a flexible plastic material.
  11. The manufacturing method of claim 1, wherein the third protection film has a thickness in a range of 20 to 30 μm.
  12. The manufacturing method of claim 1, wherein the third adhesive has a thickness in a range of 5 to 15 μm.

Description

1. Field

Exemplary embodiments of the present invention relate to a manufacturing method for an organic light emitting diode (OLED) display. More particularly, exemplary embodiments relate to an OLED display having a curling-improved structure.

2. Discussion of the Background

Organic light emitting diode displays include organic light emitting elements that include a hole injection electrode, an organic emission layer, and an electron injection electrode. Each organic light emitting element emits light by energy generated when an exciton, generated by combining an electron and a hole in the organic emission layer, falls from an exited state to a ground state. Thus, the organic light emitting diode display displays a predetermined image by using this light emission.

In contrast to liquid crystal displays, organic light emitting diode displays have a self-luminance characteristic so a separate light source is not required. Thus, thickness and weight of the display may be reduced. Further, since organic light emitting diode displays exhibit desirable characteristics such as low power consumption, high luminance, and rapid response speed, organic light emitting diode displays are receiving attention as a next generation display device.

The organic light emitting diode (OLED) display has a panel structure in which a driving circuit unit and the organic light emitting element formed on a flexible substrate are protected by a thin film encapsulation (TFE) layer. In a process of forming the TFE layer, chemical vapor deposition (CVD) is used.

Citations (7)

  • US6268695B1
  • KR20100009836A
  • US20100308335A1
  • KR20100130898A
  • US8309379B2
  • US20140021856A1
  • US20140091288A1
Record as JSON
{
  "publication_number": "US9324968B2",
  "country": "US",
  "kind": "B2",
  "title": "Method of manufacturing an organic light emitting display device",
  "abstract": "A manufacturing method of an organic light emitting diode (OLED) display is disclosed. The manufacturing method in accordance with an exemplary embodiment includes: preparing a flexible substrate and a display panel including a thin film encapsulation (TFE) layer for covering and protecting an OLED formed on the flexible substrate; attaching a first protection film to the TFE layer by using a first adhesive to be opposite to the TFE layer; heating a second protection film; and pressing and attaching a second protection film onto the flexible substrate by using a second adhesive.",
  "claims": [
    "1. A manufacturing method of an organic light emitting diode (OLED) display, the manufacturing method comprising: adhering a first protection film to a thin film encapsulation (TFE) layer of an organic light emitting device using a first adhesive, heating a second protection film; heating a third protection film after heating the first protection film; adhering the second protection film to a flexible substrate of the organic light emitting device using a second adhesive after the heating of the second protection film; and adhering the third protection film to the first protection film by using a third adhesive after heating the first protection film, the third protection film being disposed opposite the first protection film.",
    "2. The manufacturing method of claim 1, wherein heating the third protection film comprises: mounting the third protection film on a third protection film stage and then heating at least one of a roller and the third protection film stage to transfer heat to the third protection film.",
    "3. The manufacturing method of claim 2, wherein adhering the third protection film comprises pressing and attaching the third protection film to the flexible substrate by pressing one side of both the third protection film and the third protection film stage, and moving the third protection film stage in one direction.",
    "4. The manufacturing method of claim 2, wherein heating of the third protection film further comprises applying heat in a temperature range of about 50° C. to 130° C. to at least one of the roller and the third protection film stage.",
    "5. The manufacturing method of claim 1, wherein the first adhesive has a thickness in a range of 70 to 80 μm, and the second adhesive has a thickness in a range of 20 to 30 μm.",
    "6. The manufacturing method of claim 1, wherein the first adhesive and the second adhesive have different elongation rates.",
    "7. The manufacturing method of claim 1, wherein the first adhesive comprises a silicone material.",
    "8. The manufacturing method of claim 1, wherein the second adhesive comprises an acryl material.",
    "9. The manufacturing method of claim 1, wherein each of the first protection film and the second protection film has a thickness in a range of 70 to 80 μm.",
    "10. The manufacturing method of claim 1, wherein the first protection film, the second protection film, and the third protection film each comprise a flexible plastic material.",
    "11. The manufacturing method of claim 1, wherein the third protection film has a thickness in a range of 20 to 30 μm.",
    "12. The manufacturing method of claim 1, wherein the third adhesive has a thickness in a range of 5 to 15 μm."
  ],
  "description_excerpt": "1. Field\n\nExemplary embodiments of the present invention relate to a manufacturing method for an organic light emitting diode (OLED) display. More particularly, exemplary embodiments relate to an OLED display having a curling-improved structure.\n\n2. Discussion of the Background\n\nOrganic light emitting diode displays include organic light emitting elements that include a hole injection electrode, an organic emission layer, and an electron injection electrode. Each organic light emitting element emits light by energy generated when an exciton, generated by combining an electron and a hole in the organic emission layer, falls from an exited state to a ground state. Thus, the organic light emitting diode display displays a predetermined image by using this light emission.\n\nIn contrast to liquid crystal displays, organic light emitting diode displays have a self-luminance characteristic so a separate light source is not required. Thus, thickness and weight of the display may be reduced. Further, since organic light emitting diode displays exhibit desirable characteristics such as low power consumption, high luminance, and rapid response speed, organic light emitting diode displays are receiving attention as a next generation display device.\n\nThe organic light emitting diode (OLED) display has a panel structure in which a driving circuit unit and the organic light emitting element formed on a flexible substrate are protected by a thin film encapsulation (TFE) layer. In a process of forming the TFE layer, chemical vapor deposition (CVD) is used.",
  "cpc": [
    "H10K 59/8731",
    "H01L 2251/5338",
    "H01L 2251/556",
    "H01L 2251/558",
    "H01L 27/3223",
    "H01L 51/0097",
    "H01L 51/5237",
    "H01L 51/5246",
    "H01L 51/5253",
    "H01L 51/5256",
    "H01L 51/56",
    "H10K 2102/311",
    "H10K 2102/351",
    "H10K 2102/361",
    "H10K 50/84",
    "H10K 50/8426",
    "H10K 50/844",
    "H10K 50/8445",
    "H10K 59/12",
    "H10K 59/8722",
    "H10K 59/873",
    "H10K 59/88",
    "H10K 71/00",
    "H10K 71/40",
    "H10K 77/111"
  ],
  "ipc": [
    "H10K 71/40"
  ],
  "assignees": [
    "Samsung Display Co Ltd"
  ],
  "inventors": [
    "Keun Soo Lee",
    "Young Gu Kim",
    "Hyun Jun Cho",
    "Young Ji Kim",
    "Jeong Yong EOM"
  ],
  "filing_date": "2013-11-27",
  "publication_date": "2016-04-26",
  "grant_date": "2016-04-26",
  "priority_date": "2013-09-13",
  "application_number": "US-201314091821-A",
  "family_id": "52668292",
  "cited_by_count": 2,
  "citations": [
    "US6268695B1",
    "KR20100009836A",
    "US20100308335A1",
    "KR20100130898A",
    "US8309379B2",
    "US20140021856A1",
    "US20140091288A1"
  ]
}

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