Printing components to adhesive substrate posts

{
  "publication_number": "US2022368306A1",
  "country": "US",
  "kind": "A1",
  "title": "Printing components to adhesive substrate posts",
  "abstract": "A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.",
  "claims": [
    "1. A printed structure, comprising: a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface, the substrate post comprising a substrate post material that is an only partially cured adhesive; and a component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post and extending over at least one edge of the substrate post. 2. The printed structure of claim 1, wherein the adhesive is a soft-cured adhesive. 3. The printed structure of claim 1, wherein the adhesive comprises an organic material, a polymer, a resin, or an epoxy. 4. The printed structure of claim 1, wherein the adhesive is a photoresist. 5. The printed structure of claim 6, wherein the photoresist is a positive photoresist. 6. (canceled) 7. The printed structure of claim 1, comprising one or more connection posts extending from the component toward the patterned substrate. 8. The printed structure of claim 7, comprising substrate electrodes disposed on the patterned substrate adjacent to the substrate post and wherein each of the one or more connection posts is in electrical contact with one of the substrate electrodes. 9. The printed structure of claim 8, (i) wherein the adhesive between the component and the substrate is disposed only between the substrate electrodes and is not in contact with the substrate electrodes, (ii) wherein none of the adhesive is disposed on the substrate electrodes, (iii) wherein adhesive is disposed on only a portion of the substrate electrodes but not on the one or more connection posts, (iv) wherein adhesive is disposed on only a portion of the one or more connection posts but not on the substrate electrodes, or (v) any combination of (i), (ii), (iii), and (iv). 10. (canceled) 11. The printed structure of claim 8, wherein only a portion of the substrate post is disposed on only a portion of the substrate electrodes. 12. The printed structure of claim 8, wherein the connection posts extend into or penetrate the substrate electrodes to make an electrical contact between the component and the substrate electrodes. 13. The printed structure of claim 8, wherein an area of a cross section of the substrate post between the component and the substrate is less than an area of a cross section bounded by the component, the substrate, and the substrate electrodes. 14. The printed structure of claim 8, wherein the substrate electrodes are closer together than any portion of the one or more connection posts or wherein the one or more connection posts are closer together than any portion of the substrate electrodes. 15. The printed structure of claim 7, (i) wherein the adhesive between the component and the substrate is disposed only between the one or more connection posts and is not in contact with the one or more connection posts, (ii) wherein none of the adhesive is disposed on the one or more connection posts, or (iii) both (i) and (ii). 16. The printed structure of claim 7, wherein the one or more connection posts have a substantially flat distal end or wherein the one or more connection posts are each a substantially planar component contact pad. 17. The printed structure of claim 7, wherein a height of the one or more connection posts is greater than or equal to the height of the substrate post. 18. (canceled) 19. The printed structure of claim 7, wherein the area of a cross section of the substrate post between the component and the substrate is less than an area of a cross section bounded by the component, the substrate, and the one or more connection posts. 20. (canceled) 21. The printed structure of claim 1, wherein the component comprises a broken or separated component tether. 22. (canceled) 23. The printed structure of claim 1, wherein the substrate post holds the component in compression against the substrate. 24 - 38. (canceled) 39. A printed structure, comprising: a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface, the substrate post comprising a substrate post material that is an adhesive; a component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post and extending over at least one edge of the substrate post; and one or more component contact pads disposed on the bottom side. 40. The printed structure of claim 39, comprising substrate electrodes disposed on the patterned substrate adjacent to the substrate post and wherein each of the one or more component contact pads is in electrical contact with one of the substrate electrodes."
  ],
  "description_excerpt": "The present disclosure relates generally to printed or printable structures including components and methods for disposing components on substrate posts of patterned substrates.\n\nSubstrates with electronically active components distributed over the extent of the substrate may be used in a variety of electronic systems, for example, in flat-panel display devices such as flat-panel liquid crystal or organic light emitting diode (OLED) displays, in imaging sensors, and in flat-panel solar cells. The electronically active components are typically either assembled on the substrate, for example using individually packaged surface-mount integrated-circuit devices and pick-and-place tools, or by sputtering or spin coating a layer of semiconductor material on the substrate and then photolithographically processing the semiconductor material to form thin-film circuits on the substrate. Individually packaged integrated-circuit devices typically have smaller transistors with higher performance than thin-film circuits but the packages are larger than can be desired for highly integrated systems.\n\nOther methods for transferring active components from one substrate to another are described in U.S. Pat. No. 7,943,491. In an example of these approaches, small integrated circuits are formed on a native semiconductor source wafer. The small unpackaged integrated circuits, or chiplets, are released from the native source wafer by etching a layer formed beneath the circuits. A viscoelastic stamp is pressed against the native source wafer and the process side of the chiplets is adhered to individual stamp posts.",
  "cpc": [
    "H03H 9/0509",
    "B41F 16/00",
    "B41F 16/004",
    "H03H 2003/021",
    "H03H 3/02",
    "H03H 3/08",
    "H03H 9/0514",
    "H03H 9/0519",
    "H03H 9/0542",
    "H03H 9/0557",
    "H03H 9/0585",
    "H03H 9/059",
    "H03H 9/1014",
    "H03H 9/1021",
    "H03H 9/105",
    "H03H 9/172",
    "H03H 9/173"
  ],
  "ipc": [
    "B41F 16/00",
    "H03H 3/02",
    "H03H 9/05",
    "H03H 9/10"
  ],
  "assignees": [
    "X Display Company Technology Ltd"
  ],
  "inventors": [
    "Matthew Alexander Meitl",
    "Christopher Andrew Bower",
    "Salvatore Bonafede",
    "Carl Ray Prevatte, JR.",
    "Ronald S. Cok",
    "Brook Raymond"
  ],
  "filing_date": "2021-05-11",
  "publication_date": "2022-11-17",
  "priority_date": "2021-05-11",
  "application_number": "US-202117317408-A",
  "family_id": "83998104",
  "cited_by_count": 4,
  "citations": [
    "US20130196170A1",
    "US20200266220A1",
    "US20180270962A1"
  ]
}